• 한국주조공학회지
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• 제15권4호
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• pp.351-359
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• 1995

The effects of In and Be additions on the aging behaviors and mechanical properties in the Al-Cu-Li alloy were investigated using the transmission electron microscope, the scanning electron microscope, hardness and tensile strength measurement. The aging is promoted and the double hardness peak is appeared by the addition of In and Be in the Al-Cu-Li alloy. The strength is increased, but the elongation and toughness are decreased by the addition of In in the Al-Cu-Li alloy. And the Al-Cu-Li-In-Be alloy has good combination with the strength, the elogation and toughness than Al-Cu-Li-In alloy.

• 한국표면공학회지
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• 제39권6호
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• pp.255-262
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• 2006

Pd-Cu alloy membrane for hydrogen separation was fabricated by sputtering and Cu reflow process. At first, the Pd and Cu was continuously deposited by sputtering method on oxidized Si support, the Cu reflow process was followed. Microstructure of the surface and permeability of the membrane was investigated depending on various reflow temperature, time, Pd/cu composition and supports. With respect to our result, Pd-Cu thin film (90 wt.% Pd/10 wt.% Cu) deposited by sputtering process with thickness of $2{\mu}m$ was heat-treated for Cu reflow The voids of the membrane surface were completely filled and the dense crystal surface was formed by Cu reflow behavior at $700^{\circ}C$ for 1 hour. Cu reflow process, which is adopted for our work, could be applied to fabrication of dense Pd-alloy membrane for hydrogen separation regardless of supports. Ceramic or metal support could be easily used for the membrane fabricated by reflow process. The Cu reflow process must result in void-free surface and dense crystalline of Pd-alloy membrane, which is responsible for improved selectivity oi the membrane.

• Corrosion Science and Technology
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• 제17권4호
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• pp.176-182
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• 2018

Corrosion of the Cu alloy with 10wt% Ni in stagnant seawater with residual free chlorine was investigated. Despite that fact that Cu alloys are widely used for seawater applications due to their stubborn resistance to chloride attack, not much is known as to how the residual free chlorine in seawater affects corrosion of Cu and its alloys. In this work, immersion tests were conducted in the presence of different levels of chlorine for 90-10 Cu-Ni samples, one of the most frequently used Cu alloys for seawater application, mostly in shipbuilding. The results revealed no evidence for accelerated corrosion of the Cu-Ni alloy even in the presence of 5 ppm residual chlorine in seawater, signifying that the Cu-Ni alloy can be more tolerant to residual chlorine that has been commonly cited by the shipbuilding industry. However, comparison of polarization behavior of the alloy samples in the presence of different electrolytes with different concentrations of residual chlorine suggests that higher concentration of chlorine could increase the corrosion rate of the Cu-Ni alloy. Furthermore, it is suggested that microorganisms in the seawater could increase the corrosion rate of the Cu-Ni alloy by encouraging exfoliation of the corrosion product off the metal surface.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.53-53
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• 2011

As the dimension of Cu interconnects has continued to reduce, its resistivity is expected to increase at the nanoscale due to increased surface and grain boundary scattering of electrons. To suppress increase of the resistivity in nanoscale interconnects, alloying Cu with other metal elements such as Al, Mn, and Ag is being considered to increase the mean free path of the drifting electrons. The formation of Al alloy with a slight amount of Cu broadly studied in the past. The study of Cu alloy including a very small Al fraction, by contrast, recently began. The formation of Cu-Al alloy is limited in wet chemical bath and was mainly conducted for fundamental studies by sputtering or evaporation system. However, these deposition methods have a limitation in production environment due to poor step coverage in nanoscale Cu metallization. In this work, gap-filling of Cu-Al alloy was conducted by cyclic MOCVD (metal organic chemical vapor deposition), followed by thermal annealing for alloying, which prevented an unwanted chemical reaction between Cu and Al precursors. To achieve filling the Cu-Al alloy into sub-100nm trench without overhang and void formation, furthermore, hydrogen plasma pretreatment of the trench pattern with Ru barrier layer was conducted in order to suppress of Cu nucleation and growth near the entrance area of the nano-scale trench by minimizing adsorption of metal precursors. As a result, superconformal gap-fill of Cu-Al alloy could be achieved successfully in the high aspect ration nanoscale trenches. Examined morphology, microstructure, chemical composition, and electrical properties of superfilled Cu-Al alloy will be discussed in detail.

