• 대한치과기공학회지
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• 제7권1호
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• pp.13-18
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• 1985

Casting alloys, both precious and non-precious, were by heat in order to observe the change in HB and the results were : 1. The hard treatment showed 1.4 - 1.5 times as high as the soft treatment in HB. 2. The experiment shows that Au-Pt should be contained more than 75% to prevent color change. 3. Cu by hard teatment played the greatect part in creasing the solidity of Ag-Cu alloy. 4. Casting Co-Cr alloys showed little difference of HB in heat treatment.

• 대한금속재료학회지
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• 제48권11호
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• pp.1041-1046
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• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

• 한국자동차공학회논문집
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• 제21권3호
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• pp.134-141
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• 2013

Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). $Cu_6Sn_5$ IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and $(Cu,Ni)_6Sn_5$ IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.

• Journal of Welding and Joining
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• 제34권1호
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• pp.26-34
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• 2016

Automotive today has been transforming to an electronic product by adopting a lot of convenience and safety features, suggesting that joining materials and their mechanical reliabilities are getting more important. In this study, a Sn-Cu-Cr-Ca solder composition having a high melting temperature ($>230^{\circ}C$) was fabricated and its joint properties and reliability was investigated with an aim to evaluate the suitability as a joining material for electronics of engine room. Furthermore, mechanical properties change under complex environment were compared with several existing solder compositions. As a result of contact angle measurement, favorable spreadability of 84% was shown and the average shear strength manufactured with corresponding composition solder paste was $1.9kg/mm^2$. Also, thermo-mechanical reliability by thermal shock and vibration test was compared with that of the representative high temperature solder materials such as Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb. In order to fabricate the test module, solder balls were made in joints with ENIG-finished BGA and then the BGA chip was reflowed on the OPS-finished PCB pattern. During the environmental tests, resistance change was continuously monitored and the joint strength was examined after tests. Sn-3.5Ag alloy exhibited the biggest degradation rate in resistance and shear stress and Sn-0.7Cu resulted in a relatively stable reliability against thermo-mechanical stress coming from thermal shock and vibration.

• Restorative Dentistry and Endodontics
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• 제9권1호
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• pp.81-87
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• 1983

The purpose of this study was to observe and identify the phases of amalgam and to know the transformation of microstructure in the set amalgam by lapse of time. In this study, shofu spherical-D alloy was used. After trituration of amalgam alloy and mercury (Wig-L-Bug), it was filled in the stone dies. This specimens being polished and etched by usual method was observed under optical microscope using metallurgical microscope. And then X-ray diffractometer was used to analyze the phases contents and transformation of microstructure at $2{\frac{1}{2}}$ hours, 15 hours, 28 hours and 2 years after being amalgamated. The following results were obtained: 1. Shofu spherical-D alloy powder was composed of ${\gamma}$ phase, ${\epsilon}$phase and Ag-Cu eutectic phases. 2. ${\gamma}_2$ phases were appeared at $2{\theta}$ values ($32.0^{\circ}$ and $43.8^{\circ}$) in the amalgam which was analyzed at $2{\frac{1}{2}}$ hours and 15 hours after trituration with mercury. 3. In the amalgam at 28 hours, ${\gamma}_2$ phase was found at $2{\theta}$ value ($43.8^{\circ}$) at 35 hour, $r_2$ phase was appeared at $2{\theta}$ value $32.0^{\circ}$. 4. No ${\gamma}_2$ phases were observed in the 2 years old amalgam. But ${\eta}$ ($Cu_6Sn_5$) phases were found at $2{\eta}$ values $29.4^{\circ}$ and $42.4^{\circ}$.

• 대한치과보철학회지
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• 제19권1호
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• pp.17-27
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• 1981

