• Journal of the Korean Applied Science and Technology
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• v.32 no.1
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• pp.78-84
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• 2015

The purpose of this study is to evaluate the removal efficiency of phosphorus from synthetic waste water by reduction and oxidation reaction of Cu-Zn metal alloy. Cu-Zn metal alloy applied in this study is composed of 40% of Zn and 60% of Cu, which is so called Muntz metal. And the fibrous type of metal alloy has approximately $200{\mu}m$ of thickness. Metal is oxidized in an aqueous solution to generate electron and metal ion. The mechanism of phosphate treatment is co-precipitation of metal ion and phosphorous ion at various pH and temperature. The treatment efficiency showed the maximum at a one cycle treatment. This result means that the surface area of reaction material is sufficient enough to get reaction equilibrium. Experiment is conducted at various pH from 5 to 9, and showed the maximum efficiency at pH 8. Phosphorous is dominated as a type of $H_2PO_4{^-}$ and $HPO_4{^{2-}}$ at this pH condition. We could not consider the temperature effect independently, because phosphorous removal efficiency showed such a complex mechanism. We could get high efficiency at lower temperature in this research.

• Journal of Navigation and Port Research
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• v.39 no.4
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• pp.335-344
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• 2015

This study aims to assess the effectiveness of zeolite, montmorillonite, and steel slag as capping materials to block the release of heavy metals from marine sediment depending on their depths. The results showed that all capping materials used this study were not effective in interrupting release of As. Zeolite had negative effect on the block of Cr release but it was significantly reduced to 5 cm by montmorillonite capping. In contrast to As and Cr, Cd, Ni, and Pb were not released even from uncapped sediments. Cu and Zn were the heavy metals those were most significantly influenced by the capping conditions. Cu release from marine sediments were effectively blocked by more than 1 cm depth of montmorillonite and more than 3 cm depth of zeolite. All capping materials were found to be effective in interrupting release of Zn from marine sediments. It was concluded that the zeolite, montmorillonite, and steel slag could be used as a potential capping material for interrupting the release of Cr, Cu, and Zn from the contaminated marine sediments.

• 한국초전도학회:학술대회논문집
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• v.14
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• pp.95-95
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• 2004

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.224-227
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• 2003

The longitudinal thermosonic bonding method is investigated in this work for its application to the soldering process for electronic packaging. The effect of the ultrasonic is analyzed through lumped modeling, and the material properties of a viscoelastic model are measured experimentally. The thermosonic bonding method is verified by inserting the Cu pin and Au bump into solder block. As the solder thickness decreases, temperature of the solder is calculated to increase rapidly because of larger strain. Localized heating due to ultrasonic vibration is observed to melt the solder near the pin, which is adequate to the high density electronic package and Pb-free solder having high melting temperature.

• Journal of Electrical Engineering and information Science
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• v.2 no.3
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• pp.77-81
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• 1997

In his work, the influence of wire type conducting particles on the insulation reliability of GIS has been systematically investigated when the epoxy resin based dielectric coating was made on he inner side of outer electrode. For this purpose, coaxial cylinder-type electrode was adopted in 362 kV chamber and various sizes of Cu conducting particle were used under different gas pressures. In order to elucidate the coating effect on the gas insulation, different thickness of dielectric coating has been considered and then the lift-off voltage and flashover voltages have been measured. The results shown that the dielectric coating has a remarkable influence by restraining the movement of particle in GIS system, and thus GIS insulation reliability is noticeably improved.

