• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 춘계학술대회
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

• 한국결정성장학회지
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• 제27권2호
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• pp.94-98
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• 2017

최근 수년 동안 Sn-3.0Ag-0.5Cu(weight%) 조성의 합금은 주요 전자 제조업체들의 대표 무연솔더 조성으로 다양한 전자제품의 제작에 적용되어 왔다. 그러나 최근 Ag 가격의 급격한 상승과 전자산업의 저가격화 전략으로 인해 솔더 재료에서의 Ag 함량의 감소가 지속적으로 요구되고 있다. 본 연구에서는 Sn-3.0Ag-0.5Cu 조성의 무연솔더를 주석, 은 및 구리 금속분말의 용융을 이용하여 합금화 하였다. 제조한 Sn-3.0Ag-0.5Cu 샘플에 대한 결정구조 및 미세구조를 XRD, 광학현미경, FE-SEM 및 EDS 분석을 이용하여 검토하였다. 분석결과, 제조된 Sn-3.0Ag-0.5Cu 샘플은 ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$ 및 ${\eta}-Cu_6Sn_5$ 결정으로 구성되어 있었다.

• Korean Chemical Engineering Research
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• 제60권2호
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• pp.175-183
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• 2022

자동차 시장의 확대에 따라 자동차 모터의 필수 소재로 희토류금속인 Nd에 대한 수요가 급증하고 있다. Nd를 제조하기 위하여 Nd₂O₃와 Ca계 합금의 열 환원반응에 관한 연구가 활발히 진행되어 왔다. 본 연구에서는 Nd₂O₃의 환원제로 사용되는 Ca계 합금인 Ca-Cu를 CaCl₂ 용융염에서 전기분해반응을 통해 제조하였다. 전기분해반응의 작업 전극과 상대전극으로는 Cu 와이어와 흑연을 각각 사용하였다. 기준전극은 AgCl:CaCl₂=1:99 mol%로 혼합한 혼합물에 Ag 와이어를 넣어 제작하였다. 순환전압 전류법 결과에 의하면 -1.8 V의 전위부터 작업전극의 표면에 Ca²⁺의 증착이 관찰되었으며, CaCl₂ 염의 온도가 증가할수록 Ca²⁺의 환원전위가 감소하였다. 시간대전류법 실험을 통해 계산된 Ca²⁺의 확산계수는 5.4(±6.8)×10^-6 cm²/s으로 나타났다. 또한, Cu 전극에 일정한 전위를 가해 Ca-Cu 액상합금을 제조하였으며 제조된 합금은 EDS line scan을 통해 인가 전위의 증가에 따라 Ca의 전기화학적 삽입이 증가함을 확인하였다. -2.0 V보다 음의 전위를 인가하여 제조한 Ca-Cu 합금의 조성비는 Ca:Cu=1:4임을 확인하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.53-53
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• 2011

As the dimension of Cu interconnects has continued to reduce, its resistivity is expected to increase at the nanoscale due to increased surface and grain boundary scattering of electrons. To suppress increase of the resistivity in nanoscale interconnects, alloying Cu with other metal elements such as Al, Mn, and Ag is being considered to increase the mean free path of the drifting electrons. The formation of Al alloy with a slight amount of Cu broadly studied in the past. The study of Cu alloy including a very small Al fraction, by contrast, recently began. The formation of Cu-Al alloy is limited in wet chemical bath and was mainly conducted for fundamental studies by sputtering or evaporation system. However, these deposition methods have a limitation in production environment due to poor step coverage in nanoscale Cu metallization. In this work, gap-filling of Cu-Al alloy was conducted by cyclic MOCVD (metal organic chemical vapor deposition), followed by thermal annealing for alloying, which prevented an unwanted chemical reaction between Cu and Al precursors. To achieve filling the Cu-Al alloy into sub-100nm trench without overhang and void formation, furthermore, hydrogen plasma pretreatment of the trench pattern with Ru barrier layer was conducted in order to suppress of Cu nucleation and growth near the entrance area of the nano-scale trench by minimizing adsorption of metal precursors. As a result, superconformal gap-fill of Cu-Al alloy could be achieved successfully in the high aspect ration nanoscale trenches. Examined morphology, microstructure, chemical composition, and electrical properties of superfilled Cu-Al alloy will be discussed in detail.

• 한국초전도ㆍ저온공학회논문지
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• 제10권1호
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• pp.24-27
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• 2008

For the development of superconducting fault current limiters(SFCLs) having large current capacity, we fabricated an SFCL element that consists of Bi-2212 superconductor and Cu-Ni alloy tubes. First, Ag was plated on the surface of the Bi-2212 for the enhancement of soldering process. On the Ag-plated Bi-2212 tube, a Cu-Ni alloy tube was soldered using optimized solders and soldering conditions. The BSCCO/Cu-Ni composite was processed mechanically to have a helical shape for the improvement of the SFCL characteristics. The total current path of the SFCL element was 1330 mm long with 12 turns, and had critical current of 340 A at 77 K. Finally, we carried out the fault test using the fabricated SFCL element. It showed successful current limiting performance under the fault condition of 50 $V_{rms}$ and 5.5 kA. From the results, the rated voltage of the SFCL element was decided to be 0.4 V/cm, and the power capacity was 12 kVA at 77 K. The fabrication process of the SFCL and the fault test results will be presented.

