• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.252-255
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• 2004

반도체는 high integrated, high speed, low power를 위하여 design 뿐만 아니라 재료 측면에서도 많은 변화를 가져오고 있으며, RC delay time을 줄이기 위하여 Al 배선보다 비저항이 낮은 Cu와 low-k material 적용이 그 대표적인 예이다. 그러나, Cu 배선의 경우 dry etching이 어려우므로, 기존의 공정으로는 그 한계를 가지므로 damascene 또는 dual damascene 공정이 소개, 적용되고 있다. Damascene 공정은 절연막에 photo와 RIE 공정을 이용하여 trench를 형성시킨 후 electrochemical plating 공정을 이용하여 trench에 Cu를 filling 시킨다. 이후 CMP 공정을 이용하여 절연막 위의 Cu와 barrier material을 제거함으로서 Cu 배선을 형성하게 된다. Dual damascene 공정은 trench와 via를 동시에 형성시키는 기술로 현재 대부분의 Cu 배선 공정에 적용되고 있다. Cu CMP는 기존의 metal CMP와 마찬가지로 oxidizer를 이용한 Cu film의 화학반응과 연마 입자의 기계가공이 기본 메커니즘이다. Cu CMP에서 backside pressure 영향이 uniformity에 미치는 영향을 살펴보았으며, electrochemical plating 공정에서 발생하는 hump가 CMP 결과에 미치는 영향과 dishing 결과를 통하여 그 영향을 평가하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.55-59
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• 2003

Rotor in small-medium induction motor has been usually manufactured by aluminum diecasting. In order to improve efficiency of induction motors, however, it is desirable that pure aluminum is replaced by high electrical conductivity copper alloy. For this purpose, a rotor is thixoformed with Cu-Ca alloy. Thermomechanical processing(TMP) is carried out to modify the semi-solid microstructure of the alloy and final microstructures and filling defects of thixoformed Cu- rotors are investigated. The characteristics of thixoformed Cu-rotor such as motor efficiency and torque are compared with those of Al rotor.

• 한국표면공학회지
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• 제38권1호
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• pp.28-36
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• 2005

In this study, the reflow characteristics of copper thin films which is expected to be used as interconnection materials in the next generation semiconductor devices were investigated. Cu thin films were deposited on the TaN diffusion barrier by metal organic chemical vapor deposition (MOCVD) and annealed at the temperature between 250℃ and 550℃ in various ambient gases. When the Cu thin films were annealed in the hydrogen ambience compared with oxygen ambience, sheet resistance of Cu thin films decreased and the breakdown of TaN diffusion barrier was not occurred and a stable Cu/TaN/Si structure was formed at the annealing temperature of 450℃. In addition, reflow properties of Cu thin films could be enhanced in H₂ ambient. With Cu reflow process, we could fill the trench patterns of 0.16～0.24 11m with aspect ratio of 4.17～6.25 at the annealing temperature of 450℃ in hydrogen ambience. It is expected that Cu reflow process will be applied to fill the deep pattern with ultra fine structure in metallization.

• 한국주조공학회지
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• 제32권1호
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• pp.38-43
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• 2012

The effects of Mg and Cu amounts on the casting characteristics and tensile property of Al-Zn-Mg-Cu alloys were investigated for the development of high strength aluminium alloys for gravity mold casting. Increase of copper amounts in Al-6%Zn-3%Mgy% Cu alloys resulted in reduction of the fluidity of these alloys and had little effects on the tensile property of these alloys. Increase of magnesium amounts from 1.0wt% to 3.3wt% in Al-6%Zn-x%Mg-0.5%Cu alloys resulted in reduction of the elongation of these alloys from 12% to 3% and increase of the tensile strength of these alloys from 340MPa to 450MPa, but had little effects on the fluidity of these alloys.

• 한국재료학회지
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• 제30권3호
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• pp.149-154
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• 2020

A powder-in-sheath rolling method is applied to the fabrication of a carbon nano tube (CNT) reinforced copper composite. A copper tube with outer diameter of 30 mm and wall thickness of 2 mm is used as sheath material. A mixture of pure copper powder and CNTs with a volume content of 3 % is filled in a tube by tap filling and then processed to an 93.3 % reduction using multi-pass rolling after heating for 0.5 h at 400 ℃. The specimen is then sintered for 1h at 500 ℃. The relative density of the 3 vol%CNT/Cu composite fabricated using powder in sheath rolling is 98 %, while that of the Cu powder compact is 99 %. The microstructure is somewhat heterogeneous in width direction in the composite, but is relatively homogeneous in the Cu powder compact. The hardness distribution is also ununiform in the width direction for the composite. The average hardness of the composites is higher by 8Hv than that of Cu powder compact. The tensile strength of the composite is 280 MPa, which is 20 MPa higher than that of the Cu powder compact. It is concluded that the powder in sheath rolling method is an effective process for fabrication of sound CNT reinforced Cu matrix composites.

