• Korean Journal of Materials Research
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• v.25 no.1
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• pp.32-36
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• 2015

Hot rolling of Mg-6Zn-0.6Zr-0.4Ag-0.2Ca-(0, 8 wt%)Li powder was conducted at the temperature of $300^{\circ}C$ by putting the powder into the Cu pipe. The microstructure and mechanical properties of the samples were observed. Mg-6Zn-0.6Zr-0.4Ag-0.2Ca without Li element was consisted of ${\alpha}$ phase and precipitates. The microstructure of the 8 wt%Li containing alloy consisted of two phases (${\alpha}$-Mg phase and ${\beta}$-Li phase). In addition, $Mg_2Zn_3Li$ was formed in 8%Li added Mg-6Zn-0.6Zr-0.4Ag-0.2Ca alloy. By addition of the Li element, the non-basal planes were expanded to the rolling direction, which was different from the based Mg alloy without Li. The tensile strength was gradually decreased from 357.1 MPa to 264 MPa with increasing Li addition from 0% to 8%Li. However, the elongation of the alloys was remarkably increased from 10 % to 21% by addition of the Li element to 8%. It is clearly considered that the non-basal texture and ${\beta}$ phase contribute to the increase of elongation and formability.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.1-9
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• 2002

The metallurgical reaction properties between the pad consisted of 0.5 $\mu\textrm{m}$Au/5 $\mu\textrm{m}$Ni/Cu layers on a conventional ball grid array (BGA) substrate and In-15 (wt.%)Pb-5Ag solder ball were characterized during the reflow process and solid aging. During the reflow process of 1 to 5 minutes, it was observed that thin $AuIn_2$ or Ni-In intermetallic layer was formed at the interface of solder/pad. The dissolution rate of the Au layer into the molten solder was about $2\times 10^{-3}$ $\mu\textrm{m}$/sec which is remarkably low in comparison with a eutectic Sn-37Pb solder. After solid aging treatment for 500 hrs at $130^{\circ}C$, the thickness of $Ni_{28}In_{72}$ intermetallic layer was increased to about 3 $\mu\textrm{m}$ in all the conditions nevertheless the initial reflow time was different. These result show that In atoms in the solder alloy were diffused through the $AuIn_2$ phase to react with underlaying Ni layer during solid aging treatment. From the microstructural observation and shear tests, the reaction properties between In-15Pb-5Ag alloy and Au/Ni surface finish were analyzed not to trigger Au-embrittlement in the solder joints unlike Sn-37Pb composition.

• Journal of Mechanical Science and Technology
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• v.16 no.9
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• pp.1078-1083
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• 2002

Ceramics are significantly used in many industrial applications due to their excellent mechanical and thermal properties such as high temperature strength, low density, high hardness, low thermal expansion, and good corrosion resistive properties, while their disadvantages are brittleness, poor formability and high manufacturing cost. To combine advantages of ceramics with those of metals, they are often used together as one composite component, which necessiates reliable joining methods between metal and ceramic. Direct brazing using an active filler metal has been found to be a reliable and simple technique, producing strong and reliable joints. In this study, the fracture characteristics of Si$_3$N$_4$ ceramic joined to ANSI 304L stainless steel with a Ti-Ag-Cu filler and a Cu (0.25-0.3 mm) interlayer are investigated as a function of strain rate and temperature. In order to evaluate a local strain a couple of strain gages are pasted at the ceramic and metal sides near joint interface. As a result the 4-point bending strength and the deflection of interlayer increased at room temperature with increasing strain rate. However bending strength decreased with temperature while deflection of interlayer was almost same. The fracture shapes were classified into three groups ; cracks grow into the metal-brazing filler line, the ceramic-brazing filler line or the ceramic inside.

• Journal of Surface Science and Engineering
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• v.48 no.1
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• pp.11-22
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• 2015

Pd alloy hydrogen membranes for hydrogen purification and separation need thermal stability at high temperature for commercial applications. Intermetallic diffusion between the Pd alloy film and the porous metal support gives rise to serious problems in long-term stability of Pd alloy membranes. Ceramic barriers are widely used to prevent the intermetallic diffusion from the porous metal support. However, these layers result in poor adhesion at the interface between film and barrier because of the fundamentally poor chemical affinity and a large thermal stress. In this study, we developed Pd alloy membranes having a dense microstructure and saturated composition on modified metal supports by advanced DC magnetron sputtering and heat treatment for enhanced thermal stability. Experimental results showed that Pd-Cu and Pd-Ag alloy membranes had considerably enhanced long-term stability owing to stable, dense alloy film microstructure and saturated composition, effective diffusion barrier, and good adhesive interface layer.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.43-47
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• 2001

Sn-3Ag-8Bi-5In was developed for the intermediate melting point solder. Although In-contained solder is expensive, its melting point is lower than these of Sn-Ag-Cu alloys. Sn-3Ag-8Bi-5In solder used for this research has a melting range of 188~$204^{\circ}C$. On this study wetting characteristics of Sn-3Ag-8Bi-5In were evaluated in order to investigate its availability as a Pb-free solder. Wettabilities of Sn-37Pb and Sn-3.5Ag solders were also studied to compare these of the Sn-3Ag-8Bi-5In. Experimental results showed that the zero-cross-time and wetting time at $240^{\circ}C$ for the Sn-3Ag-8Bi-5In were 1.1 and 2.2 second respectively. These values are a little better than these of Sn-37Pb and Sn-3.5Ag solders. The equilibrium wetting farce of the Sn-3Ag-8Bi-5In was 5.8 mN at $240^{\circ}C$, and it was tuned out to be a little higher than that of Sn-3.5Ag and lower than that of Sn-37Pb.