This study was conducted to determine the chemical composition and the mechanical properties of four commercially available low gold-based crown and bridge alloy produced in Korea. Four dental casting gold-silver-palladium alloys, i.e., A, B, C and D (code of alloys) were selected for the evaluation of chemical composition, ultimate tensile strength, elongation. values and Vickers hardness. The chemical composition of test specimens was analyzed by both emission spectrography and wet gravitation method with a 1.5gm of low gold ingot. The tensile properties and Vickers hardness was determined with cast specimens treated in following three conditions; as-cast, softening heat treatment and hardening heat treatment. The tensile testing bars were cast in accordance with the model designed by Gettleman and Harrison (1969) which was modified from the A. D. A. Specification No. 14 for dental chromium-cobalt casting alloy. Nine tensile test specimens were made from a split silicone mold for each of the test alloys to the size of 2.5mm in diameter and a gauge length of 10mm. All four alloys were handled in accordance with conventional methods used in Type III gold alloys. Ultimate tensile strength and elongation were measured on an Instron Universal Tensile Testing Machine (Model 1125, Japan) operated at a crosshead rate of 0.1cm/min. Elongation values were measured using Digital Measuring Microscope (MS-152, FUSOH, Japan). Vickers hardness was determined with a Vickers Hardness Tester (Model VKH-l, Japan) at a 1.0kg load on a mounted tensile test specimen. The following results were obtained from this study; 1. All tested alloys were composed of Au, Ag, Pd, Cu, Zn and Fe in common. The composition rate of gold for all four alloys was found in the range of $42{\sim}47$ weight % as shown below. Alloy A; Au 45%, Ag 40.2%, Pd 5.76%, others 9.04%. Alloy B; Au 47.1%, Ag 29.03%, Pd 6.98%, others 16.92%. Alloy C; Au 45%, .Ag 26.9%, Pd 6.83%, others 21.07%. Alloy D; Au 41.8%, Ag 34.4%, Pd 6.95%, others 16.85%. 3. The ultimate tensile strength of the four alloys was in the range of $31{\sim}82kg/mm^2$. The test results were shown in the below order from the highest value; As-cast condition; D, B, C, A. Softening heat treament; B, C, D, A. Hardening heat treatment; D, B, C, A. 4. The test :results of the elongation rate for each alloy were in the range of $0.5{\sim}18%$. The test results were shown in the below order from the highest value; As-cast condition; A, D, B, C. Softening heat treatment; A, C, D, B. Hardening heat treatment; C, D, B, A. 5. Vickers hardness for each of the four alloys was in the range of $120{\sim}230$. The test results were shown in the below order from the highest value; As-cast condition; C, B, D, A Softening heat treatment; D, B, C, A. Hardening heat treatment; D, A, C, B. 6. There were no differences in the physical properties between as-cast condition and softening heat treatment.

• 박물관보존과학
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• 제16권
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• pp.4-13
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• 2015

지금까지 한반도에서 출토된 누금세공유물의 접합방법을 살펴보면 금과 은을 합금한 재료를 사용한 금납법으로 접합한 경우가 대부분이다. 경주 보문동합장분 출토 금제태환이식(국보 제90호), 호암미술관 소장 금제세환이식과 금제태환이식(보물 제557호) 그리고 통일신라시대 감은사지 동삼층석탑 출토 금제풍탁(金製風鐸) 등에서 확인되었다. 그러나 경주 계림로 14호묘 출토 장식보검(裝飾寶劍)의 금립 접합방법은 지금까지 확인된 방식과는 다르다는 것을 SEM-EDS 분석으로 알 수 있었다. 계림로 장식보검의 금립은 크기와 형태가 매우 고르고, 표면에 수지상 조직(樹枝狀組織)을 갖고 있다. 순수한 금속에서는 이 수지상 조직이 나타나지 않으며, 합금된 물질의 특징이라고 할 수 있다. 실제로 금립의 조성은 Au 77wt%, Ag 18wt%, Cu 4wt%의 3원계 합금물질이다. 이 성분 특성(합금 금속)으로 인하여 순수한 금의 녹는점인 1064℃ 보다 훨씬 더 낮은 온도인 1000℃ 미만(약 980℃)에서도 금속의 용해가 가능하게 된다. 그러므로 금땜이나 다른 매개물을 전혀 사용하지 않고도 순간적으로 고온을 가하게 되면 금립의 접합이 가능하게 된다. 그리고 SEM 이미지 관찰에서도 땜의 흔적을 전혀 찾아 볼 수 없는 것으로 보아 융접법에 의한 접합이 이루어진 것으로 추정된다.

