• 제목/요약/키워드: Cu oxide

검색결과 866건 처리시간 0.027초

Characteristics of p-Cu2O/n-Si Heterojunction Photodiode made by Rapid Thermal Oxidation

  • Ismail, Raid A.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제9권1호
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    • pp.51-54
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    • 2009
  • Transparent Cuprous oxide film was deposited by rapid thermal oxidation (RTO) of Cu at $500^{\circ}C$/45s condition on textured single-crystal n-Si substrate to form $Cu_2O$/n-Si heterojunction photodiode. The Hall effect measurements for the $Cu_2O$ films showed a p-type conductivity. The photovoltaic and electrical properties of the junction at room temperature were investigated without any post-deposition annealing. I-V characteristics revealed that the junction has good rectifying properties. The C-V data showed abrupt junction and a built-in potential of 1 V. The photodiode showed good stability and high responsivity in the visible at three regions; 525 nm, 625-700 nm, and 750nm denoted as regions A, B, and C, respectively.

Adhesion Strength Measurements of Cu-based Leadframe/EMC Interface

  • Lee, Ho-Young;Jin Yu
    • 마이크로전자및패키징학회지
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    • 제6권2호
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    • pp.1-12
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    • 1999
  • Brown oxide and/or black oxide layers were formed on the surface of Cu-based leadframe by chemical oxidation of leadframe in hot alkaline solutions, and their growth characteristics were studied. Then, to measure the adhesion strength between leadframe and epoxy molding compound (EMC), oxidized leadframe samples were molded with EMC and machined to form sandwiched double-cantilever beam (SDCB) specimens and pull-out specimens, respectively. Results showed that the adhesion strength of un-oxidized leadframe/EMC interface was inherently very poor but could be increased drastically with the nucleation of acicular CuO precipitates on the surface of leadframe. The presence of smooth faceted $Cu_2O $ on the surfaces of leadframe gave close to zero interfacial fracture toughness (Gc) and reasonable pull strength (PS). A direct correlation between Gc and PS showed that PS can be a measure of Gc only in a limited range.

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γ-Al2O3에 담지된 Cu-Mn 산화물 촉매의 활성 및 특성 (Activity and Characteristics of Cu-Mn Oxide Catalysts Supported on γ-Al2O3)

  • 김혜진;최성우;이창섭
    • Korean Chemical Engineering Research
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    • 제44권2호
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    • pp.193-199
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    • 2006
  • ${\gamma}-Al_2O_3$에 담지한 Cu-Mn 산화물 촉매에서 톨루엔 완전산화 반응을 $160{\sim}280^{\circ}C$의 온도 범위에서 고정층 반응기로 조사하였다. BET, SEM, TPR, TPO, XPS 및 XRD를 이용하여 촉매 특성분석을 하였다. 톨루엔의 완전산화 반응은 $280^{\circ}C$ 이하에서 이루어졌으며, 적절한 Cu-Mn 담지량은 15.0 wt%Cu-10.0 wt%Mn인 것으로 나타났다. TPR/TPO 및 XPS 분석 결과, 15 Cu-10 Mn 촉매의 산화환원 봉우리가 낮은 온도로 이동하였으며 결합에너지가 높은 값으로 이동하였다. XRD 결과, 고분산된 Mn 산화물과 CuO 보다 $Cu_{1.5}Mn_{1.5}O_4$의 촉매활성 인자로서의 역할이 더욱 우수한 것으로 추측되며, 촉매의 활성은 촉매의 산화환원 능력과 촉매의 높은 산화 상태에 기인하는 것으로 사료된다.

재생 알루미늄 산화물을 이용한 비소 흡착 특성 (Adsorption Characteristics of Arsenic using the Recycled Aluminium Oxide)

  • 민경철;김원기;이승목;김근한;이희용;양재규;박연종
    • 한국물환경학회지
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    • 제27권4호
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    • pp.486-490
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    • 2011
  • As(V) adsorption on aluminum oxide powder which was recycled from industrial wastes containing aluminum hydroxide was evaluated. Aluminum oxide powder in this study was prepared by calcinating aluminum hydroxide wastes at$550^{\circ}C$. Spectroscopic analysis indicated that the aluminum hydroxide wastes were changed to aluminum oxide by calcination. Arsenic adsorption isotherm was conducted with variation of ionic strength and multiple-ion systems using Ca(II) and Cu(II). As(V) removal showed typical anionic adsorption characteristics that the removal efficiency decreased with increasing pH in single As(V) system as well as in binary and ternary system. More than 80% of As(V) at an initial concentration of $5{\times}10^{-5}$ M was removed from aluminum oxide powder in As(V) single system. The effect of ionic strength on As(V) adsorption was negligible, which indicated the strong bonding between aluminum oxide powder and As(V). The removal efficiency of As(V) was higher in a binary system with Cu(II) than in a binary system with Ca(II).

