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Evaluation of Texture and Mechanical Property on Annealing Condition of Ni-Plated Hybrid Cu Sheet  

Lee, Jung-Il (Dept. of Mat. Sci. and Eng./ReSEM, Chungju Nat'l Univ.)
Lee, Joo-Ho (Dept. of Mat. Sci. and Eng./ReSEM, Chungju Nat'l Univ.)
Cho, Kyung-Won (Dept. of Mat. Sci. and Eng./ReSEM, Chungju Nat'l Univ.)
Kim, Kun-Nam (URi Fine Plating Co., Ltd.)
Kim, Gang-Beom (URi Fine Plating Co., Ltd.)
Jang, Tae-Soon (URi Fine Plating Co., Ltd.)
Park, No-Jin (Sch. of Adv. Mat. and Sys. Eng., Kumoh Nat'l Inst. of Tech.)
Publication Information
Journal of the Korean Society for Heat Treatment / v.21, no.3, 2008 , pp. 144-149 More about this Journal
Abstract
It has been reported that copper and copper alloys have a large anisotropy of functional properties such as electrical, thermal and mechanical properties, which means that the texture of polycrystalline alloy should be considered to achieve better properties. In this study, the determination of grain growth orientation and texture formation in the cold-rolled, heat-treated and Ni-plated hybrid copper sheets was investigated. Grain growth direction and texture formation were analyzed by the X-ray pole figure. The influence of texture on the mechanical properties could be quantitatively confirmed by the results from the orientation distribution function and the tensile test. The heat-treated texture in the cold-rolled hybrid copper sheet is also investigated and discussed.
Keywords
Ni-plated hybrid copper sheet; Texture formation; Mechanical properties; Annealing;
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