• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.5
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• pp.376-381
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• 2019

In this work, we evaluated the structural, electrical and optical properties of $Ge_8Sb_2Te_{11}$ and Cu-doped $Ge_8Sb_2Te_{11}$ thin films prepared by rf-magnetron reactive sputtering. The 200-nm-thick deposited films were annealed in a range of $100{\sim}400^{\circ}C$ using a furnace in an $N_2$ atmosphere. The amorphous-to-crystalline phase changes of the thin films were investigated by X-ray diffraction (XRD), UV-Vis-IR spectrophotometry, a 4-point probe, and a source meter. A one-step phase transformation from amorphous to face-centered-cubic (fcc) and an increase of the crystallization temperature ($T_c$) was observed in the Cu-doped film, which indicates an enhanced thermal stability in the amorphous state. The difference in the optical energy band gap ($E_{op}$) between the amorphous and crystalline phases was relatively large, approximately 0.38~0.41 eV, which is beneficial for reducing the noise in the memory devices. The sheet resistance($R_s$) of the amorphous phase in the Cu-doped film was about 1.5 orders larger than that in undoped film. A large $R_s$ in the amorphous phase will reduce the programming current in the memory device. An increase of threshold voltage ($V_{th}$) was seen in the Cu-doped film, which implied a high thermal efficiency. This suggests that the Cu-doped $Ge_8Sb_2Te_{11}$ thin film is a good candidate for PRAM.

• Journal of Radiation Protection and Research
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• v.42 no.3
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• pp.141-145
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• 2017

Background: The concrete walls inside the vaults of cyclotron facilities are activated by neutrons emitted by the targets during radioisotope production. Reducing the amount of radioactive waste created in such facilities is very important in case they are decommissioned. Thus, we proposed a strategy of reducing the neutron activation of the concrete walls in cyclotrons during operation. Materials and Methods: A polyethylene plate and B-doped Al sheet (30 wt% of B and 2.5 mm in thickness) were placed in front of the wall in the cyclotron room of a radioisotope production facility for pharmaceutical use. The target was Xe gas, and a Cu block was utilized for proton dumping. The irradiation time, proton energy, and beam current were 8 hours, 30 MeV, and $125{\mu}A$, respectively. To determine a suitable thickness for the polyethylene plate set in front of the B-doped Al sheet, the neutron-reducing effects achieved by inserting such sheets at several depths within polyethylene plate stacks were evaluated. The neutron fluence was monitored using an activation detector and 20-g on de Au foil samples with and without 0.5-mm-thick Cd foil. Each Au foil sample was pasted onto the center of a polyethylene plate and B-doped Al sheet, and the absolute activity of one Au foil sample was measured as a standard using a Ge detector. The resulting relative activities were obtained by calculating the ratio of the photostimulated luminescence of each foil sample to that of the standard Au foil. Results and Discussion: When the combination of a 4-cm-thick polyethylene plate and B-doped Al sheet was employed, the thermal neutron rate was reduced by 78%. Conclusion: The combination of a 4-cm-thick polyethylene plate and B-doped Al sheet effectively reduced the neutron activation of the investigated concrete wall.

• Journal of the Korean Society for Heat Treatment
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• v.21 no.3
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• pp.144-149
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• 2008

It has been reported that copper and copper alloys have a large anisotropy of functional properties such as electrical, thermal and mechanical properties, which means that the texture of polycrystalline alloy should be considered to achieve better properties. In this study, the determination of grain growth orientation and texture formation in the cold-rolled, heat-treated and Ni-plated hybrid copper sheets was investigated. Grain growth direction and texture formation were analyzed by the X-ray pole figure. The influence of texture on the mechanical properties could be quantitatively confirmed by the results from the orientation distribution function and the tensile test. The heat-treated texture in the cold-rolled hybrid copper sheet is also investigated and discussed.

• Journal of Powder Materials
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• v.15 no.4
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• pp.292-296
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• 2008

The electromagnetic (EM) wave absorption properties of the $Fe_{73}Si_{16}B_7Nb_3Cu_1$ nanocrystalline powder mixed with 5 to 20 vol% of Ni-Zn ferrites has been investigated in a frequency range from 100MHz to 10GHz. Amorphous ribbons prepared by a planar flow casting process were pulverized and milled after annealing at 425 for 1 hour. The powder was mixed with a ferrite powder at various volume ratios to tape-cast into a 1.0mm thick sheet. Results showed that the EM wave absorption sheet with Ni-Zn ferrite powder reduced complex permittivity due to low dielectric constant of ferrite compared with nanocrystalline powder, while that with 5 vol% of ferrite showed relatively higher imaginary part of permeability. The sheet mixed with 5 vol% ferrite powder showed the best electromagnetic wave absorption properties at high frequency ranges, which resulted from the increased imaginary part of permeability due to reduced eddy current.