Mg 첨가에 따른 수성가스전이반응용 Cu/ZnO/Al2O3 촉매의 활성 연구 (Enhanced Catalytic Activity of Cu/ZnO/Al2O3 Catalyst by Mg Addition for Water Gas Shift Reaction)

  • 박지혜;백정훈;황라현;이광복
    • 청정기술
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    • 제23권4호
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    • pp.429-434
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    • 2017
  • 저온 수성가스전이반응에서 $Cu/ZnO/MgO/Al_2O_3$ (CZMA) 촉매의 마그네슘의 영향을 조사하기 위하여 Cu/Zn/Mg/Al의 비율을 45/45/5/5 mol%로 공침법을 사용하여 제조하였다. 제조된 촉매들은 BET, $N_2O$ 화학흡착, XRD, $H_2-TPR$ and $NH_3-TPD$를 사용하여 분석되었다. 촉매 활성 테스트는 GHSV $28,000h^{-1}$와 온도 범위 $200{\sim}320^{\circ}C$에서 수행되었다. 동일한 조건에서 마그네슘이 첨가된 촉매(CZMA 400)는 가장 낮은 환원 온도를 나타내며 활성종인 $Cu^+$가 안정적으로 존재하고 또한 많은 약산점을 보유하였다. 또한 마그네슘이 첨가된 촉매(CZMA)는 마그네슘이 첨가되지 않은 촉매(CZA)와 비교하였을 때 240 이상의 높은 온도에서 촉매 활성이 증가하였다. CZMA 400 촉매는 최적의 촉매로서 $240^{\circ}C$, GHSV $28,000h^{-1}$에서 75 h 동안 활성의 저하없이 평균 CO 전환율 77.59%를 나타내었다.

Ce 첨가에 따른 저온수성가스전이반응용 Cu/Zn 촉매의 활성 연구 (Enhanced Catalytic Activity of Cu/Zn Catalyst by Ce Addition for Low Temperature Water Gas Shift Reaction)

  • 변창기;임효빈;박지혜;백정훈;정정민;윤왕래;이광복
    • 청정기술
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    • 제21권3호
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    • pp.200-206
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    • 2015
  • 산화세륨의 첨가가 수성가스전이반응 효율에 미치는 영향을 조사하기 위해서, Cu-ZnO-CeO2촉매를 공침법을 사용하여 제조하였다. 일련의 Cu-ZnO-CeO2 촉매는 Cu 함량(50 wt%)을을 고정시키고 산화세륨(CeO2 기준으로, 0, 5, 10, 20, 30, 40 wt%)의 함량을 조절하면서 제조되었고 이를 이용하여 GHSV 95,541 h-1의 기체 유량범위, 200~400 ℃의 온도범위에서 수성가스전이반응 촉매활성이 측정되었다. 또한, BET, SEM, XRD, H2-TPR, XPS 분석을 통하여 촉매특성이 분석되었다. CeO2가 첨가된 촉매는 구리 분산도와 결합에너지 같은 촉매특성의 다양한 변화를 나타내었다. 10wt%의 CeO2가 최적의 첨가량으로 판단되며 이때 촉매는 가장 낮은 온도에서 환원이 일어났으며 반응에서 가장 높은 촉매 활성을 보였다. 또한 CeO2가 첨가된 촉매는 CeO2가 첨가되지 않는 촉매와 비교하여 높은 온도영역에서 활성이 향상되었다. 따라서, 최적 조성의 CeO2첨가는 높은 구리 분산도, 낮은 결합에너지, 구리 금속의 응집 방지를 유도하여 높은 촉매활성을 유도하였다.

Facilitation of the four-mask process by the double-layered Ti/Si barrier metal for oxide semiconductor TFTs

  • Hino, Aya;Maeda, Takeaki;Morita, Shinya;Kugimiya, Toshihiro
    • Journal of Information Display
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    • 제13권2호
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    • pp.61-66
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    • 2012
  • The double-layered Ti/Si barrier metal is demonstrated for the source/drain Cu interconnections in oxide semiconductor thin-film transistors (TFTs). The transmission electromicroscopy and ion mass spectroscopy analyses revealed that the double-layered barrier structure suppresses the interfacial reaction and the interdiffusion at the interface after thermal annealing at $350^{\circ}C$. The underlying Si layer was found to be very useful for the etch stopper during wet etching for the Cu/Ti layers. The oxide TFTs with a double-layered Ti/Si barrier metal possess excellent TFT characteristics. It is concluded that the present barrier structure facilitates the back-channel-etch-type TFT process in the mass production line, where the four- or five-mask process is used.