• 열처리공학회지
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• 제17권1호
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• pp.2-9
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• 2004

This study has examined the metallurgical microstructures and alloy compositions of 3 bronze artifacts, a vessel, a spoon and a chopstick, manufactured in the Koryo Dynasty. The results show that they were made from Cu-Sn alloys whose Sn content ranges from 22 to 24% by weight. It is of significant importance to find that they were all given special thermo-mechanical treatments during their manufacturing. It has been found that the Koryo bronze workers were well aware of the mechanical properties of ${\alpha}$, ${\beta}$, ${\gamma}$ and ${\delta}$ phases that appear in the Cu-Sn alloys. Knowing how to promote or suppress the formation of each phase, they were able to find proper alloy compositions and temperatures for the high Sn alloys to be successfully forged. The present study will detail the Koryo bronze technology as estimated from the microstructures of the 3 bronze artifacts. The results of the reproduction experiments with Cu-24%Sn will also be presented to explain how the microstructures develop and to estimate the mechanical properties of each phase.

• Journal of Welding and Joining
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• 제33권3호
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• Journal of Electrochemical Science and Technology
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• 제3권3호
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• pp.123-134
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• 2012

The electrochemical performance of positive pole grids of lead-acid batteries made of Pb-0.08%Ca-1.1%Sn alloys without and with 0.1 wt% of each of Cu, As or Sb and with 0.1 wt% of Cu, As and Sb combined was investigated by electrochemical methods in 4.0 M $H_2SO_4$. The corrodibility of alloys under open-circuit conditions and constant current charging of the positive pole, the positive pole gassing and the self-discharge of the charged positive pole were studied. All impurities (Cu, As, Sb) were found to decrease the corrosion resistance, $R_{corr}$ after 1/2 hour corrosion, but after 24 hours an improvement in $R_{corr}$ was recorded for Sb containing alloy and the alloy with the three impurities combined. While an individual impurity was found to enhance oxygen evolution reaction, the impurities combined significantly inhibition this reaction and the related water loss problem was improved. Impedance results were found helpful in identification of the species involved in the charging/discharging and the self-discharge of the positive pole. Impurities individually or combined were found to increase the self-discharge during polarization (33-68%), where Sb containing alloy was the worst and impurities combined alloy was the least. The corrosion of the positive pole grid in the constant current charging was found to increase in the presence of impurities by 5-10%. Under open-circuit, the self-discharge of the charged positive grids was found to increase significantly (92-212%) in the presence of impurities, with Sb-containing alloy was the worst. The important result of the study is that the harmful effect of the studied impurities combined was not additive but sometimes lesser than any individual impurity.

• 한국분말재료학회지
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• 제23권1호
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• pp.49-53
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• 2016

The present study demonstrates the effect of freezing conditions on the pore structure of porous Cu-10 wt.% Sn prepared by freeze drying of $CuO-SnO_2$/camphene slurry. Mixtures of CuO and $SnO_2$ powders are prepared by ball milling for 10 h. Camphene slurries with 10 vol.% of $CuO-SnO_2$ are unidirectionally frozen in a mold maintained at a temperature of $-30^{\circ}C$ for 1 and 24 h, respectively. Pores are generated by the sublimation of camphene at room temperature. After hydrogen reduction and sintering at $650^{\circ}C$ for 2 h, the green body of the $CuO-SnO_2$ is completely converted into porous Cu-Sn alloy. Microstructural observation reveals that the sintered samples have large pores which are aligned parallel to the camphene growth direction. The size of the large pores increases from 150 to $300{\mu}m$ with an increase in the holding time. Also, the internal walls of the large pores contain relatively small pores whose size increases with the holding time. The change in pore structure is explained by the growth behavior of the camphene crystals and rearrangement of the solid particles during the freezing process.

