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박태원;심인옥;김영우;강정윤
- Proceedings of the KWS Conference
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- 1994.05a
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- pp.44-47
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- 1994
The ageing behavior of Cu-bearing HSLA steels was studied by using Differential scanning calorimetry(DSC), Transmission electron microscopy and hardness tester. Two heat evolution peaks were observed during DSC scans over the temperature range of 25～590$^{\circ}C$ at a heating rate of 5$^{\circ}C$/min. The peaks appeared in low (241∼319$^{\circ}C$ : HSLA-A, 224∼310$^{\circ}C$ : HSLA-B) and high temperature (514∼590$^{\circ}C$ : HSLA-A, 451∼558$^{\circ}C$ : HSLA-B) are attributed to the formation of coherent Cu-clusters and noncoherent $\varepsilon$-Cu phase, respectively. It was confirmed that as ageing proceeds, the coherent bcc Cu-clusters transform to noncoherent fcc $\varepsilon$-Cu phase. In the case of the ageing to peak hardness at 300$^{\circ}C$ and 400$^{\circ}C$, the coherent Cu-clusters contributed to the hardening. As ageing time and temperature increase over peak hardness, noncoherent $\varepsilon$-Cu are formed and hardness decreases.
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Kim, Jong-Yeon;Yu, Jin
- Journal of the Microelectronics and Packaging Society
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- v.15 no.1
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- pp.33-37
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- 2008
A noticeable amount of Kirkendall voids formed at the Sn-3.5Ag solder joint with electroplated Cu, and that became even more significant when an additive was added to Cu electroplating bath. With SPS, a large amount of voids formed at the $Cu/Cu_3Sn$ interface of the solder joint during thermal aging at $150^{\circ}C$. The in-situ AES analysis of fractured joints revealed S segregation on the void surface. Only Cu, Sn, and S peaks were detected at the fractured $Cu/Cu_3Sn$ interfaces, and the S peak decreased rapidly with AES depth profiling. The segregation of S at the $Cu/Cu_3Sn$ interface lowered interface energy and thereby reduced the free energy barrier for the Kirkendall void nucleation. The drop impact test revealed that the electrodeposited Cu film with SPS degraded drastically with aging time. Fracture occurred at the $Cu/Cu_3Sn$ interface where a lot of voids existed. Therefore, voids occupied at the $Cu/Cu_3Sn$ interface are shown to seriously degrade drop reliability of solder joints.
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