• The Journal of Korean Academy of Prosthodontics
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• v.27 no.1
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• pp.49-54
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• 1989

The purpose of this study was to investigate the interfacial elemental change when solding the Ni-Co-Cr dental removable partial denture alloy and Fe-Cr-Ni wrought wire alloy with Ag-Cu-Zu Silver solder, by EDXA, EPMA, to investigate the appropriateness of clinical usefullness for repair the fractured clasps of removable partial dentive. The result of this study was as follows: 1. The Ni element of major component of Ticonium penetrate into the silver solder 2. The movement Age element of silver solder into Fe-Cr-Ni wire was not significant, by EDXA and EPMA.

• Korean Journal of Materials Research
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• v.34 no.3
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• pp.170-174
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• 2024

In this study, we report the microstructural evolution and shear strength of an Sn-Sb alloy, used for die attach process as a solder layer of backside metal (BSM). The Sb content in the binary system was less than 1 at%. A chip with the Sn-Sb BSM was attached to a Ag plated Cu lead frame. The microstructure evolution was investigated after die bonding at 330 ℃, die bonding and isothermal heat treatment at 330 ℃ for 5 min and wire bonding at 260 ℃, respectively. At the interface between the chip and lead frame, Ni₃Sn₄ and Ag₃Sn intermetallic compounds (IMCs) layers and pure Sn regions were confirmed after die bonding. When the isothermal heat treatment is conducted, pure Sn regions disappear at the interface because the Sn is consumed to form Ni₃Sn₄ and Ag₃Sn IMCs. After the wire bonding process, the interface is composed of Ni₃Sn₄, Ag₃Sn and (Ag,Cu)₃Sn IMCs. The Sn-Sb BSM had a high maximum shear strength of 78.2 MPa, which is higher than the required specification of 6.2 MPa. In addition, it showed good wetting flow.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.608-613
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• 2017

We proposed a pyrometallurgical process to achieve gold alloy with an Au content of more than 80wt% from low grade (<35wt%) gold alloys. We performed the heat treatment at a temperature of $1200^{\circ}C$ for 5 hrs using Au35wt%-Ag5wt%-Cu60wt% gold alloys mixed with 1/2 weighed PbO and CaO flux by varying the ratio of PbO/(PbO+CaO) from 0 to 1. We investigated the change in content of the samples with energy dispersive X-ray spectroscopy (EDS) and time of flight secondary ion mass spectrometry (ToF-SIMS). The EDS results showed that the Au content increased from 35.0wt% in the PbO-only sample to 86.7wt% (in the PbO/(PbO+CaO) 1:1 sample), while the other samples achieved more that 84wt%. In addition, the 2/3 flux ratio sample showed the lowest Ag loss into the flux. In the ToF-SIMS results, the PbO only and CaO only fluxes had Au+ peak intensities of 349 and 37, respectively. Although the CaO-only flux might be more favorable considering the loss of Au into the flux, we concluded that the amount of Au lost into the flux could be ignored. Our results imply that that the pyrometallurgical process using a mixed flux is an effective hydrometallurgical process.

• Journal of Korea Foundry Society
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• v.22 no.1
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• pp.35-41
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• 2002

To improve the reliability of solder joints, a composite solder which consists of solder matrix and intermetallic reinforcements was manufactured by a new method. The cast ingot of Sn-6.9Cu-2.9Ag alloy had primary Cu6Sn5 intermetallics in the form of dendrites. After rolling the ingot, the intermetallic dendrites were crushed into fine particles and distributed uniformly throughout the solder matrix. As the rolled strips became thinner, the average size of the crushed particles reached a critical size which did not decrease any more by further rolling. The critical size was nearly the same as the average width of intermetallic dendrite trunk. The crushed intermetallic particles did not melt and remained in solid state during reflow soldering due to their high meltingterm-perature. The coarsening and gravitational segregation of the particles were observed during reflow soldering.

• Korean Journal of Materials Research
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• v.7 no.7
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• pp.571-575
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• 1997

급냉온도에 따른 전기 저항 측정으로 Cu-17, 25Zn-15AI 및 Cu-17.25Zn-15AI-1Ag형상기억합금의 열처리에 의한 마르텐사이트 변태온도의 영향을 연구하였다. DSC 측정으로 고온 모상에서의 상전이 온도롸 종류를 구별하였고 XRD측정으로 구조 변화를 연구하였다. 그리고 열처리에 의한 온도 변화의 원인을 연구하였17.25Zn-15AI 합금에서 고온 모상의 규칙-불규칙 전이온도인 $T_{2}$, $T_{L21}$은 각각 809K와 610K였다. CuZnAI의 경우 $T_{2}$근방에서의 급냉은 마르텐사이트 변태온도를 높이지만 $T_{L21}$ 근방에서의 급냉은 마르텐사이트 변태온도를 낮춘다. 실험결과 열처리에 따른 상전이온도 변화의 원인은 석출물의 형성이라기 보다는 급냉전의 모상의 구조에 가장 큰 영향을 받는다.받는다.