• Journal of Powder Materials
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• v.26 no.2
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• pp.112-118
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• 2019

Infiltration is a popular technique used to produce valve seat rings and guides to create dense parts. In order to develop valve seat material with a good thermal conductivity and thermal expansion coefficient, Cu-infiltrated properties of sintered Fe-Co-M(M=Mo,Cr) alloy systems are studied. It is shown that the copper network that forms inside the steel alloy skeleton during infiltration enhances the thermal conductivity and thermal expansion coefficient of the steel alloy composite. The hard phase of the CoMoCr and the network precipitated FeCrC phase are distributed homogeneously as the infiltrated Cu phase increases. The increase in hardness of the alloy composite due to the increase of the Co, Ni, Cr, and Cu contents in Fe matrix by the infiltrated Cu amount increases. Using infiltration, the thermal conductivity and thermal expansion coefficient were increased to 29.5 W/mK and $15.9um/m^{\circ}C$, respectively, for tempered alloy composite.

• Journal of Korea Foundry Society
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• v.10 no.5
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• pp.399-407
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• 1990

The effect of thermal cycling and isothermal exposure on the high temperature microstructural stability of unidirectionally solidified $Al-CuAl_2$ eutectic composite has been studied. A coarsening procedures of lamellar eutectic structures were initiated at growth fault region because of diffusion through low angle boundary at this region. It was considered that thermally induced residual stresses produced by thermal cycling were high enough to increase the dislocation density in Al-rich matrix phase. However, it was also considered that dislocations generated by these high thermal stresses were annihilated at high temperature by stress relaxation. Consequently, the thermal cycling up to 1440 cycles between 20 and $520^{\circ}C$ did not affect the microstructural stability.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.10a
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• pp.46-49
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• 2003

Cu have been widely used as signal transmission materials for electrical electronic components owing to its high electrical conductivity. However, it's size have been limited to small ones due to its poor mechanical properties, Until now, strengthening of the copper at toy was obtained either by the solid solution and precipitation hardening by adding alloy elements or the work hardening by deformation process. Adding the at toy elements lead to reduction of electrical conductivity. In this aspect, if carbon nanofiber is used as reinforcement which have outstanding mechanical strength and electric conductivity, it is possible to develope Cu matrix nanocomposite having almost no loss of electric conductivity. It is expected to be innovative in electric conduct ing material market. The unidirectional alignment of carbon nanofiber is the most challenging task developing the copper matrix composites of high strength and electric conductivity In this study, the unidirectional alignment of carbon nanofibers which is used reinforced material are controlled by drawing process in order to manufacture the intermediary materials for the carbon nanofiber reinforced Cu matrix nanocomposite and align mechanism as well as optimized drawing process parameters are verified via experiments and numerical analysis. The materials used in this study were pure copper and the nanofibers of 150nm in diameter and of $10~20\mu\textrm{m}$ In length. The materials have been tested and the tensile strength was 75MPa with the elongation of 44% for the copper it is assumed that carbon nanofiber behave like porous elasto-plastic materials. Compaction test was conducted to obtain constitutive properties of carbon nanofiber. Optimal parameter for drawing process was obtained by experiments and numerical analysis considering the various drawing angles, reduction areas, friction coefficient, etc Lower reduction areas provides the less rupture of cu tube is not iced during the drawing process. Optimal die angle was between 5 degree and 12 degree. Relative density of carbon nanofiber embedded in the copper tube is higher as drawing diameter decrease and compressive residual stress is occurred in the copper tube. Carbon nanofibers are moved to the reverse drawing direct ion via shear force caused by deformation of the copper tube and alined to the drawing direction.

• Journal of Korea Foundry Society
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• v.14 no.5
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• pp.429-437
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• 1994

Influence of interfacial structure between matrix and particle in A356/coated SiC composite fabricated by squeeze casting method was studied. Experimental variables are types of coated metallic film on SiC particles such as Cu, Ni-P, and applied pressure for squeeze casting. It was found that coating treatment on SiC particles improves the wetting of liquid A356 alloy on SiC particles. SiC particle distribution is very homogeneous in A356 matrix alloy which is fabricated by squeeze casting. Analysing the surface morphology of fractured A356/coated SiC, it was concluded that metallic thin film by coating treatment on SiC particle improves the interfacial bonding between particle and matrix, and so does on mechanical properties such as tensile strength. However, there was on significant difference in hardness between those composite made of as-received SiC particle and coated SiC particle.

• Journal of Powder Materials
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• v.13 no.5 s.58
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• pp.366-370
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• 2006

The microstructure and mechanical properties of hot-pressed $Al_2O_3/Cu$ composites with a different sintering temperature have been studied. The size of matrix grain and Cu dispersion in composites increased with increase in sintering temperature. Fracture toughness of the composite sintered at high temperature exhibited an enhanced value. The toughness increase was explained by the thermal residual stress, crack bridging and crack branching by the formation of microcrack. The nanocomposite, hot-pressed at $1450^{\circ}C$, showed the maximum fracture strength of 707 MPa. The strengthening was mainly attributed to the refinement of matrix grains and the increased toughness.

