• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.29-33
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• 2011

Research about the geometry design of lead pin was carried based on the normal or shear stress of the interface between a lead pin and a PCB in terms of delamination failure. The taguchi method with four design factors of three levels and FEA(Finite element Analysis) are carried under $20^{\circ}$ bending and 50 ${\mu}m$ tension of lead pin. The contact width, d2, between head round and copper pad in PCB is the highest affection factor among design factors by analysis of contribution analysis. Equivalent von Mises stress of 18.7% reduction design is obtained by the parameter design of the taguchi method. Maximum normal stress occurred at contact position between solder outer surface and a Cu pad in PCB. Also, maximum shear stress happened at contact position between solder outer surface and SR layer of PCB. From these calculated results, delamination of the PGA package may be occurred from outer interface of solder to inner interface of solder.

• Journal of Plant Biotechnology
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• v.30 no.4
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• pp.399-403
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• 2003

In order to understand the protection effects of antioxidant enzymes against oxidative stress caused by various environmental stresses, transgenic tobacco (Nicotiana tabacum cv, Xanthi) plants expressing both copper/zinc superoxide dismutase (CuZnSOD) and ascorbate peroxidase (APX) in chloroplasts (referred to as CA plants) were subjected to highlight (1,100$\mu$mol m$^{-2}$ sec$^{-1}$) and chilling at 4$^{\circ}C$. The protection effects of CA plants using leaf discs were compared with those of transgenic plants expressing either CuZnSOD or APX in chloroplasts (SOD plants or APX plants, respectively) and non-transgenic (NT) plants. CA plants showed about 15％ protection in the photosynthetic efficiency (Fv/Fm) of photosystem II relative to NT plants 1 hr after treatment of both highlight and chilling, whereas they showed about 23％ protection in the redox state of P700 in photosystem I at 3 hr after treatment. SOD plants or APX plants showed an intermediate protection effect between CA plants and NT plants. These results demonstrated that the coexpression of CuZnSOD and APX in chloroplasts importantly involves in the protection effects against oxidative stress caused by various environmental stresses.

• Applied Chemistry for Engineering
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• v.23 no.3
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• pp.313-319
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• 2012

In this work, the electroplating of copper was introduced on PAN-based carbon fibers for the enhancement of mechanical interfacial strength of carbon fibers-reinforced composites. The surface properties of carbon fibers were determined by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and contact angle measurements. Its mechanical interfacial properties of the composites were studied by interlaminar shear strength (ILSS) and critical stress intensity factor ($K_{IC}$). From the results, it was found that the mechanical interfacial properties of Cu-plated carbon fibers-reinforced composites (Cu-CFRPs) enhanced with increasing the Cu plating time, Cu content and COOH group up to Cu-CFRP-30. However, the mechanical interfacial properties of the Cu-CFRPs decreased dramatically in the excessively Cu-plated CFRPs sample. In conclusion, the presence of Cu particles on carbon fiber surfaces can be a key factor to determine the mechanical interfacial properties of the Cu-CFRPs, but the excessive Cu content can lead the failure due to the interfacial separation between fibers and matrices in this system.

• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05b
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• pp.126-126
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• 1992

Solid and liquid sintering behaviors of mechanically alloyed 75W-25Cu powders have been studied by using a dilatometry technique. The sintering was performed under hydrogen atmosphere of 1 atm with a heating rate of 3 $^{\circ}C$/min. The mechanically alloyed 75W-25Cu powders were prepared by high energy ball milling process under argon atmosphere of 1 atm with alloying times of 0 to 400 h. To compare with the sintering behaviors of mechanically alloyed powders, pure Cu and W powders were also sintered under the above conditions, As the mechanical alloying time increased from 0 to 400 h, the shrinkage behavior of the alloyed powders was enhanced during the sintering, and staring temperature of liquid sintering decreased from 1083 to 1068 $^{\circ}C$. The saturation temperature, above which the shrinkage was completed, of liquid phase sintering decreased from 1248 to 1148 $^{\circ}C$ with increasing mechanical alloying time from 200 to 400 h. The residual stress of the mechanically alloyed powder was measured by X-raydiffractometer. The microstructure of sintered spcimen was observed by optical and scanning electron microscope. From these results, variations of solid and liquid sintering behaviors with mechanical alloying time were discussed in terms of the amount of residual stress and the distribution of W and Cu powders in the mechanically alloyed powder.

