• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 춘계학술발표대회 개요집
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• pp.224-227
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• 2003

The longitudinal thermosonic bonding method is investigated in this work for its application to the soldering process for electronic packaging. The effect of the ultrasonic is analyzed through lumped modeling, and the material properties of a viscoelastic model are measured experimentally. The thermosonic bonding method is verified by inserting the Cu pin and Au bump into solder block. As the solder thickness decreases, temperature of the solder is calculated to increase rapidly because of larger strain. Localized heating due to ultrasonic vibration is observed to melt the solder near the pin, which is adequate to the high density electronic package and Pb-free solder having high melting temperature.

• 한국산업융합학회 논문집
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• 제12권4호
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• 대한금속재료학회지
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• 제50권10호
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• pp.785-792
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• 2012

A new flip chip structure consisting of interlocking joints locally surrounded by non-conductive adhesive was investigated in order to improve the contact resistance characteristics and prevent the parasitic capacitance increase. The average contact resistance of the interlocking joints was substantially reduced from $135m{\Omega}$ to $79m{\Omega}$ by increasing the flip chip bonding pressure from 85 MPa to 185 MPa. Improvement of the contact resistance characteristics at higher bonding pressure was attributed not only to the increased contact area between Cu chip bumps and Sn pads, but also to the severe plastic deformation of Sn pads caused during formation of the interlocking-joint structure. The parasitic capacitance increase due to the non-conductive adhesive locally surrounding the flip chip joints was estimated to be as small as 12.5%.

• 마이크로전자및패키징학회지
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• 제19권4호
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• pp.57-64
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• 2012

표면처리에 따른 Sn-1.2Ag-0.7Cu-0.4In 솔더범프의 접합 강도 평가를 위하여 전단 속도 및 열처리 시간에 따른 볼 전단강도 시험을 실시하였다. 전반적으로, 전단속도가 증가함에 따라 전단강도는 증가하였지만 인성은 감소하는 경향을 나타내었다. 파괴모드 관찰 결과, 전단 속도가 증가함에 따라 파괴모드의 경우, ENIG(electroless nickel immersion gold) 처리는 취성파괴가 대부분 지배적으로 존재하였고, OSP(organic solderability preservative) 처리는 pad open이 주로 발생하였다. 또한, 500 mm/s의 고속전단시험에서는 열처리 시간이 증가함에 따라 표면처리별 전단강도와 인성 값 모두 감소하는 경향을 보였다. ENIG 표면처리가 OSP 표면처리 보다 좋은 접합강도 특성을 보이는 것은 솔더범프 계면의 금속간화합물의 물성 및 두께와 밀접한 연관이 있는 것으로 판단된다.

• Korean Chemical Engineering Research
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• 제45권5호
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• pp.466-472
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• 2007

웨이퍼 레벨(WL) 3차원(3D) 집적을 구현하기 위해 저유전체 고분자를 본딩 접착제로 이용한 웨이퍼 본딩과, 적층된 웨이퍼간 전기배선 형성을 위해 구리 다마신(damascene) 공정을 사용하는 방법을 소개한다. 이러한 방법을 이용하여 웨이퍼 레벨 3차원 칩의 특성 평가를 위해 적층된 웨이퍼간 3차원 비아(via) 고리 구조를 제작하고, 그 구조의 기계적, 전기적 특성을 연속적으로 연결된 서로 다른 크기의 비아를 통해 평가하였다. 또한, 웨이퍼간 적층을 위해 필수적인 저유전체 고분자 수지를 이용한 웨이퍼 본딩 공정의 다음과 같은 특성 평가를 수행하였다. (1) 광학 검사에 의한 본딩된 영역의 정도 평가, (2) 면도날(razor blade) 시험에 의한 본딩된 웨이퍼들의 정성적인 본딩 결합력 평가, (3) 4-점 굽힘시험(four point bending test)에 의한 본딩된 웨이퍼들의 정량적인 본딩 결합력 평가. 본 연구를 위해 4가지의 서로 다른 저유전체 고분자인 benzocyclobutene(BCB), Flare, methylsilsesquioxane(MSSQ) 그리고 parylene-N을 선정하여 웨이퍼 본딩용 수지에 대한 적합성을 검토하였고, 상기 평가 과정을 거쳐 BCB와 Flare를 1차적인 본딩용 수지로 선정하였다. 한편 BCB와 Flare를 비교해 본 결과, Flare를 이용하여 본딩된 웨이퍼들이 BCB를 이용하여 본딩된 웨이퍼보다 더 높은 본딩 결합력을 보여주지만, BCB를 이용해 본딩된 웨이퍼들은 여전히 칩 back-end-of-the-line (BEOL) 공정조건에 부합되는 본딩 결합력을 가지는 동시에 동공이 거의 없는 100%에 가까운 본딩 영역을 재현성있게 보여주기 때문에 본 연구에서는 BCB가 본딩용 수지로 더 적합하다고 판단하였다.