• 열처리공학회지
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• 제35권3호
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• pp.150-158
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• 2022

The effects of scandium addition on the Al-6Si-2Cu Alloy were investigated. The Al-6Si-2Cu-Sc alloy was prepared by gravity die casting process. In this study, scandium was added at 0.2 wt%, 0.4 wt%, 0.8 wt%, and 1.0 wt%. The microstructure of Al-6Si-2Cu-Sc alloy was investigated using Optical Microscope, Field Emission Scanning Electron Microscope, Electron Back Scatter Diffraction, and Transmission Electron microscope. The microstructure of Al-6Si-2Cu alloy with scandium added changed from dendrite structure to equiaxed crystal structure in specimens of 0.4 wt% Sc or more, and coarse needle-shape eutectic Si and β-Al₅FeSi phases were segmented and refined. The nanosized Al₃Sc intermetallic compound was observed to be uniformly distributed in the modified Al matrix.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• 한국재료학회지
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• 제13권2호
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• pp.133-136
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• 2003

Sn-2.5Cu alloy layers were deposited on the Alloy 42 lead-frame substrates by the electroplating method, and their microstructures, adhesion strength, and electrical resistivity were measured to evaluate the applicability of Sn-Cu alloy as a surface finishing material of electronic parts. The Sn-2.5Cu layers were electroplated in the granular form, and composed of pure Sn and Cu$_{6}$Sn$_{5}$ intermetallic compound. Surfaces of the electroplated Sn-2.5Cu layers were rather rough and also the thickness variance was large. The adhesion strength of the Sn-2.5Cu electroplated layers was highly comparable to that of the electroplated Cu alloy layer and the electrical conductivity was about 10 times higher than the pure Sn. After the 20$0^{\circ}C$ 30 min. annealing of the electroplated Sn-2.5Cu layers, the surface roughness was reduced, and adhesion strength and conductivity were improved. These results showed the Sn-Cu alloys can be used as an excellent surface finishing material.ial.

• 대한치과기공학회지
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• 제25권1호
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• pp.63-70
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• 2003

The microstructure and hardness of a porcelain fused Au-Pt-Cu-In alloy was investigated using optical microscopy, secondary electron microscopy, electron probe microanalyzer, transmission electron microscope, and vickers hardness. The hardness of the heat-treated Au-Pt-Cu-In quartenary alloy reached a maximum value in 30 min at 550$^{\circ}C$ in the range of 150 to 950$^{\circ}C$. In the aged Au-Pt-Cu-0.5In alloy at 550$^{\circ}C$, the hardness of the alloy rapidly increased until 30min with increasing aging time and after that it was remained nearly constant value. Based on above results, glazing and final aging of the porcelain fused Au-Pt-Cu-0.5In alloy were performed at 920 and 550$^{\circ}C$, respectively. The hardness of Au-Pt-Cu-0.5In alloy glazed at 920$^{\circ}C$ was 90 Hv and that of the alloy aged for 30 min at 550$^{\circ}C$ increased to 160 Hv. This indicates that a ceramic-metal crown with high strength can be manufactured using the glazing at 920$^{\circ}C$ and followed final aging at 550$^{\circ}C$ for 30 min.

• 한국분말재료학회지
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• 제13권3호
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• pp.187-191
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• 2006

Al-Cu alloy nano powders were produced by the electrical explosion of Cu-plated Al wires. The composition and phase of the alloy could be controlled by varying the thickness of Cu deposit on Al wire. When the Cu layer was thin, Al solid solution and $CuAl_2$ were the major phases. As the Cu layer becomes thicker, Al diminished while $Al_4Cu_9$ phase prevailed instead. The average particle size of Al-Cu nano powders became slightly smaller from 63 nm to 44 nm as Cu layer becomes thicker. The oxygen content of Al-Cu powder decreased linearly with Cu content. It is well demonstrated that the electrodeposition combined with wire explosion could be simple and economical means to prepare variety of alloy and intermetallic nano powders.

• 한국주조공학회지
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• 제42권5호
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• pp.273-281
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• 2022

Al-Cu-Si 3원계 공정합금의 응고거동과 미세조직 변화를 이해하기 위해서, 금형 예열온도를 달리하여 Al-Cu-Si 3원계 공정합금의 미세조직 변화를 관찰하였다. 금형 예열온도가 500℃일 때, 초정 Si과 덴드라이트 형상의 Al2Cu상이 관찰되며, 이후 (α-Al+Al2Cu)의 2원계 공정상이 관찰된다. 금형 예열온도가 300℃일 때 미제조직은 금형 예열온도가 500℃일 때와 유사하나 (α-Al+Al2Cu+Si)의 3원계 공정상이 관찰되는 영역과 관찰되지 않는 영역이 나타난다. 금형 예열온도가 150℃인 경우에는 미세조직이 (α-Al+Al2Cu)의 2원계 공정상과 (α-Al+Al2Cu+Si)의 3원계 공정상이 관찰되는 Bimodal 구조를 나타낸다. 금형 예열온도를 달리 하였을 때 가장 큰 변화를 나타내는 상은 Si상이며, 임계냉각속도를 지나면 (α-Al+Al2Cu+Si)의 3원계 공정상이 형성되는 순간에 빠른 냉각에 의한 Si의 성장이 억제되면 Cooperative 성장을 하기 때문에 Al, Cu의 성장도 함께 억제된다. 서로 다른 합금설계 전산모사 프로그램을 통해 Al-27wt%Cu-5wt%Si의 3원계 공정 합금을 분석한 결과, 합금설계 전산모사 프로그램에 따라 결과의 차이가 발생하며, 전산모사의 신뢰성을 높이기 위해서는 실제 주조를 통한 미세조직 분석이 수반되어야 한다.