• 대한치과기공학회지
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• 제30권2호
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• pp.31-37
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• 2008

A variety of the porcelain fused to gold(PFG) have been developed to which porcelain can be fused. PFG alloys developed for this purposed have a high melting point and do not discolor when combined with porcelain. The design of the compositions of PFG is very important to esthetic restorative materials applying to porcelain. The purpose of this study is on the change of physical and mechanical characteristics in PFG 18K alloy by the small additional elements. Principal results are as follows. The high Au alloy containing 18Karat gold contents is respectively Au(75%), Pd(10%), Pt(4%), Ag(4%), In(2%), Sn(2%), Cu(2%), Ti(1%). These alloys are composed mainly of gold, platinum, silver and palladium with a few percent of the additional elements. By the addition of small amounts of elements such as In, Sn, Ti, the fine grain castings are produced in gold alloy and the small addition of platinum is very effective in increasing of hardness and strength. These gold alloys are representative of the changes to be expected as a result of heat treatment. These changes in strength and hardness values are sufficient to demonstrate a significant difference in performance between a as-casted and a heat-treated. These alloys have mechanical properties characteristics of Type and Type gold alloys. These alloys are useful to porcelain-metal restorations and dental laboratory. Also the porcelain fused to metal(PFM) alloys containing gold are commonly use for dental purposes in dental laboratory.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.83-90
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• 2017

본 연구에서는 미세피치 패키지 적용을 위한 기초 실험으로 thin ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold) 도금층을 형성하여 솔더링 특성을 평가하였다. 먼저, Sn-3.0Ag-0.5Cu (SAC305) 솔더합금에 대한 thin ENEPIG 도금층의 젖음 특성이 평가되었으며, 순차적인 솔더와의 반응에 대한 계면반응 및 솔더볼 접합 후 고속 전단 시험을 통한 접합부 기계적 신뢰성이 평가되었다. 젖음성 시험에서 침지 시간이 증가함에 따라 최대 젖음력은 증가하였으며, 5초의 침지 시간 이후에는 최대 젖음력이 일정하게 유지되었다. 초기 계면 반응 동안에는 $(Cu,Ni)_6Sn_5$ 금속간화합물과 P-rich Ni 층이 SAC305/ENEPIG 계면에서 관찰되었다. 연장된 계면반응 후에는 P-rich Ni 층이 파괴 되었으며, 파괴된 P-rich Ni 층 아래에는 $(Cu,Ni)_3Sn$ 금속간화합물이 생성되었다. 고속 전단 시험의 경우, 전단속도가 증가함에 따라 취성 파괴율이 증가하였다.

• Restorative Dentistry and Endodontics
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• 제9권1호
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• pp.101-106
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• 1983

It was the purpose of this study to investigate the fracture mode of dental amalgam by observing the crack propagation, and to relate this to the microstructure of the amalgam. Caulk 20th Century Regular, Caulk Spherical, Dispersalloy, and Tytin amalgam alloys were used for this study. After each amalgam alloy and Hg measured exactly by the balance was triturated by the mechanical amalgamator (Capmaster, S.S. White), the triturated mass was inserted into the cylindrical metal mold which was 4 mm in diameter and 12 mm in height and was pressed by the Instron Universal Testing Machine at the speed of 1mm/min with 120Kg. The specimen removed from the mold was stored in the room temperature for a week. This specimen was polished with the emery papers from #100 to #200 and finally on the polishing cloth with 0.06${\mu}Al_2O_3$ powder suspended in water. The specimen was placed on the Instron testing machine in the method similar to the diametral tensile test and loaded at the crosshead speed of 0.05mm/min. The load was stopped short of fracture. The cracks on the polished surface of specimen was examined with scanning electron microscope (JSM-35) and analyzed by EPMA (Electron probe microanalyzer). The following results were obtained. 1. In low copper lathe-cut amalgam, the crack went through the voids and ${\gamma}_2$ phase, through the ${\gamma}_1$ phase around the ${\gamma}$ particles. 2. In low copper spherical amalgam, it was observed that the crack passed through the ${\gamma}_2$ and ${\gamma}_1$ phase, and through the boundary between the ${\gamma}_1$ and ${\gamma}$ phase. 3. In high copper dispersant (Dispersalloy) amalgam, the crack was found to propagate at the interface between the ${\gamma}_1$ matrix and reaction ring around the dispersant (Ag-Cu) particles, and to pass through the Ag-Sn particles. 4. In high copper single composition (Tytin) amalgam, the crack went through the ${\gamma}_1$ matrix between ${\eta}$ crystals, and through the unreacted alloy particle (core).