• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.57-62
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• 2014

Using flexible bismaleimide-triazine co-polymer as a substrate, inkjet-printed Cu films were also investigated for low-cost and process feasibility of flexible electronics. After annealing at $200^{\circ}C$ for 1 h under various reducing ambient, surface color was changed to red and electrical resistivity was decreased to the level of conductor under formic acid ambient. However, its resistivity was much higher than conventional copper films due to surface crack. In order to reduce the residual film stress after annealing, additional isothermal treatment was inserted before anneal hiring the stress relaxation applied in processes of amorphous materials. As a result, no surface crack was observed and electrical resistivity of $3.4{\mu}{\Omega}cm$ was measured after annealing at $230^{\circ}C$ with stress relaxation while electrical resistivity of $7.4{\mu}{\Omega}cm$ was observed after normal annealing without relaxation. The effect of stress relaxation was also confirmed by observing surface crack after decreasing the relaxation time to 0 min.

• Journal of Photoscience
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• v.8 no.1
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• pp.13-17
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• 2001

Cucumber leaves subjected to light chilling stress exhibit a preferential inactivation of photosystem(PS) I relative to PSII, resulting in the photoinhibition of photosynthesis. In light chilled cucumber leaves, Cu/Zn-Superoxide dismutase(SOD) is regarded as a primary target of the light chilling stress and its inactivation is closely related to the increased production of reactive oxygen species. In the present study, we further explored that inactivation of PSI in cucumber leaves is not a light chilling specific, but general to various oxidative stresses. Oxidative stress in cucumber leaves was induced by treatment of methylviologen(MV), a producer of reactive oxygen species in chloroplasts. MV treatment decreased the maximal photosynthetic O$_2$ evolution, resulting in the photoinhibition of photosynthesis. The photoinhibition of photosynthesis was attributable to the decline in PSI functionality determined in vivo by monitoring absorption changes around 820 nm. In addition, MV treatment inactivated both antioxidant enzymes Cu-Zn-superoxide dismutase and ascorbate peroxidase known sensitive to reactive oxygen species. From these results, we suggest that chloroplast antioxidant enzymes are the primary targets of photooxidative stress, followed by subsequent inactivation of PSI.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.03b
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• pp.163-170
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• 1999

Although the bulge forming technique is currently employed in commercial superplastic forming processes, the uniaxial tensile test is still the most commonly used method for the evaluation of the superplasticity of materials due to its simplicity in testing. However, the results obtained from the uniaxial tensile test can not be applied in analyzing the characteristics of the real parts formed in multi-axial stress state. In this paper, using the tensile test specimen obtained from the square cup manufactured by superplastic forming, tensile strength and elongation have been investigated according to the strain and cavity volume fraction. From the result of experiment, tensile strength and elongation are decreased according to the strain and cavity in Al-6%Cu-0.4%Zr alloy. On condition of uniaxial stress, cavity volume fraction is increased on linear according to the increasement of thickness strain. However, on condition of biaxial stress there are critical point( E t=1.5-1.6) that the slope, the ratio of cavity volume fraction and strain, have been changed. Therefore, cavity volume fraction is different with respect to stress condition, although the same strain.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.69-73
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• 2010

Finite-element analyses were conducted to investigate the thermal stress in 3-dimensional stacked wafers package containing through-silicon-via (TSV), which is being widely used for 3-Dimensional integration. With finite element method (FEM), thermal stress was analyzed with the variation of TSV diameter, bonding diameter, pitch and TSV height. It was revealed that the maximum von Mises stresses occurred at the edge of top interface between Cu TSV and Si and the Si to Si bonding site. As TSV diameter increased, the von Mises stress at the edge of TSV increased. As bonding diameter increased, the von Mises stress at Si to Si bonding site increased. As pitch increased, the von Mises stress at Si to Si bonding site increased. The TSV height did not affect the von Mises stress. Therefore, it is expected that smaller Cu TSV diameter and pitch will ensure mechanical reliability because of the smaller chance of plastic deformation and crack initiation.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.377-381
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• 2004

