• Journal of Korea Foundry Society
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• v.30 no.4
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• pp.137-141
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• 2010

The effects of Zn amounts on the castability and tensile properties of Al-Zn-Mg-Cu alloys were investigated for development of high strength die casting aluminium alloys. Al-Zn-Mg-Cu alloys with 3.5% Zn showed high cast cracking tendency and poor mold filling behaviour. Al-Zn-Mg-Cu alloys with 5wt% Zn and 7wt% Zn had the tensile strengths of 300~400MPa and the elongations of 2~18%. The effect of Zn on the tensile strength of Al-Zn-Mg-Cu alloys was insignificant, but Al-Zn-Mg-Cu alloy with high Zn amount had lower elongation.

• Journal of Welding and Joining
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• v.23 no.6
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• pp.93-98
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• 2005

The purpose of this study is to investigate the characteristics of pb-free $Zn-(3\~6)\%Al-(1\~6)\%Cu$ solder alloys for ultra high temperature(>573K) which applied to air craft, space satellite, automotive, oil, gas well exploration and data logging of geo-thermal wells. Melting range, solderability, electric resistivity, microstructure and mechanical properties were examined with solder alloys casted in Ar gas atmosphere. $Zn-4\%Al-(1\~3)\%Cu,\;Zn-5\%Al-(2\~4)\%Cu\;and\;Zn-6\%Al-(3\~5)\%Cu$ alloys satisfied the optimum melting range of 643 to 673k for ultra high temperature solder. A melting temperature increased with increasing Cu content, but decreased with increasing Al content. The spreadability was improved with increasing hi content. But the content of Cu had no effect on the spreadability. The electric resistivity was lowered with increasing Al and decreasing Cu content. In all Zn-Al-Cu solder alloys, primary dendritic $\varepsilon$ phase(Zn-Cu), dendritic $\eta$ phase(Zn-Cu-Al), $\alpha(Al-Zn)-\eta$ eutectic and eutectoid phase were observed. The addition of Al increased the volume fraction of eutectic and eutectoid phase and it decreased f phases. Also, the addition of Cu increased slightly the volume fraction of e, the eutectic and eutectoid phases. With increasing total content of Al and Cu, a hardness and a tensile strength were linearly increased, but anelongation was linearly decreased.

• Journal of the Korean Ceramic Society
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• v.32 no.1
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• pp.106-112
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• 1995

In order to examine the effect of CuO and Al2O3 addition on the electrical conductivity of ZnO, both Al2O3 (0, 1, 2, 5, 10at.%) and CuO (1, 5at.%) were added to ZnO. Al2O3 addition (~2at.% Al) increased the total electrical conductivity of ZnO which was already decreased by CuO doping effect Above solid solubility of Al (~2at.%), ZnAl2O4 formed and the total electrical conductivity decreased due to the decrease of sintered density. Impedance measurements were used to know the reason and degree of contribution of three resistive elements, ZnO grain, ZnO/CuO, and ZnO/ZnO grain boundaries, to the total electrical conductivity changed.

• Journal of the Korean Society for Heat Treatment
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• v.20 no.5
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• pp.243-249
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• 2007

The age hardening behavior and mechanical properties of an extruded Al-Zn-Mg-(Cu)-0.1 wt.%Sc alloy were investigated with the Sc addition and ageing temperature. The results showed that the $Al_3Sc$ compounds were formed by Sc addition and distributed preferentially along the extrusion direction. The age hardening of Al-Zn-Mg-Cu-0.1 wt.%Sc alloy which was treated by T6 process was more significant than that of Al-Zn-Mg-0.1 wt.%Sc alloy. The tensile property of Al-Zn-Mg-Cu+0.1 wt.%Sc alloy was also higher than that of Al-Zn-Mg-0.1 wt.%Sc alloy, which is 691 MPa and 584 MPa in strength and 9% and 11% in elongation, respectively.

• Korean Journal of Chemical Engineering
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• v.36 no.2
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• pp.191-196
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• 2019

The phase of Cu,Zn,Al precursors strongly affects the activity of their final catalysts. Herein, the Cu,Zn,Al precursor was prepared by precipitation of $Al^{3+}$ onto primitive, amorphous Cu,Zn precipitate. This precursor turned out to be a phase mixture of zincian malachite and hydrotalcite in which the latter phase was less abundant compared to the co-precipitated precursor. The final catalyst derived from this precursor exhibited a little higher copper surface area and methanol synthesis activity than the co-precipitated counterpart. Therefore, the two precursor phases need to be mixed in an adequate proportion for the preparation of active $Cu/ZnO/Al_2O_3$ catalyst.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.12 no.4
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• pp.172-177
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• 2002

The CuZnAl alloys have some advantages against other shape memory alloys, such as the widely variable transformation temperature, the low cost and easy fabrication. The alloys have been produced mostly by metallurgical methods. Thereby a tendency to large grain sizes is observed, which causes brittle properties of the materials. In order to avoid these deficiencies a special powder metallurgical process, SPS(spark plasma sintering), is applied in the present investigation. The starting materials were the pure (99.9 %) Cu, Zn and Al element powders with different particle size. The relatively fine grained and homogeneous Cu-24.78Zn-9.11Al (at.%) and Cu-13.22Zn-17.24Al (at.%) shape memory alloys were obtained using the powders with size of 75-150 $\mu$m. The average grain size is about 70 $\mu$m and the phases at room temperature are the austenitic and martensitic phase respectively.