• 한국재료학회지
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• 제9권10호
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• pp.1018-1024
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• 1999

Sn-3.5Ag 무연합금을 Cu 및 Alloy42 리드프레임에 납땜접합 (solder joint)하고 미세조직, 젖음성, 전단강도, 시효효과를 측정하여 비교하였다. Cu의 경우, 땜납의 Sn기지상안에 Ag(sub)3Sn과 Cu(sub)6Sn(sub)5상이, 그리고 땜납/리드프레임의 경계면에서는 1∼2㎛ 두께의 Cu(sub)6Sn(sub)5상이 형성되었다. Alloy42의 경우, 기지상내에 있는 낮은 밀도의 Ag(sub)3Sn상만이, 그리고 계면에는 0.5∼1.5㎛ 두께의 FeSn(sub)2이 형성되었다. 한편, Cu에 비해 Alloy42 리드프레임에서 퍼짐면적은 크고 접촉각은 작아 더 우수한 젖음성을 나타내었으나, 전단강도는 35%, 연신율은 75%로 낮았다. 180℃에서 1주일간 시효처리 후, Cu 리드프레임에는 계면에 η-Cu(sub)6Sn(sub)5 층외에 ξ-Cu(sub)3Sn층이 성장하였고, Alloy42 리드프레임에는 기지상내에 Ag(sub)3Sn이 구형으로 조대하게 성장하였고, 계면에는 FeSn(sub)2층만이 약 1.5㎛로 성장하였다.

• 대한금속재료학회지
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• 제46권1호
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• pp.26-32
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• 2008

Examination of two bronze vessels supposedly from the Koryo dynasty revealed that they consist of bowls and stands that are fixed together using rivet joints made of Cu-Ag alloys. The bowls and stands were forged out of unleaded bronze alloys of approximately 22 weight % Sn before being quenched from the ${\alpha}+{\beta}$ region of the Cu-Sn phase diagram. This specific alloy and the thermo-mechanical treatment constitute two key elements of the unique technical tradition called Bangcha (방짜) that has long been established in Korea. The high Sn content ensures better casting and the thermal treatment causes the brittle ${\delta}$ phase to be avoided in forging as well as in services. The experiment on the laboratory Cu-Ag alloys of varying Ag contents suggested that the Cu-Ag system was the best choice of materials for the rivets at the time in view of their color, availability, ductility and low melting points.

• 한국주조공학회지
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• 제21권4호
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• pp.232-238
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• 2001

Experimental study on the twin roll strip casting of BCuP-5(Cu-15wt%Ag-wt5%P) alloy was carried out using laboratory scale horizontal type twin roll caster. In this study, among the various operating parameters, such as tundish angle, contact angle, pouring temperature, roll speed, presetting gap of the rolls and kinds of roll and tundish materials, effect of pouring temperature for strip casting of BCuP-5 alloy which has long freezing range of about $170^{\circ}C$ was mainly investigated. BCuP-5 alloy strip was successfully produced when pouring molten metal at lower temperature than its liquidus temperature. Microstructure of the cast strip consists of primary Cu and eutectic. Especially the size of primary Cu phase increased with decreasing of pouring temperature.

• 한국주조공학회지
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• 제17권3호
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• pp.245-251
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• 1997

Solderability, interfacial reaction and mechanical properties of joint between Sn-Bi-Ag base solder and Cu-substrate were studied. Solders were subjected to aging treatments to see the change of mechanical properties for up to 30 days at $100^{\circ}C$, and then also examined the changes of microstructure and morphology of interfacial compound. Sn-Bi-Ag base solder showed about double tensile strength comparing to Pb-Sn eutectic solder. Addition of 0.7wt%Al in the Sn-Bi-Ag alloy increase spread area on Cu substrate under R-flux and helps to reduce the growth of intermetallic compound during heat-treatment. According to the aging experiments of Cu/solder joint, interfacial intermetallic compound layer was exhibited a parabolic growth to aging time. The result of EDS, it is supposed that the soldered interfacial zone was composed of $Cu_6Sn_5$.

• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.49-55
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• 2011

전자기기에서의 고장 중 대부분은 작동 중 발생하는 열과 충격에 기인한다. 이 열과 충격은 PCB(Printed Board) 부품의 접합부 계면에 균열을 야기 시키고, 이 균열은 금속간 화합물(Intermetallic Compound: IMC)의 형성과 밀접한 관계를 가진다. 본 연구에서는 Sn-Ag-Cu계의 Ag함량을 변화한 Sn-1.0Ag-0.5Cu와 Sn-1.2Ag-0.5Cu 및 Sn-3.0Ag-0.5Cu의 3가지 조성의 솔더로 접합한 소재를 대상으로 1000시간 까지 등온시효(Isothermal Aging) 하였다. 등온시효 동 안 솔더(Solder)의 계면에 발생하는 IMC(Intermetallic Compound) 성장이 관찰되었으며, solder 접합부의 기계적 특성은 굽힘충격 시험법을 이용하여 평가되었다. 그 결과 시효처리 전에는 Ag 함량이 낮은 solder의 굽힘충격 특성이 우수하게 나타났으나, 시효처리 후에는 반대의 결과를 나타내었다. 이 결과는 IMC layer 주변에 생성된 미세한 $Ag_3Sn$ 및 조대한 $Cu_6Sn_5$와 관련되어, 미세한 $Ag_3Sn$이 충격을 완화한 것으로 나타나 이에 따라 굽힘충격 특성에 차이가 나타남을 알 수 있었다.