• Journal of the Korean Society for Railway
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• v.6 no.1
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• pp.21-28
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• 2003

Environment-dependent fatigue life of Cu-Cd alloy wires used as messenger wires was investigated. Tensile test results showed the decrease of tensile strength and elongation of messenger wires by 3.7% and 16.8%, respectively, in used specimens when compared to new ones. Messenger wires used at industrial region for 26 yeras showed 35∼50% decrease in fatigue life, which is partly due to the in stress concentrations by formation of corrosion products at the surface. Single wires showed better fatigue properties than stranded wires, especially at low cycle regions with higher stresses. Stranded wires showed shorter fatigue lives than single wires because of friction between wires by surface contact. Service life of messenger wires was dependent upon the environments which they were exposed to. SO$_2$ and humidity deteriorated the fatigue properties by environmental degradation.

• Journal of the Korean Vacuum Society
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• v.18 no.3
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• pp.203-207
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• 2009

Copper is known as a replacement for aluminum wire which is used for semiconductor. Because specific resistance of Cu ($1.67{\mu}{\Omega}$-cm) is lower than that of Al ($2.66{\mu}{\Omega}$-cm), Cu reduce RC delay time. Although melting point of Cu($1085^{\circ}C$) is higher than melting point of Al, Cu have characteristic to easily react with Silicon(Si) in low temperature, and it isn't good at adhesive strength with Si. For above these reason, research of diffusion barrier to prevent reaction between Cu and Si and to raise adhesive strength is steadily advanced. Our study group have researched on W-C-N (tungsten-carbon-nitrogen) Diffusion barrier for preventing diffusion of Cu through semiconductor. By recent studies, It's reported that W-C-N diffusion barrier can even precent Cu and Si diffusing effectively at high temperature. In this treatise, we vaporized different proportion of N into diffusion barrier to research Cu's Electromigration based on the results and studied surface hardness in the heat process using nano scale indentation system. We gain that diffusion barrier containing nitrogen is more stable for Cu's electromigration and has stronger surface hardness in heat treatment process.

• The korean journal of orthodontics
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• v.48 no.3
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• pp.153-162
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• 2018

Objective: The aim of this trial was to compare the alignment efficiency and intermaxillary arch dimension changes of nickel-titanium (NiTi) or copper-nickel-titanium (CuNiTi) round archwires with increasing diameters applied sequentially to the mandibular arch. Methods: The initial alignment phase of fixed orthodontic treatment with NiTi or CuNiTi round archwires was studied in a randomly allocated sample of 66 patients. The NiTi group comprised 26 women, 10 men, and the CuNiTi ($27^{\circ}C$) group comprised 20 women, 10 men. The eligibility criteria were as follows: anterior mandibular crowding of minimum 6 mm according to Little's Irregularity Index (LII), treatment requiring no extraction of premolars, 12 to 18 years of age, permanent dentition, skeletal and dental Class I malocclusion. The main outcome measure was the alignment of the mandibular anterior dentition; the secondary outcome measure was the change in mandibular dental arch dimensions during 12 weeks. Simple randomization (allocation ratio 1:1) was used in this single-blind study. LII and mandibular arch dimensions were measured on three-dimensional digital dental models at 2-week intervals. Results: No statistically significant difference was observed between NiTi and CuNiTi according to LII (p > 0.05). Intercanine and intermolar arch perimeters increased in the CuNiTi group (p < 0.001). Inter-first premolar width showed a statistically significant interaction in week ${\times}$ diameter ${\times}$ application (p < 0.05). Conclusions: The effects of NiTi and CuNiTi round archwires were similar in terms of their alignment efficiency. However, the intercanine and intermolar arch perimeters, and the inter-first premolar width changes differed between groups.

• Smart Structures and Systems
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• v.6 no.1
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• pp.73-85
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• 2010

The potential offered by the thermo-mechanical properties of shape memory alloys (SMA) in structural engineering applications has been the topic of many research studies during the last two decades. The main issues concern the long-term predictability of the material behaviour and the fatigue lifetime of the macro structural elements (as different from the one of wire segments). The laboratory tests reported in this paper are carried out on bar specimens and they were planned in order to pursue two objectives. First, the creep phenomenon is investigated for two different alloys, a classical Ni-Ti alloy and a Cu-based alloy. The attention is then focused on the Cu-based alloy only and its fatigue characteristics at given temperatures are investigated. Stress and thermal cycles are alternated to detect any path dependency.

• Electrical & Electronic Materials
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• v.6 no.5
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• pp.407-416
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• 1993

무산소동을 안정화 모재로한 Cu/Nb-Ti 빌렛트를 제작한 다음 간접 열간방식의 압출에 의해 얻어진 봉재를 인발한 후 신선과 열처리를 반복하여 단심 및 다심 Nb-Ti 초전도 선재를 제조하였다. 가공 조직을 조사한 결과, 단심 선재의 경우 Nb-Ti 심의 단면이 균일하게 가공된 것을 확인하였으며 다심선재의 경우는 신선가공에 의하여 다소 불균질한 필라멘트부분이 관찰되었다. 4.2K, 자장하에서 4단자법으로 직선형 단척시료의 임계전류를 측정하여 가공 열처리 조건에 따른 임계전류밀도의 자장특성을 조사하였는데 열처리시간을 길게하고 가공도를 높인 시료일수록 자장하의 임계전류밀도가 높게 나타나는 것을 확인하였다. 4.2K, 5T 자장하에서 각각 4 x $10^{5}$A/$cm^{2}$ 및 2 x $10^{5}$A/$cm^{2}$의 임계전류밀도를 나타내는 Nb-Ti 단심 및 다심 초전도선재를 제작 할 수 있었다.있었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.254.2-254.2
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• 2013

