• 마이크로전자및패키징학회지
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• 제21권4호
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• pp.57-62
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• 2014

미래형 유연소자 개발 시 비용감소 및 공정적합성 개선을 위해 동박을 잉크젯 프린팅법을 이용해 공중합체 유연기판 상 형성하고, 전기적 특성에 열처리 분위기가 미치는 영향을 확인하기 위해 3 종류의 환원분위기에서 열처리를 진행하여 보았다. 그 결과 200도의 낮은 온도에서 환원 특성이 뛰어난 포름산 분위기에서 전도체 수준의 비저항은 얻을 수 있었으나, 열처리 시 발생하는 응력으로 인해 발생된 표면균열에 기인해 그 값이 기존 동박에 비해 매우 높았다. 이에 비정질재료에서 응용되는 응력해소법을 응용하여 표면균열을 억제한 결과 230도 열처리 시 기존 열처리 방법에서는 $7.4{\mu}{\Omega}cm$의 비저항을 보이나, 응력해소를 통한 표면 균열이 억제된 시편에서는 $3.4{\mu}{\Omega}cm$의 비저항 값을 얻을 수 있었다. 특히 등온열처리에 의한 응력해소 효과를 확인하기 위해 동일 온도에서 등온시간 없이 열처리를 진행한 결과, 표면균열이 억제되지 못함을 확인할 수 있었다.

• Journal of Photoscience
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• 제8권1호
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• pp.13-17
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• 2001

Cucumber leaves subjected to light chilling stress exhibit a preferential inactivation of photosystem(PS) I relative to PSII, resulting in the photoinhibition of photosynthesis. In light chilled cucumber leaves, Cu/Zn-Superoxide dismutase(SOD) is regarded as a primary target of the light chilling stress and its inactivation is closely related to the increased production of reactive oxygen species. In the present study, we further explored that inactivation of PSI in cucumber leaves is not a light chilling specific, but general to various oxidative stresses. Oxidative stress in cucumber leaves was induced by treatment of methylviologen(MV), a producer of reactive oxygen species in chloroplasts. MV treatment decreased the maximal photosynthetic O$_2$ evolution, resulting in the photoinhibition of photosynthesis. The photoinhibition of photosynthesis was attributable to the decline in PSI functionality determined in vivo by monitoring absorption changes around 820 nm. In addition, MV treatment inactivated both antioxidant enzymes Cu-Zn-superoxide dismutase and ascorbate peroxidase known sensitive to reactive oxygen species. From these results, we suggest that chloroplast antioxidant enzymes are the primary targets of photooxidative stress, followed by subsequent inactivation of PSI.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1999년도 춘계학술대회논문집
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• pp.163-170
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• 1999

Although the bulge forming technique is currently employed in commercial superplastic forming processes, the uniaxial tensile test is still the most commonly used method for the evaluation of the superplasticity of materials due to its simplicity in testing. However, the results obtained from the uniaxial tensile test can not be applied in analyzing the characteristics of the real parts formed in multi-axial stress state. In this paper, using the tensile test specimen obtained from the square cup manufactured by superplastic forming, tensile strength and elongation have been investigated according to the strain and cavity volume fraction. From the result of experiment, tensile strength and elongation are decreased according to the strain and cavity in Al-6%Cu-0.4%Zr alloy. On condition of uniaxial stress, cavity volume fraction is increased on linear according to the increasement of thickness strain. However, on condition of biaxial stress there are critical point( E t=1.5-1.6) that the slope, the ratio of cavity volume fraction and strain, have been changed. Therefore, cavity volume fraction is different with respect to stress condition, although the same strain.

• 마이크로전자및패키징학회지
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• 제17권1호
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• pp.69-73
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• 2010

Through-silicon-via (TSV)를 포함하고 있는 3차원 적층 반도체 패키지에서 구조적 변수에 따른 열응력의 변화를 살펴보기 위하여 유한요소해석을 수행하였다. 이를 통하여 TSV를 포함하고 있는 3차원 적층 반도체 패키지에서 웨이퍼 간 접합부의 지름, TSV 지름, TSV 높이, pitch 변화에 따른 열응력의 변화를 예측하였다. 최대 von Mises 응력은 TSV의 가장 위 부분과 Cu 접합부, Si, underfill 계면에서 나타났다. TSV 지름이 증가할 때, TSV의 가장 위 부분에서의 von Mises 응력은 증가하였다. Cu 접합부 지름이 증가할 때, Si과 Si 사이의 Cu 접합부가 Si, underfill과 만나는 부분에서 von Mises 응력이 증가하였다. Pitch가 증가할 때에도, Si과 Si 사이의 Cu 접합부가 Si, underfill과 만나는 부분에서 von Mises 응력이 증가하였다. 한편, TSV 높이는 von Mises 응력에 크게 영향을 미치지 못하였다. 따라서 TSV 지름이 작을수록, 그리고 pitch가 작을수록 기계적 신뢰성은 향상되는 것으로 판단된다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.377-381
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• 2004