• 한국분말재료학회지
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• 제8권2호
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• pp.117-123
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• 2001

Formation of pores in melt-processed $YBa_2Cu_3O_{7-x}$ (123) oxides and its effect on the microstructure were studied. Spherical pores with a size of a few tens of microns were formed due to the evolution of oxygen gas during melting of a 123 oxide. Some of pores were converted into liquid pockets by liquid filling, but others remained unfilled. The liquid pockets were converted into spherical 123 regions with a lower $Y_2BaCuO_5$ (211)density through the peritectic reaction during subsequent cooling, while the pores were entrapped into the periteictically grown 123 grains. The spherical 123 regions often consists of a residual melt due to the unbalanced peritectically reaction.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.722-723
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• 2006

A new method has been developed to fabricate microcomponents by a combination of photolithography and sintering of metallic powder mixtures, without the need for compression and the addition of Mg. This involves (1) the fabrication of a micromould, (2) mould filling of the powder/binder mixture, (3) debinding and (3) sintering. The starting powdered materials consisted of a mixture of aluminium powder(average size of 2.5 um) and alloying elemental powder of Cu and Sn(less than 70nm), at appropriate proportions to achieve nominal compositions of Al-6wt%Cu, Al-6wt%Cu-3wt%Sn. This paper presents detailed investigation of debinding behaviour and microstructural development.

• 대한금속재료학회지
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• 제48권6호
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• pp.557-564
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• 2010

Formation of Sn through-silicon-via (TSV) and its interconnection processes were studied in order to form a three-dimensional interconnection structure of chip-stack packages. Different from the conventional formation of Cu TSVs, which require a complicated Cu electroplating process, Sn TSVs can be formed easily by Sn electroplating and reflow. Sn via-filling behavior did not depend on the shape of the Sn electroplated layer, allowing a much wider process window for the formation of Sn TSVs compared to the conventional Cu TSV process. Interlocking joints were processed by intercalation of Cu bumps into Sn vias to form interconnections between chips with Sn TSVs, and the mechanical integrity of the interlocking joints was evaluated with a die shear test.

• Corrosion Science and Technology
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• 제18권2호
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• pp.39-48
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• 2019

The feasibility of using benzotriazole (BTAH) to inhibit pitting corrosion in the sprinkler copper tubes was investigated by filling the tubes with BTAH-water solution in 829 households at an eight-year-old apartment complex. The water leakage rate was reduced by approximately 90% following BTAH treatment during 161 days from the previous year. The leakage of one of the two sprinkler copper tubes was investigated with optical microscopy, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectroscopy, and X-ray diffraction analysis to determine the formation of Cu-BTA film inside the corrosion pits. All the inner components of the corrosion pits were coated with Cu-BTA films suggesting that BTAH molecules penetrated the corrosion products. The Cu-BTA film was about 2 nm in thickness at the bottom of a corrosion pit. A layer of CuCl and $Cu_2O$ phases lies under the Cu-BTA film. This complex structure effectively prevented the propagation of corrosion pits in the sprinkler copper tubes and reduced the water leakage.

• 한국분말재료학회지
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• 제30권4호
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• pp.339-345
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• 2023

This study investigates the melting point and brazing properties of the aluminum (Al)-copper (Cu)-silicon (Si)-tin (Sn) alloy fabricated for low-temperature brazing based on the alloy design. Specifically, the Al-20Cu-10Si-Sn alloy is examined and confirmed to possess a melting point of approximately 520℃. Analysis of the melting point of the alloy based on composition reveals that the melting temperature tends to decrease with increasing Cu and Si content, along with a corresponding decrease as the Sn content rises. This study verifies that the Al-20Cu-10Si-5Sn alloy exhibits high liquidity and favorable mechanical properties for brazing through the joint gap filling test and Vickers hardness measurements. Additionally, a powder fabricated using the Al-20Cu-10Si-5Sn alloy demonstrates a melting point of around 515℃ following melting point analysis. Consequently, it is deemed highly suitable for use as a low-temperature Al brazing material.