Cu wire 발열패드는 대중화된 히터로 많이 이용되지만 높은 소비전력(70 w이상)으로 에너지 효율을 중요시 하는 미래 소재로는 적합하지 않아 효율이 높은 발열 소재의 연구가 이루어지고 있다. 이에 본 실험에서 Graphite표면에 Amide 기능화를 유도된 Carbon nanotube (Electrical Conductivity $10^5$ s/cm, Thermal Conductivity >3,000 w/mk)를 분산 시켜, Graphite의 우수한 전기 전도도의 특성을 이용할 뿐만 아니라 Carbon nanotube의 접착 특성을 통해 물리적 특성을 향상시켜 면상발열체의 도막 특성 향상뿐만 아니라 효율적 발열을 유도 하고자 한다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.135-135
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• 2012

세계 환경유해물질 규제에 대응하여 반도체 substrate의 Pb-free solution의 일환으로 등장한 PPF (Pre-Plated Frame)는 패키지공정 조립성은 물론, 자동차 반도체와 같은 고 신뢰성 및 low cost 요구를 만족하기 위해 초박막 고품질의 도금층과 Sub-micro scale의 rough treatment 와 같은 미세 표면제어 기술, 그리고 Au wire로부터 Cu wire 로의 전환에 대응하는 최적화된 도금층 구조로 발전하고 있다. 이러한 기술적인 진화를 거듭해온 이 기술은 다양한 반도체 substrate에 광범위하게 사용될 수 있기 때문에 향후 PPF기술의 활용저변은 더욱 확대될 전망이다.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.53-58
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• 2008

In this study, we fabricated embedded IC (Double Pole Double throw switch chip) polymer substrate and evaluate it for 2.4 GHz WiFi application. The switch chips were laminated using FR4 and ABF(Ajinomoto build up film) as dielectric layer. The embedded DPDT chip substrate were interconnected by laser via and Cu pattern plating process. DSC(Differenntial Scanning Calorimetry) analysis and SEM image was employed to calculate the amount of curing and examine surface roughness for optimization of chip embedding process. ABF showed maximum peel strength with Cu layer when the procuring was $80\sim90%$ completed and DPDT chip was laminated in a polymer substrate without void. An embedded chip substrate and wire-bonded chip on substrate were designed and fabricated. The characteristics of two modules were measured by s-parameters (S11; return loss and S21; insertion loss). Insertion loss is less than 0.55 dB in two presented embedded chip board and wire-bonded chip board. Return loss of an embedded chip board is better than 25 dB up to 6 GHz frequency range, whereas return loss of wire-bonding chip board is worse than 20 dB above 2.4 GHz frequency.

• Journal of the Korean Society of Propulsion Engineers
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• v.4 no.4
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• pp.50-58
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• 2000

Burning rate of the matrix propellant($r_{sb}$) and burning rate along the metal wire($r_w$) were measured and analyzed for the HTPB/AP/Al propellant embedded with Ag wire($\phi$0.15mm) according to weight % of RDX(0~20%). Variation of burning rate increment ratio($r_w$/$r_{sb}$) and pressure exponent(n) was studied for the nitramine propellant having 10% RDX embedded with three kinds of metal(Ag, Cu, and Ni-Cr) of which diameter range is between 0.1~0.6mm. Maximum burning rate increment ratio of the nitramine propellant embedded with Ag wire($\phi$0.1mm) was 5.94 at $20^{\cire}C$, 1000 psia, 16.4% faster than that of HTPB/AP propellant, it is because that autoignition temperature of the nitramine propellant was higher than that of HTPB/AP propellant. Standard deviation of absolute ($r_{wc}$/$r_{we}$)/$r_{we}$ calculated by using new empiracal equation composed of four dimensionless groups, is 6.11% less than that calculated by using original empirical equation composed of three dimensionless group. The new empiracal equation is derived from Buckingham pi theorem using the parameters such as thermal diffusivity, melting temperature. wire diameter, propellant sample diameter, frame temperature, autoignition temperature and matrix burning rate which influence on $r_w$.

• 한국초전도학회:학술대회논문집
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• v.9
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• pp.129-132
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• 1999

A new single solution source MOCVD technique for the deposition of YBCO film has been developed, using a ultrasonic atomizer to feed the precursors into an evaporation zone. This method being investigated as a basis for future long wire fabrication, for example the electric power use, the magnatic applications, etc.. YBCO films were prepared on MgO(100) substrate, using mixture of Y, Ba, and Cu ${\beta}$ -diketonate chelate was dissolve in tetrahydrofuran as a solution sources. X-ray diffraction measurement indicated that the thin film grew epitaxially with the c-axis orientation perpandicular to the surface of the surface.