• Journal of Powder Materials
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• v.3 no.1
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• pp.13-24
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• 1996

Two grades of Permalloy strips, Fe-45Ni(PB) and Fe-78Ni-4Mo-5Cu(PC) were fabricated by powder rolling process from elemental powder mixtures. The roll compacted green strips were sintered, homogenized, cold rolled with or without an intermediate annealing and finally heat treated to measure magnetic properties. For a given thickness reduction, rolling with an intermediate annealing was found more effective to achieve a full densification with no visible micropores and also to obtain better magnetic properties. Increasing the final rolling reduction also produced a marked improvement of the magnetic properties whereas the cooling rate during the final heat treatment has little effect in both grades. Addition of a small amount, 0.4% Mn slightly degraded the properties. As an overall, The PM strips produced via powder rolling yielded the similar soft magnetic properties to the corresponding commercial grades produced via wrought processing.

• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.77-85
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• 2004

To evaluate the effect of plasma cleaning on the soldering reliability the plasma cleaning using Ar-10vol%$H_2$ gas was applied on a UBM(Under Bump Metallization). The UBM consisted of Au/ Cu/ Ni/ Al layers which were deposited on a Si-wafer with 20 nm/ 4 $\mu\textrm{m}$/ 4 $\mu\textrm{m}$/ 0.4 $\mu\textrm{m}$ thickness respectively. Sn-3.5%Ag, Sn-3.5%Ag-0.7%Cu and Sn-37%Pb solder balls sized of 500 $\mu\textrm{m}$ in diameter were used. Solder balls on the UBM were plasma reflowed under Ar-10%$H_2$ plasma (with or without plasma cleaning). They were compared with air reflowed solder balls with flux. The spreading ratios of plasma reflowed solder with plasma cleaning was 20-40% higher than that of plasma reflowed solder without plasma cleaning. The shear strength of plasma reflowed solder with plasma cleaning was about 58-65MPa. It showed 60-80% higher than that of plasma reflowed solder without plasma cleaning and 15-35% higher than that of air reflowed solder. Thus it was believed that plasma cleaning for the UBM using Ar-10vol%$H_2$ gas was considerably effective for the improvement of the strength of solder ball.

• Proceedings of the Safety Management and Science Conference
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• 1999.11a
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• pp.543-563
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• 1999

For hazardous air pollutants(HAP) such as NO and $NO_2$ decomposition efficiency, power consumption, and applied voltage were investigated by SPCP(surface induced discharge plasma chemical processing) reactor to obtain optimum process variables and maximum decomposition efficiencies. Decomposition efficiency of HAP with various electric frequencies(5~50 kHz), flow rates(100~1,000 mL/min) initial concentrations(100~1,000 ppm), electrode materials(W, Cu, Al), electrode thickness(1, 2, 3 mm) and number of electrode windings(7, 9, 11) were measured. Experimental results showed that for the frequency of 10 kHz, the highest decomposition efficiency of 94.3% for NO and 84.7% for $NO_2$ were observed at the poser consumptions of 19.8 and 29W respectively and that decomposition efficiency decreased with increasing frequency above 20 kHz. Decomposition efficiency was increased with increasing residence times and with decreasing initial concentration of pollutants. Decomposition efficiency was increased with increasing thickness of discharge electrode and the highest decomposition efficiency was obtained for the electrode diameter of 3mm in this experiment. As the electrode material, decomposition efficiency was in order : tungsten(W), copper(Cu), aluminum(Al).

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.57-64
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• 2012

Ball shear test was performed by test variables such as loading speed and annealing time in order to investigate the effect of surface finishes on the bonding strength of Sn-1.2Ag-0.7Cu-0.4In Pb-free solder. The shear strength increased and the ductility decreased with increasing shear speed. With increasing shear speed, the electroless nickel immersion gold (ENIG) finish showed dominant brittle fracture mode, while organic solderability preservative (OSP) finish showed pad open fracture mode. The shear strength and toughness for both surface finishes decreased with increasing annealing time under the high-speed shear test of 500 mm/s. Typically, the thickness of intermetallic compound increased with increasing annealing time, which means that exposure of brittle fracture became much easier. With increasing annealing time, the both ENIG and OSP finishes exhibited the pad open fracture mode. Overall, ENIG finish showed higher shear strength rather than OSP finish due to its superior barrier stability.