• Korean Journal of Materials Research
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• v.27 no.3
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• pp.172-178
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• 2017

The aim of this study is to consider the effect hydrogen on dezincification behavior of Cu-Zn alloys. The investigations include microstructural observations with scanning electron microscope and chemical composition analysis with energy dispersive spectrometer. The dezincification layer was found to occur in high pressure hydrogen atmosphere, not in air atmosphere. In addition, the layers penetrated into the inner side along the grain boundaries in the case of hydrogen condition. The shape of the dezincification layers was porous because of Zn dissolution from the ${\alpha}$ or ${\beta}$ phase. In the case of stress corrosion cracks formed in the Cu-Zn microstructure, the dezincification phenomenon with porous voids was also accompanied by grain boundary cracking.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.342-347
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• 2004

The deformation behavior of a $Zr_{55}Al_{10}Ni_5Cu_{30}$ bulk metallic glass under tensile loading at different range of strain rates and temperatures between 680 K and 740 K were investigated. The variation in the deformation behavior of $Zr_{55}Al_{10}Ni_5Cu_{30}$ bulk metallic glass which resulted from the crystallization induced during testing was reported. The$Zr_{55}Al_{10}Ni_5Cu_{30}$ bulk metallic glass has showed either homogeneous or inhomogeneous deformation depending on test condition. It exhibited a maximum elongation of about 560 % at the condition of $407^{\circ}C{\times}\;10^{-4}/s$. The flow behavior exhibited three different types and the flow stress became lower at higher temperatures and lower strain rates. The increase of the time elapsed during heating resulted in the partial crystallization of bulk metallic glass phase and eventually strain hardening and brittle fracture.

• Plant Resources
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• v.8 no.1
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• pp.52-59
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• 2005

A cDNA, PSOD1, encoding cytosolic copper/zinc superoxide dismutase (CuZn-SOD) was cloned and characterized from a full length cDNA library prepared from Populus alba${\times}$Populus glandulosa cultured in vitro. A PSOD1, is 725 nucleotides long and has an open reading frame of 459 bp with 152 amino acid residues (pI 5.43). The deduced amino acid sequence of PSOD1 perfect matched to the previously reported CuZn-SOD (CAC33845.1). Consensus amino acid residues (His-45, -47, -62, -70, -79, -119) were involved in Cu-, Cu/Zn-, and Zn- binding ligands. The deduced amino acid sequence of PSOD1 exhibited the high level of similarity from 100 to $85\%$ among previously registered SOD genes. The expression of PSOD1 in poplar increased at the 1 mM $H_{2}O_2$ and drought stress during 30 min and 60 min, but the ozone treated poplar increased at 30 min in the early time and then decreased at 60 min.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.139-140
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• 2002

This paper discusses the effect of plating condition on the mechanical property of electroplated Cu film. Current density, the amount of the organic additives was found to affect the residual stress of electroplated copper film. The result show that, in the case of residual stress, the copper film deposited at higher additive result in lower residual stress and plating current by $15mA/cm^2$ induced a better result than any other ones.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.57 no.3
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• pp.332-337
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• 2008

We analyzed carbonization pattern and crystal structure of polyvinyl chloride wire by thermal stress. Copper that is oxidized at normal temperature is a reddish brown. If under the thermal stress range of 500 to 700 [$^{\circ}C$], carbonization and exfoliation occurrence. Section structure of electric wire is same as arrangement of particle in metallograph analysis. But, as thermal stress increases, size of particle is enlarged. Electric wire displays elongation structure in SEM image analysis and elongation structure collapses when receive thermal stress at 300 [$^{\circ}C$]. In EDX analysis, we get the spectra of CuL, CuK, OK, and ClK. FT-IR analysis was shown new spectra with in range of $1,440{\sim}1,430\;[cm^{-1}]$, 1,340 [$cm^{-1}$], 1,240 [$cm^{-1}$].

• Korean Journal of Materials Research
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• v.5 no.4
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• pp.468-475
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• 1995

활성금속 브레이징 방법으로 스테인레스 스틸과 질화규소를 접합하여 기계적 특성 및 유한요소법을 사용하여 접합체에서 발생되는 잔류응력의 크기를 조사하였다. 고강도 접합체를 제조하기 위하여 연성금속인 Cu 및 Cu/Mo 적층체를 중간재로 사용하였으며, 중간재의 두께 및 구조에 따라 접합체에서 발생되는 잔류응력의 크기 및 분포가 접합강도에 미치는 영향에 관하여 조사하였다.중간재인 Cu의 두께가 0.2mm 일대 세라믹스에 발생되는 최대 잔류응력의 크기가 급격히 감소하였으며, 최대 접합강도가 나타났다. Cu/Mo 다층 중간재를 사용한 접합체에서는 Cu/Mo 두께비가 감소할수록 접합강도는 증가되었다. 스테인레스 스틸/질화규소 접합체에서 Cu/Mo 중간재의 사용은 Cu 중간재 사용보다 접합강도를 증가시키는데 효과적이었으며, 최대 접합강도는 450Mpa 정도이었다. Cu/Mo 중간재를 사용한 접합체에서는 Mo에 최대 인장방향의 잔류응력이 발생하여 강도 측정시 Mo의 지배적인 소성변형으로 잔류응력이 감소되어 접합체의 접합강도를 향상시키는 것으로 생각된다.