Electrical conductivity of Al-Si-Cu-Mg alloy foams of various density produced in powder metallurgical method has been measured using two probe electrical conductivity measurement method. Compressive mechanical properties such as elastic modulus and plastic plateau stress of foams were evaluated from electrical conductivity using power law relation and scaling laws of foam properties. Uni-axial compression test was also performed. Experimentally measured elastic modulus and plastic plateau stress were compared with the values evaluated from electrical conductivity. The computed values were in good agreement with the experimental result.

• 대한기계학회논문집
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• 제16권2호
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• pp.400-408
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• 1992

In this paper, analysis of temperature and stress distributions in the roll for a twin roll continuous casting process was carried out. Firstly, several state equations were set up to determine the temperature distribution in the roll using finite difference method. Secondly, thermal stress in the roll was calculated numerically. Also, stress distribution due to the roll pressure was calculated to determine the effect of the roll pressure. For analysis of temperature distributions and the stress states of the roll, there are three kinds of roll materials, 2ICrMoV5. 11, CuCo/NiBe, CuCrZr and three types of cooling system were used.

• 한국재료학회지
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• 제33권4호
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• pp.142-150
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• 2023

AZO/Cu/AZO thin films were deposited on glass by RF magnetron sputtering. The specimens showed the preferred orientation of (0002) AZO and (111) Cu. The Cu crystal sizes increased from about 3.7 nm to about 8.5 nm with increasing Cu thickness, and from about 6.3 nm to about 9.5 nm with increasing heat treatment temperatures. The sizes of AZO crystals were almost independent of the Cu thickness, and increased slightly with heat treatment temperature. The residual stress of AZO after heat treatment also increased compressively from -4.6 GPa to -5.6 GPa with increasing heat treatment temperature. The increase in crystal size resulted from grain growth, and the increase in stress resulted from the decrease in defects that accompanied grain growth, and the thermal stress during cooling from heat treatment temperature to room temperature. From the PL spectra, the decrease in defects during heat treatment resulted in the increased intensity. The electrical resistivities of the 4 nm Cu film were 5.9×10^-4 Ω·cm and about 1.0×10^-4 Ω·cm for thicker Cu films. The resistivity decreased as the temperature of heat treatment increased. As the Cu thickness increased, an increase in carrier concentration resulted, as the fraction of AZO/Cu/AZO metal film increased. And the increase in carrier concentration with increasing heat treatment temperature might result from the diffusion of Cu ions into AZO. Transmittance decreased with increasing Cu thicknesses, and reached a maximum near the 500 nm wavelength after being heat treated at 200 ℃.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.25-30
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• 2003

The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film/substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 ${\mu}m$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.256-259
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• 2008

An micro-probe tip must be manufactured using thin film to evaluate integrity of the semiconductor with narrow distance between pads. In this study, fatigue tests were performed for BeCu thin film which is used in micro-probe tip of semiconductor test machine. The thin film was manufactured by electro plating process, and the specimens were fabricated by wire-cut electric discharge method to make hour glass type specimen of $5000{\mu}m$ width, $29200{\mu}m$ length and $30{\mu}m$ thickness. The fatigue test of load control with 10Hz frequency was performed, in ambient environment. The fatigue cycles were tension-tension with mean stress, at stress ratio, R=0.1.

• 대한기계학회논문집A
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• 제24권3호
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• pp.761-768
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• 2000

In order to investigate how the fatigue damage effects on the critical properties of superconductor, a fatigue test at room temperature and an Ic measurement test at 4.2K were carried out in this study, respectively, using a 9 strand Cu-Ni/NbTi/Cu composite cable. Through the fatigue test of a 9 strand Cu-NUNbTi/Cu composite cable, a conventional S-N curve was plotted even though there was a possibility of fretting among strands. It was found that the maximum stress corresponding to the inflection point on the S-N curve obtained was nearly the same value as the yielding strength of cable obtained from the static tensile test. However, the effect of cabling in multi-strands superconducting cable on the fatigue strength was not noticeable. The critical current(Ic) measurement was carried out at 4.2K in a NbTi strand out of the fatigued cable. It showed a degradation of lc at high stress amplitude regions over 380NTa, and the degradation became significant as the applied stress amplitude increased.