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http://dx.doi.org/10.3740/MRSK.2014.24.2.105

Microstructural Characteristics of Electro-Plated Cu Films by DC and Pulse Systems  

Yoon, Jisook (Education Program for Samsung Advanced Integrated Circuit, Pusan National University)
Park, Chansu (Department of Materials Science and Engineering, Pusan National University)
Hong, Soonhyun (Department of Materials Science and Engineering, Pusan National University)
Lee, Hyunju (Department of Materials Science and Engineering, Pusan National University)
Lee, Seungjun (Education Program for Samsung Advanced Integrated Circuit, Pusan National University)
Kim, Yangdo (Department of Materials Science and Engineering, Pusan National University)
Publication Information
Korean Journal of Materials Research / v.24, no.2, 2014 , pp. 105-110 More about this Journal
Abstract
The aim of this work was to investigate the effects of electrodeposition conditions on the microstructural characteristics of copper thin films. The microstructure of electroplated Cu films was found to be highly dependent on electrodeposition conditions such as system current and current density, as well as the bath solution itself. The current density significantly changed the preferred orientation of electroplated Cu films in a DC system, while the solution itself had very significant effects on microstructural characteristics in a pulse-reverse pulse current system. In the DC system, polarization at high current above 30 mA, changed the preferred orientation of Cu films from (220) to (111). However, Cu films showed (220) preferred orientation for all ranges of current density in the pulse-reverse pulse current system. The grain size decreased with increasing current density in the DC system while it remained relatively constant in the pulse-reverse pulse current system. The sheet resistance increased with increasing current density in the DC system due to the decreased grain size.
Keywords
Cu films; electrodeposition; microstructural characteristics;
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