• Journal of Welding and Joining
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• 제26권3호
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• pp.30-36
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• 2008

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

• 대한의생명과학회지
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• 제14권2호
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• pp.105-113
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• 2008

The objective of this study was to evaluate the influence of surface modifications on the bonding characteristics and cytotoxicity of specific titanium porcelain bonded to milling titanium and cast titanium. Milling titanium and cast titanium samples were divided into 8 test groups. These groups are as follow: i) sandblasted with particles of different size of $220{\mu}m\;and\;50{\mu}m$, ii) different sequences of sandblasting treatment and etching treatment, iii) etched with different etching solutions, and iv) preheated or not. The surface characteristics of specimens were characterized by the test of mean roughness of surface and SEM. The bond strength of titanium-ceramic systems was measured by using three-point bending test and SEM. The results show that the mean roughness of surface of sample sandblasted with $220{\mu}m$ aluminum oxide increased and bond strength were higher than sample sandblasted with $50{\mu}m$ aluminum oxide. The mean roughness of surface decreased, but the bond strength increased when the samples sandblasted with $220{\mu}m$ aluminum oxide were preheated. The sample sandblasted with $220{\mu}m$ aluminum oxide after oxidized with occupational corrosive agent I (50% NaOH, 10% $CuSO_4{\cdot}5H_2O$) and II (35% $HNO_3$, 5% HF) showed higher bond strength than sample oxidized with 30% $HNO_3$ after sandblasted with $220{\mu}m$ aluminum oxide. Group NaCuNF220SP (milling Ti: 35.3985 MPa, casting Ti: 37.2306 MPa) which was treated with occupational corrosive agent I (50% NaOH, 10% $CuSO_4{\cdot}5H_2O$) and II (35% $HNO_3$, 5% HF), followed by sandblasting with $220{\mu}m$ aluminum oxide and preheating at $750^{\circ}C$ for 1 hour showed the highest bond strength and significant differences (P<0.05). The method for modifying surface of titanium showed excellent stability of cells.

• 한국염색가공학회지
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• 제17권2호
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• pp.10-18
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• 2005

Silk fabrics mordanted with $Fe^{2+},\;Ni^{2+},\;and\;Cu^{2+}$ were dyed with the aqueous extract of Cassia tora L. seed which was known to include water soluble colorant kaempferol, one of flavonol compounds. Kaempferol can react with free radicals and chelate transition metal ions, which is thought to catalyze processes leading to the appearance of free radicals and have antioxidant activity. In relation to the coordinating and chelating mechanism of the ions with the silk protein and kaempferol, reasonable conclusions should be made on the colorant uptake and the water fastness of the fabric. The amount of the colorant on the fabric was in the order of $Fe^{2+}>Ni^{2+}>Cu^{2+}$. In case of dyeing through coordinaiton bonds between transition metal ions and silk protein and colorants, it was thought that the ions with the smaller secondary hydration shell, the higher preference to the atoms of the ligand coordinated, and the suitable bonding stability for the substitution of primarily hydrated water molecules for colorants led to the higher colorant uptake. The water fastnsess of the fabric was in the order of $Fe^{2+}>Cu^{2+}>Ni^{2+}$. It should be reasonable to choose transition metal ions with weak and strong tendency to the ionic and the coordination bond, respectively, to the carboxylate anion of the silk protein. Although further research needs to be done, the conclusions above may be generally applied to the natural dyeing through the coordination bond mechanism between transition metal ions and colorants and substrates.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 1999년도 제1회 학술대회논문집(KIASC 1st conference 99)
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• pp.3-9
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• 1999

The grain morphology, the changes in morphology and Jc with the thermo-mechanical treatment (TMT) history, the field dependence of Jc and the nature of intergranular bonding were studied in $T_{10.8}$$Pb_{.2}$$Bi_{0.2}$$Sr_{1.8}$$Ba_{0.2}$$Ca_{2.2}$$Cu_{3}$$O_{z}$/Ag tapes. As a result, incorporation of intermediate rolling during the final heat-treatment resulted in of plate-like TI-1223 grains, and thus enhanced Jc. Jc's near 2.5$\times$104 A/cm2 at 77 K and 0 T were obtained in just rolled tapes with an excellent reproducibility. The high Jc's seem to grain-connectivity easy recovery of excellent grain-connectivity during final heat-treatment after inter -mediate rolling, probably due to retarded T1 evaporation and excessive Ca content in the present composition. The strong field dependence of Jc even in low fields, however, indicated that there still existed significant weak-links and the degree of directional grain-alignment was far from the desired one. The intergranular binding in the tapes seemed to be mainly dominated by SIS junctions.

• Korean Chemical Engineering Research
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• 제53권1호
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• pp.53-56
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• 2015

초임계 암모니아 분위기와 CuI 촉매 하에서 p-Diiodobenzene(PDIB)를 아민화 반응시켜 p-Phenylenediamine(PPD)를 합성하는 방법을 연구하였다. 본 연구에서는 여러 가지 공정변수들이 PPD 생성 수율에 미치는 영향을 알아보기 위하여 반응 온도, 암모니아 초기 주입 양에 따른 반응 압력, 촉매의 유무 및 촉매 주입량, 반응 시간 등을 변화시키면서 이에 따른 PPD 수율 변화를 GC 분석을 통하여 조사하였다. 그 결과, 무촉매 반응 시에는 PPD가 전혀 생성되지 않음을 알 수 있었으며, 반응온도, 반응 압력, 촉매 주입량 및 반응시간이 증가함에 따라 PPD 생성 수율이 증가하는 것을 확인할 수 있었다 단, 반응온도의 경우 $250^{\circ}C$ 이상에서는 열분해에 의해 PPD가 감소하여 $200^{\circ}C$가 최적의 온도임을 알 수 있었다. 또한, FT-IR과 $^1H$-NMR 분석을 통하여 아민기의 결합 특성과 PPD의 구조를 확인하였다.