• Title/Summary/Keyword: Cu via

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Antimicrobial Evaluation and Characterization of Copper Nanoparticles Synthesized by the Simple Chemical Method

  • Wazir, Arshad Hussain;Khan, Qudratullah;Ahmad, Nisar;Ullah, Faizan;Quereshi, Imdadullah;Ali, Hazrat
    • Korean Journal of Materials Research
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    • v.32 no.2
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    • pp.80-84
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    • 2022
  • Copper nanoparticles (CuNPs) are considered of great importance due to their high catalytic and antimicrobial activities. This study focuses on the preparation and characterization of CuNPs, and on their antibacterial/antifungal activities. A copper salt (copper sulfate pentahydrate) as precursor, starch as stabilizing agent, and ascorbic acid as reducing agent were used to fabricate CuNPs. The resulting product was characterized via different techniques such as X-ray diffractrometry (XRD), Fourier Transform Infrared (FTIR) spectroscopy, and Scanning electron microscopy (SEM) to confirm its characteristic properties. Employing the Scherrer formula, the mean crystallite sizes of copper (Cu) and cuprous oxide (Cu2O) nanocrystals were found to be 29.21 and 25.33 nm, respectively, as measured from the main X-ray diffraction peaks. The functional groups present in the resulting CuNPs were confirmed by FTIR. In addition, the engineered CuNPs showed antibacterial and antifungal activity against tested pathogenic bacterial and fungal strains.

Blind Via Hole Drilling Using DPSS UV laser (DPSS UV 레이저를 이용한 블라인드 비아 홀 가공)

  • 김재구;장원석;신보성;장정원;황경현
    • Laser Solutions
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    • v.6 no.1
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    • pp.9-16
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    • 2003
  • Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.

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Characteristics of Bi-superconducting Thin Films Prepared by Co- and Layer-by-Layer Deposition

  • Yang, Sung-Ho;Park, Yong-Pil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.10a
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    • pp.40-44
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    • 2000
  • $Bi_2Sr_2Ca_nCu_{n+1}O_y$($n{\geq}0$; BSCCO)thin film is fabricated via two different processes using an ion beam sputtering method i.e. co-deposition and layer-by-layer deposition. A single phase of Bi2212 can be fabricated via the co-deposition process. While it cannot be obtained by the layer-by-layer process. Ultra-low growth rate in our ion beam sputtering system brings out the difference in Bi element adsorption between the two processes and results in only 30% adsorption against total incident Bi amount by layer-by-layer deposition, in contrast to enough Bi adsorption by co-deposition.

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Comparison between Bi-superconducting Thin Films Fabricated by Co-Deposition and Layer-by-Layer Deposition

  • Yang, Sung-Ho;Park, Yong-Pil
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.9
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    • pp.796-800
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    • 2000
  • Bi$_2$Sr$_2$Ca$_{n}$Cu$_{n+1}$ O$_{y}$(n$\geq$0; BSCCO) thin film is fabricated via two different processes using an ion beam sputtering method i.e. co-deposition and layer-by-layer deposition. A single phase of Bi2212 can be fabricated via the co-deposition process. While it cannot be obtained by the layer-by-layer process. Ultra-low growth rate in our ion beam sputtering system brings out the difference in Bi element adsorption between the two processes and results in only 30% adsorption against total incident Bi amount by layer-by-layer deposition, in contrast to enough Bi adsorption by co-deposition.on.n.

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Comparison between BSCCO Thin Films Fabricated by Co-Deposition and Layer-by-Layer Deposition

  • Lee, Hee-Kab;Park, Yong-Pil;Lee, Joon-Ung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.07a
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    • pp.230-234
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    • 2000
  • Bi$_2$Sr$_2$Ca$_{n}$Cu$_{n+1}$ O$_{y}$(n$\geq$0; BSCCO)thin film is fabricated via two different processes using an ion beam sputtering method i.e. co-deposition and layer-by-layer deposition. A single phase of Bi2212 can be fabricated via the co-deposition process. While it cannot be obtained by the layer-by-layer process. Ultra-law growth rate in our ion beam sputtering system brings out the difference in Bi element adsorption between the two processes and results in only 30% adsorption against total incident Bi amount by layer-by-layer deposition, in contrast to enough Bi adsorption by co-deposition.on.n.

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Study on the Effect of Alkylamines on Cu Electroplating (구리전해도금에서 알킬아민의 영향 연구)

  • Lee, Jaewon;Shin, Yeong Min;Bang, Daesuk;Cho, Sung Ki
    • Journal of the Korean Electrochemical Society
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    • v.25 no.2
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    • pp.81-87
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    • 2022
  • In this study, the effect of alkylamine on copper electroplating was analyzed using cyclic voltammetry. When water-soluble alkylamines were added to the plating solution, the reduction reaction of Cu2+ was inhibited. The inhibition effect of 1,12-diaminododecane has been investigated at various concentrations and conditions of the plating solution. 1,12-diaminododecane was protonated in the acidic plating solution, and therefore, it did not act as a complexing agent for Cu2+. Accordingly, it was confirmed that the inhibiton effect of 1,12-diaminododecane was attributed to adsorption on the Cu surface. The adsorption of 1,12-diaminododecane exhibits two characteristics: (i) protonation and subsequent electrostatic attraction with anions pre-adsorbed on Cu surface, and (ii) direct adsorption on Cu surface via amine functional group. The adsorbed 1,12-diaminododecane caused three-dimensional growth and grain refining, as well as the inhibition effect, during Cu electroplating.