• Journal of the Korean Society for Heat Treatment
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• v.19 no.5
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• pp.257-261
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• 2006

Scandium(Sc) in Al-Zn-Mg-Cu based Al alloy on precipitation phenomenon was compared to a 7001(Al-7.2%Zn-3.2%Mg-1.8%Cu) Al alloy. GP zone and ${\eta}^{\prime}$ phases were the main strengthening phases at low aging temperature under $100^{\circ}C$, but ${\eta}^{\prime}$ and $Al_3Sc$ phases were the main strengthening phases at high aging temperature above $1600^{\circ}C$ in Sc added 7000(Al-7.7%Zn-2.0%Mg-1.9%Cu-0.1%Zr) Al alloy. With the addition of 0.1%Sc in 7000 Al alloy, the activation energy for the GP zone, ${\eta}^{\prime}$ and ${\eta}$ phase decreased compared to the 7001 Al alloy. This result indicates that the Sc accelerated the precipitation for the GP zone, ${\eta}^{\prime}$ and ${\eta}$ phases in 7000 Al alloy. Al-7.7%Zn-2.0%Mg-1.9%Cu-0.1%Zr-0.1 Sc alloy has higher strength than 7001 Al alloy, which has high strength.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.118-118
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• 2011

The Nano-Floating Gate Memory(NFGM) devices with ZnO:Cu thin film embedded in Al2O3 and AlOx-SAOL were fabricated and the electrical characteristics were evaluated. To further improve the scaling and to increase the program/erase speed, the high-k dielectric with a large barrier height such as Al2O3 can also act alternatively as a blocking layer for high-speed flash memory device application. The Al2O3 layer and AlOx-SAOL were deposited by MLD system and ZnO:Cu films were deposited by ALD system. The tunneling layer which is consisted of AlOx-SAOL were sequentially deposited at $100^{\circ}C$. The floating gate is consisted of ZnO films, which are doped with copper. The floating gate of ZnO:Cu films was used for charge trap. The same as tunneling layer, floating gate were sequentially deposited at $100^{\circ}C$. By using ALD process, we could control the proportion of Cu doping in charge trap layer and observe the memory characteristic of Cu doping ratio. Also, we could control and observe the memory property which is followed by tunneling layer thickness. The thickness of ZnO:Cu films was measured by Transmission Electron Microscopy. XPS analysis was performed to determine the composition of the ZnO:Cu film deposited by ALD process. A significant threshold voltage shift of fabricated floating gate memory devices was obtained due to the charging effects of ZnO:Cu films and the memory windows was about 13V. The feasibility of ZnO:Cu films deposited between Al2O3 and AlOx-SAOL for NFGM device application was also showed. We applied our ZnO:Cu memory to thin film transistor and evaluate the electrical property. The structure of our memory thin film transistor is consisted of all organic-inorganic hybrid structure. Then, we expect that our film could be applied to high-performance flexible device.----못찾겠음......

• Journal of Korea Foundry Society
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• v.29 no.6
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• pp.265-269
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• 2009

The optimum RRA heat treating conditions and SCC (stress corrosion cracking) resistance of semi-solid Al-Zn-Mg-Cu alloy fabricated by inclined cooling plate were compared with those of conventional mould cast alloys. The non-stirring method characterized by using a cooling plate can effectively eliminate dendritic structure and form a fine globular semisolid microstructure in as-cast Al-Zn-Mg-Cu alloy and the SCC resistance of semi-solid Al-Zn-Mg-Cu alloy was higher than that of conventional mold cast alloy. Also, after retrogressed treatment at RRA heat treatment of semi-solid Al-Zn-Mg-Cu alloy, retrogressed treatment time has increased more than 10 minutes at $180^{\circ}C$ to recovery the T6 heat treatment strength.

• Bulletin of the Korean Chemical Society
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• v.31 no.5
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• pp.1241-1246
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• 2010

Ternary Cu/ZnO/$Al_2O_3$ catalysts were prepared by a co-precipitation method. The precursor structures were monitored during the aging. The first precipitate structure was amorphous georgeite, which transformed into the unknown crystalline structure. The transition crystalline structure was assigned to the crystalline georgeite, which was suggested with elemental analysis, IR and XRD. The final structure of precursors was malachite. The Cu surface area of the resulting Cu/ZnO/$Al_2O_3$ was maximized to be 30.6 $m^2$/g at the aging time of 36 h. The further aging rapidly decreased Cu surface areas of Cu/ZnO/$Al_2O_3$. ZnO characteristic peaks in oxide samples almost disappeared after 24 h aging, indicating that ZnO was dispersed in around bulk CuO. TOF of the prepared catalysts of the Cu surface area ranges from 13.0 to 30.6 $m^2/g_{cat}$ was to be 2.67 ${\pm}$ 0.27 mmol/$m^2$.h in methanol synthesis at the condition of $250^{\circ}C$, 50 atm and 12,000 mL/$g_{cat}$. h irrespective of the XRD and TPR patterns of CuO and ZnO structure in CuO/ZnO/$Al_2O_3$. The pH of the precipitate solution during the aging time can be maintained at 7 by $CO_2$ bubbling into the precipitate solution. Then, the decrease of Cu surface area by a long aging time can be prevented and minimize the aging time to get the highest Cu surface area.