• Journal of Korea Foundry Society
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• v.20 no.2
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• pp.89-96
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• 2000

The effects of modification processing on the refinement of primary Si and the wear behavior of hyper-eutectic Al-Si alloys have been mainly investigated. Refining effects of primary Si in Al-17%Si alloy was more efficient than that of B.390 alloy. Optimum condition of getting the finest primary Si microstructure was when AlCuP modifier is added into the melt at $750^{\circ}C$ and held it at $700^{\circ}C$ for 30 minutes. Wear loss in the specimens of as-cast condition decreases as the size of primary Si decreases, in the order of B.390 alloy, B.390 alloy with AlCuP addition, Al-17%Si alloy and Al-17%Si alloy with AlCuP addition. Wear loss in the aged condition of Al-17%Si alloy, B.390 alloy and B.390 alloy with AlCuP addition decreased due to the increase of compressive residual stress in the matrix by the aging treatment. While, wear loss increased in the aged specimens of Al-17%Si alloy with AlCuP addition and Hepworth addition in which compressive residual stress decreases by the aging treatment. Therefore, it is assumed that higher compressive residual stress in the matrix can reduce the wear loss in composite materials such as hyper-eutectic Al-Si alloys.

• Journal of Electrochemical Science and Technology
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• v.9 no.3
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• pp.169-175
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• 2018

Cu-Salen complex was prepared and attached into chitosan (Cs) polymer backbone. Nanocomposite of the synthesized polymer was prepared with functionalized carbon nano-particles (Cs-Cu-sal/C) to modify the electrode surface. The surface morphology of (Cs-Cu-sal/C) nanocomposite film showed a homogeneous distribution of carbon nanoparticles within the polymeric matrix. The cyclic voltammogram of the modified electrode exhibited a redox behavior at -0.1 V vs. Ag/AgCl (3 M KCl) in 0.1 M PB (pH 7) and showed an excellent hydrogen peroxide reduction activity. The Cs-Cu-sal/C electrode displays a linear response from $5{\times}10^{-6}$ to $5{\times}10^{-4}M$, with a correlation coefficient of 0.993 and detection limit of $0.9{\mu}M$ (at S/N = 3). The sensitivity of the electrode was found to be $0.356{\mu}A\;{\mu}M^{-1}\;cm^{-2}$.

• Journal of Korea Foundry Society
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• v.20 no.6
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• pp.377-385
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• 2000

Al matrix composites as the most promising MMCs can be expected to be excellent engineering materials in the nearest future. So as to improve material properties of composite, many manufacturing processes have been developed. Among them, squeeze casting process which offers fine microstructure and near-net-shape is one of the most successful MMCs manufacturing processes. But, in case of with subsieve size particles (under 44 ${\mu}m$), it is very difficult to homogeneously distribute particles in matrix of Al matrix composite by various casting processes, including squeeze casting used so far. Duplex process which was developed in previous study was used to distribute the particle of subsieve size more homogeneously in matrix of Al matrix composite. Microstructures, wear and heat resistance characterization of Al-Si-Cu-Mg-(Ni)/SiCp manufactured by duplex process were examined to clarify the effect of manufacturing conditions, particle size of reinforcement and alloying elements. Al matrix composites reinforced with SiCp(10 ${\mu}m$) have the lowest wear amount among composites reinforced with 3 ${\mu}m$, 5 ${\mu}m$ and 10 ${\mu}m$ SiCp. The wear amount of Al matrix composites with 10 wt.% SiCp(3, 5, 10 ${\mu}m$) was decreased according to the increase of the sliding speed because abrasive wear takes place at high sliding speed of 4m/s and worn debris with block type occurs at low sliding speed of 1m/s. As for heat resistance, it is made clear that remarkable heat resistance property can be obtained by addition of Ni element in Al matrix composites.

• Journal of Powder Materials
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• v.10 no.6
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• pp.443-447
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• 2003

Nano-sized $TiB_2$ was in situ synthesized in copper matrix through self-propagating high temperature synthesis (SHS) with high-energy ball milled Ti-B-Cu elemental mixtures as powder precursors. The size of $TiB_2$ particles in the product of SHS reaction decreases with time of preliminary mechanical treatment ranging from 1 in untreated mixture to 0.1 in mixtures milled for 3 min. Subsequent mechanical treatment of the product of SHS reaction allowed the $TiB_2$ particles to be reduced down to 30-50 nm. Microstructural change of $TiB_2$-Cu nanocomposite during spark plasma sintering (SPS) was also investigated. Under simultaneous action of pressure, temperature and electric current, titanium diboride nanoparticles distributed in copper matrix move, agglomerate and form a interpenetrating phase composite with a fine-grained skeleton.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.848-849
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• 2006

Bulk metallic glass (BMG) composites combining a $Cu_{54}Ni_6Zr_{22}Ti_{18}$ matrix with brass powders or $Zr_{62}A_{l8}Ni_{13}Cu_{17}$ metallic glass powders were fabricated by spark plasma sintering. The brass powders and Zr-based metallic glass powders added for the enhancement of plasticity are well distributed homogeneously in the Cu-based metallic glass matrix after consolidation. The BMG composites show macroscopic plasticity after yielding, and the plastic strain increased to around 2% without a decrease in strength for the composite material containing 20 vol% Zr-based amorphous powders. The proper combination of strength and plasticity in the BMG composites was obtained by introducing a second phase in the metallic glass matrix.