• 보존과학회지
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• 제20권
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• pp.23-30
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• 2007

호록 미륵사지에서 출토된 동경의 성분을 분석하여 어떠한 배합비로 주조하였는지 또한 금속조직 관찰을통하여 동경의 제작기법을 그리고 납동위원소비를 분석하여 동경에 쓰인 납이 어느 지역의 방연석을 사용한 것인지를 검토하였다. 동경의 성분분석 결과, Cu의 농도는 68.8-73.3wt% Sn의 농도는 21.6-24.9wt%로 나타났으며, Pb의 함량은 시료번호 미륵 2와 3이 미륵 4에 비해 높게 나타났다. 미세조직은 미륵 2와 3의 경우는 주조조직으로서 ${\alpha}$상과 ${\alpha}+{\delta}$상으로 이루어져 있었으며, 미륵 4의 경우는 마르텐사이트 조직이 관찰되는 것으로 보아 인위적인 열처리가 있었음을 알 수 있다. 납동위원소비를 통한 산지분석결과에서는 동경의 주조시 사용된 납의 경우 일본지역에서 쓰인 방연석과 깊은 상관관계가 있는 것으로 나타났다. 이 연구 결과는 익산 미륵사지에서 출토된 동경의 제작기법 및 교류관계 등을 알아볼 수 알 수 있는 귀중한 자료로 활용될 것이다.

• 박물관보존과학
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• 제26권
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• pp.161-182
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• 2021

완구(碗口)란 유통식 화기로 발사체 장전 부분이 사발(碗) 형태인 화포이다. 발사체로는 비격진천뢰(飛擊震天雷)나 단석(團石) 등을 사용하였다. 『화포식언해(火砲式諺解)』(이서(李曙), 1635)에 의하면, 대·중·소·소소완구 등 총 4종으로 구분되며, 실물은 대완구 1점(보물 제857호), 중완구 2점(보물 제858호, 제859호) 등 총 3점이 전한다. 본 연구에서는 임진왜란기에 제작된 국립진주박물관 소장 중완구(보물 제858호)와 해군사관학교 박물관 소장 중완구(보물 제859호)의 과학적 조사를 토대로 제작 기술을 확인하였다. 첫 번째로 국내 현전하는 중완구가 단 두점인 만큼 정밀 3D 스캐닝 정보를 바탕으로 세부 제원을 서로 비교하고, 동 시기의 문헌 기록 수치와 함께 검토하였다. 전체 크기차는 근소하나 중량에서 5,507g의 차이를 보이고, 세부적으로 심지구멍 위치와 손잡이 길이가 상이하다. 한편 현전 중완구는 『화포식언해』의 중완구 제원과 가장 유사하다. 두 번째로는 중완구의 성분을 분석하고 기존 청동제 화약 무기와 함께 검토하였다. 표면 성분 분석결과, 중완구는 Cu-Sn-Pb의 삼원계 합금이며, 평균 함량(wt%)은 Cu 85.24 : Sn 10.16 : Pb 2.98이다. 중완구의 재료 성분은 기존에 조사된 조선 청동 화약 무기의 평균 성분과 매우 유사하며, 중세 유럽의 청동제 화포 재료(Gun-metal)와도 유사한 경향임을 확인하였다. 마지막으로 중완구 표면의 주조 결함(casting defect)과 CT 상을 토대로 주조 기법을 추정하였다. 측면의 주조분할선으로 보아 주형을 반으로 나눈 분할 제작(piece mold)이며, 용탕의 주입은 약실끝 부분으로 포구가 바닥에 오는 수직 주형 설계로 추정한다. 특히 포신 기벽에서 주형과 코어를 고정하는 보조 장치인 채플릿(chaplets)이 확인되므로 이는 기벽을 일정하게 형성하는 역할을 했을 것이다. 한편 보물 제858호와 제859호 중완구 두 점은 외형이 매우 유사하지만, 채플릿의 수량과 배치가 상이하여 주형 설계 일부가 달랐을 것으로 예상한다.