Electrical conductivity of Al-Si-Cu-Mg alloy foams of various density produced in powder metallurgical method has been measured using two probe electrical conductivity measurement method. Compressive mechanical properties such as elastic modulus and plastic plateau stress of foams were evaluated from electrical conductivity using power law relation and scaling laws of foam properties. Uni-axial compression test was also performed. Experimentally measured elastic modulus and plastic plateau stress were compared with the values evaluated from electrical conductivity. The computed values were in good agreement with the experimental result.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.2
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• pp.400-408
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• 1992

In this paper, analysis of temperature and stress distributions in the roll for a twin roll continuous casting process was carried out. Firstly, several state equations were set up to determine the temperature distribution in the roll using finite difference method. Secondly, thermal stress in the roll was calculated numerically. Also, stress distribution due to the roll pressure was calculated to determine the effect of the roll pressure. For analysis of temperature distributions and the stress states of the roll, there are three kinds of roll materials, 2ICrMoV5. 11, CuCo/NiBe, CuCrZr and three types of cooling system were used.

• Korean Journal of Materials Research
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• v.33 no.4
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• pp.142-150
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• 2023

AZO/Cu/AZO thin films were deposited on glass by RF magnetron sputtering. The specimens showed the preferred orientation of (0002) AZO and (111) Cu. The Cu crystal sizes increased from about 3.7 nm to about 8.5 nm with increasing Cu thickness, and from about 6.3 nm to about 9.5 nm with increasing heat treatment temperatures. The sizes of AZO crystals were almost independent of the Cu thickness, and increased slightly with heat treatment temperature. The residual stress of AZO after heat treatment also increased compressively from -4.6 GPa to -5.6 GPa with increasing heat treatment temperature. The increase in crystal size resulted from grain growth, and the increase in stress resulted from the decrease in defects that accompanied grain growth, and the thermal stress during cooling from heat treatment temperature to room temperature. From the PL spectra, the decrease in defects during heat treatment resulted in the increased intensity. The electrical resistivities of the 4 nm Cu film were 5.9×10^-4 Ω·cm and about 1.0×10^-4 Ω·cm for thicker Cu films. The resistivity decreased as the temperature of heat treatment increased. As the Cu thickness increased, an increase in carrier concentration resulted, as the fraction of AZO/Cu/AZO metal film increased. And the increase in carrier concentration with increasing heat treatment temperature might result from the diffusion of Cu ions into AZO. Transmittance decreased with increasing Cu thicknesses, and reached a maximum near the 500 nm wavelength after being heat treated at 200 ℃.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.25-30
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• 2003

The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film/substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 ${\mu}m$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.256-259
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• 2008

An micro-probe tip must be manufactured using thin film to evaluate integrity of the semiconductor with narrow distance between pads. In this study, fatigue tests were performed for BeCu thin film which is used in micro-probe tip of semiconductor test machine. The thin film was manufactured by electro plating process, and the specimens were fabricated by wire-cut electric discharge method to make hour glass type specimen of $5000{\mu}m$ width, $29200{\mu}m$ length and $30{\mu}m$ thickness. The fatigue test of load control with 10Hz frequency was performed, in ambient environment. The fatigue cycles were tension-tension with mean stress, at stress ratio, R=0.1.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.3 s.174
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• pp.761-768
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• 2000

In order to investigate how the fatigue damage effects on the critical properties of superconductor, a fatigue test at room temperature and an Ic measurement test at 4.2K were carried out in this study, respectively, using a 9 strand Cu-Ni/NbTi/Cu composite cable. Through the fatigue test of a 9 strand Cu-NUNbTi/Cu composite cable, a conventional S-N curve was plotted even though there was a possibility of fretting among strands. It was found that the maximum stress corresponding to the inflection point on the S-N curve obtained was nearly the same value as the yielding strength of cable obtained from the static tensile test. However, the effect of cabling in multi-strands superconducting cable on the fatigue strength was not noticeable. The critical current(Ic) measurement was carried out at 4.2K in a NbTi strand out of the fatigued cable. It showed a degradation of lc at high stress amplitude regions over 380NTa, and the degradation became significant as the applied stress amplitude increased.