• Korean Journal of Optics and Photonics
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• v.32 no.3
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• pp.114-119
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• 2021

A large-area graphene sheet has been successfully grown on a copper-foil substrate by chemical vapor deposition (CVD) for industrial use. To screen out unsatisfactory graphene films as quickly as possible, noninvasive optical characterization in reflection geometry is necessary. Based on the optical conductivity of graphene, developed by the single-electron tight-binding method, we have investigated the optical-reflectance contrast. Depending on the four independent control parameters of layer number, chemical potential, hopping energy, and temperature, the optical-reflectance contrast can change dramatically enough to reveal the quality of the grown graphene sheet.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.79-80
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• 2006

From a viewpoint of heat stress at high temperatures and contact thermal resistance, it is confirmed that the optimal structure is the skeleton structure using Cu substrate on the cooling side, which has excellent heat conductivity and the optimal installation method is to adopt a carbon sheet and a mica sheet to the high temperature side, where Si grease is applied to the low temperature side, under pressurized condition. The power of the developed modules indicated 0.5W in an $FeSi_2$ module and 3.8 W with a SiGe module at 823K, respectively.

• Korean Journal of Materials Research
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• v.24 no.2
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• pp.105-110
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• 2014

The aim of this work was to investigate the effects of electrodeposition conditions on the microstructural characteristics of copper thin films. The microstructure of electroplated Cu films was found to be highly dependent on electrodeposition conditions such as system current and current density, as well as the bath solution itself. The current density significantly changed the preferred orientation of electroplated Cu films in a DC system, while the solution itself had very significant effects on microstructural characteristics in a pulse-reverse pulse current system. In the DC system, polarization at high current above 30 mA, changed the preferred orientation of Cu films from (220) to (111). However, Cu films showed (220) preferred orientation for all ranges of current density in the pulse-reverse pulse current system. The grain size decreased with increasing current density in the DC system while it remained relatively constant in the pulse-reverse pulse current system. The sheet resistance increased with increasing current density in the DC system due to the decreased grain size.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.725-728
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• 2001

We have fabricated thin films using the DC/RF magnetron sputtering of 74wt%Ni-l8wt%Cr-4wt%Al-4wt%Cu alloy target and studied the effect of the process parameters on the electrical properties for low TCR(Temperature Coefficient of Resistance) films. In sputtering process, pressure, power and substrate temperature, are varied as controllable parameter. The films are annealed to 400$^{\circ}C$ in air and nitrogen atmosphere. The sheet resistance, TCR of the films increases with increasing annealing temperature. It abruptly increased as annealing temperature increased over 300$^{\circ}C$ in air atmosphere. From XRD, it is found that these results are due to the existence of NiO on film surface formed by annealing. As a results of them, TCR can be controlled by variation of sputter process parameter and annealing of thin film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.806-809
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• 2000

A key technology for achieving commercial Nb$_3$Sn superconducting wires may be driven from fabrication Process of big-scale billets. Sub-element billet with diameter of 200 mm was designed and fabricated. This billet was hot-extruded and drawn. Cu stabilizer tube, Nb barrier tube and 19 sub-elements inserted Sn core were composed for strand. There was no breakage in the strand that was constituted with annealed sub-element. It was need that billet had to treat HIP because of remove of voids and goad contact between Cu and Nb filaments. Ta wound sheet was better than Ta tube thor barrier in the strand. Ic of the Nb$_3$Sn wire at 127, 4.2K was over than 120 A.

• Transactions of Materials Processing
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• v.9 no.6
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• pp.631-637
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• 2000

The tube hydroforming technology is new key production technologies, which contribute to a light-weight cu. Because the tubes are used for hydroforming instead of the sheet materials formability test for tube is required to measure the formability of materials for hydroforming. In this Paper, a kind of formability test for tube, which can well represent the characteristics of tube hydroforming processes, is developed. Developed formability test method can consider not oかy the influence of material Properties but also contact with die and material. Some investigation was carried out to verify the effectiveness of developed formability test.