Photoelectrochemical characterization of surface-modified CuInS2 nanorod arrays prepared via template-assisted growth and transfer

  • Yang, Wooseok;Kim, Jimin;Oh, Yunjung;Moon, Jooho
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.401-401
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    • 2016
  • Although vertically aligned one-dimensional (1D) structure has been considered as efficient forms for photoelectrode, development of efficient 1D nanostructured photocathode are still required. In this sense, we recently demonstrated a simple fabrication route for CuInS2 (CIS) nanorod arrays from aqueous solution by template-assisted growth-and-transfer method and their feasibility as a photoelectrode for water splitting. In this study, we further evaluated the photoelectrochemical properties surface-modified CIS nanorod arrays. Surface modification with CdS and ZnS was performed by successive ion layer adsorption and reaction (SILAR) method, which is well known as suitable technique for conformal coating throughout nanoporous structure. With surface modification of CdS and ZnS, both photoelectrochemical performance and stability of CuInS2 nanorod arrays were improved by shifting of the flat-band potential, which was analyzed both onset potential and Mott-schottky plot.

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Observation of Electrocatalytic Amplification of Iridium Oxide (IrOx) Single Nanoparticle Collision on Copper Ultramicroelectrodes

  • Choi, Yong Soo;Jung, Seung Yeon;Joo, Jin Woo;Kwon, Seong Jung
    • Bulletin of the Korean Chemical Society
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    • v.35 no.8
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    • pp.2519-2522
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    • 2014
  • Recently, the observation of the electrocatalytic behavior of individual nanoparticles (NPs) by electrochemical amplification method has been reported. For example, the Iridium oxide ($IrO_x$) NP collision on the Pt UME was observed via electrocatalytic water oxidation. However, the bare Pt UME had poor reproducibility for the observation of NP collision signal and required an inconvenient surface pre-treatment for the usage. In this manuscript, we has been investigated other metal electrode such as Cu UME for the reproducible data analysis and convenient use. The $IrO_x$ NP collision was successively observed on the bare Cu UME and the reproducibility in collision frequency was improved comparing with previous case using the $NaBH_4$ pre-treated Pt UME. Also, the adhesion coefficient between NP and the Cu UME was studied for better understanding of the single NP collision system.

In-Situ Measurement of Densification Behavior of Nano Cu Powders during Sintering (In-Situ 측정에 의한 나노 Cu 분말의 소결 공정 시 치밀화 거동)

  • Yoon, S.C.;Bok, C.H.;Kwak, E.J.;Rhee, C.K.;Kim, H.S.
    • Transactions of Materials Processing
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    • v.16 no.3 s.93
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    • pp.210-214
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    • 2007
  • Manufacturing bulk nanostructured materials with least grain growth from initial powders is challenging because of the bottle neck of bottom-up methods using the conventional powder metallurgy via compaction and sintering. In the study, densification behavior of nano Cu powders during pressureless sintering was investigated using an in-situ optical dilatometer technique. The initial heating and steady temperature stages during the sintering of nano Cu powder compacts were observed. At the initial heating stage, the powder compact has many porosities and full densification needs high temperature and/or high pressure sintering. In the experimental analysis, changes in geometry and density were measured and discussed for optimal consolidation and densification by the in-situ optical dilatometer.

Cytotoxicity of Environmental Estrogenic Compound, Bisphenol A, via Generation of Free Radicals (내분비계 장애물질인 Bisphenol A의 free radical 생성을 통한 독성발현)

  • 안광현;김봉희
    • Environmental Analysis Health and Toxicology
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    • v.18 no.3
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    • pp.175-182
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    • 2003
  • Bisphenol A shares similarities in structure, metabolism and action with DES, a known human teratogen and carcinogen. Bisphenol A, a monomer of polycarbonate and epoxy resins, has been detected in canned food and human saliva. The purpose of the this study was to evaluate the cytotoxicity, cell proliferation of bisphenol A In the presence of a rat liver S9 mix, contaning cytochrome P450 enzymes, and Cu (II). In the present study, Bisphenol A in combination with Cu (II) exhibited a enhancement in cytotoxicity which were inhibited by free radical scavengers. The content of malondialdehyde, an end product of lipid peroxidation, was also found to increase with concentration of bisphenol A. Also, we examined the change of CuZn-SOD, Mn-SOD, catalase and GPx activities in the MCF-7 cells exposed to bisphenol A. The activities of CuZn-SOD, CPx, catalase were found to decrease with bisphenol A concentration. Meanwhile, the activity of Mn-SOD was unchanged. This indicated that elevated oxidative stress caused by imbalance between the production and removal of free radicals occurred in cells.