• Transactions of the Korean hydrogen and new energy society
• /
• v.24 no.4
• /
• pp.282-287
• /
• 2013

Hydrogen production from water using solar energy is attractive way to obtain clean energy resource. Among the various solar-to-hydrogen production techniques, a combination of a photovoltaic and an electrolytic cell is one of the most promising techniques in term of stability and efficiency. In this study, we show successful fabrication of precursor solution processed CIGS thin film solar cells which can generate high voltage. In addition, CIGS thin film solar cell modules producing over 2V of open circuit voltage were fabricated by connecting three single cells in series, which are applicable to water electrolysis. The operating current and voltage during water electrolysis was measured to be 4.23mA and 1.59V, respectively, and solar to hydrogen efficiency was estimated to be 3.9%.

• 한국초전도학회:학술대회논문집
• /
• v.10
• /
• pp.193-196
• /
• 2000

A new type low-pass filter design method based on a coupled line and transmission line theory is proposed to suppress harmonics by attenuation poles in the stop band. The design formula are derived using the equivalent circuit of a coupled transmission line. The new low-pass filter structure is shown to have attractive properties such as compact size, wide stop band range and low insertion loss. The seventh-order low-pass filter designed by present method has a cutoff frequency of 0.9 CHz with a 0.01 dB ripple level. The coupled line type low-pass filter with strip line configuration was fabricated by using a high-temperature superconducting (HTS : YBa$_2$Cu$_3$O$_{7-{\delta}}$ thin film on MgO(100) substrate. Since the HTS coupled tine type low-pass filter was proposed with five attenuation poles in stop band such as 1.8, 2.5, 4, 5.5, 6.2 GHz. The fabricated low-pass filter has improved the attenuation characteristics up to seven times of the cutoff frequency.

• Proceedings of the KIEE Conference
• /
• 1999.11d
• /
• pp.909-911
• /
• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed circuit boards (PCB) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor metals, such as Al and Cu, and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure, wear resistance, corrosion protection and thermal stability. In this study fundamental aspects of electroless nickel deposition were studied with effect of complexeing agents of different kinds. Then, the property of electroless deposit are controlled by the composition of the deposition solution, the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.05b
• /
• pp.20-23
• /
• 2003

The operational characteristics of flux-lock type high-Tc superconducting fault currentlimiters(HTSC-FCLs) was described and currents equation at each coil was derived from equivalent circuit. $YBa_{2}Cu_{3}O_{7-x}$(YBCO) thin film was used as the current limiting elements of the flux-lock type HTSC-FCL, which were fabricated by etching the YBCO thin film into 2 mm wide and 420 mm long meander line consisting of foureen stripes with different length. The 2nd peak on the current of coil 2 after a fault disappeared by current of the 3rd winding, which was installed in the flux-lock type HTSC-FCL.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.1247-1249
• /
• 2009

We have successfully developed the 22 inch WSXGA+ DLS(Data Line Sharing) Panel driving in 75 Hz. In the large size and high resolution panels, it is very difficult to design the DLS Panels without failure because of the very short charging time and the large signal delay. So, we first investigated the charging order to find the most adequate charging type to the large size and high resolution panels. And then, we optimized the design of DLS in terms of improving the charging properties using the technologies of the Delta-doping TFTs, Cu metal electrodes and optimization of panel design value and the circuit signal timing.

• Progress in Superconductivity and Cryogenics
• /
• v.14 no.1
• /
• pp.44-47
• /
• 2012

The substantial improvement of the signal-to-noise ratio (SNR) can be achieved with small-size samples or low-field MRI system by high-temperature superconducting(HTS) RF coil. The typical HTS RF coil made of HTS thin film is expensive and is limited the coil geometry to planar surface coil. In this study, commercial Bi-2223 HTS tapes was used as RF coil for a 0.35T permanent MRI system. It has advantages of both much lower cost and easier fabrication over HTS thin film coil. SNR gain of the image obtained from the HTS RF coil over a conventional Cu RF coil at room temperature was about 2.4-fold and 1.9-fold using the spin echo pulse sequence and gradient echo pulse sequence respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.82-82
• /
• 2007

The chemical mechanical polishing (CMP) process has been widely used to obtain global planarization of multilevel interconnection process for ultra large scale. integrated circuit applications. Especially, the application of copper CMP has become an integral part of several semiconductor device and materials manufacturers. However, the low-k materials at 65nm and below device structures because of fragile property, requires low down-pressure mechanical polishing for maintaining the structural integrity of under layer during their fabrication. In this paper, we studied electrochemical mechanical polishing (ECMP) as a new planarization technology that uses electrolyte chemistry instead of abrasive slurry for copper CMP process. The current-voltage (I-V) curves were employed we investigated that how this chemical affect the process of voltage induced material removal in ECMP of Copper. This work was supported by grant No. (R01-2006-000-11275-0) from the Basic Research Program of the Korea Science.

• Journal of the Korean Society of Safety
• /
• v.34 no.3
• /
• pp.15-20
• /
• 2019

As industry is progressing and standards of living are improved, the demand of electrical energy is expected to grow 8-9% annually. Therefore, the importance of electrical fire prevention technology with the ability of the power supply is being emphasized. According to the statistics of fire in Korea, fire occurred about 45,000 cases annually, and electrical fire possessed about 20%. The electrical fire by poor contact has increased gradually, can be connected as great fire to secondarily induce short circuit and earth fault. Then analysis of heating causes of electrical connections between copper and copper alloy is needed. Also, detection and analysis algorithm of oxide at copper alloy are necessary. In this research, in order to understand the characteristics of oxide growth with rising resistance and heating, it is demonstrated that the oxide at electrical connections can cause fire due to arcing.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.4
• /
• pp.97-103
• /
• 2014

Among various lead-free solders, the Sn-58Bi solders have been considered as a highly promising lead-free solders because of its low melting temperature and high tensile strength. However, Sn-58Bi solder has the poor ductility. To enhance the mechanical property of Sn-58Bi solder, epoxy-enhanced Sn-58Bi solders have been studied. This study compared the microstructures and the mechanical properties of Sn-58Bi solder and Sn-58Bi epoxy solder with aging treatment. The solders ball were formed on the printed circuit board (PCB) with organic solderability preservative (OSP) surface finish, and then the joints were aged at 85, 95, 105 and $115^{\circ}C$ for up to 100, 300, 500 and 1000 hours. The shear test was conducted to evaluate the mechanical property of the solder joints. $Cu_6Sn_5$ intermetallic compound (IMC) layer grew with increasing aging time and temperature. The IMC layer for the Sn-58Bi epoxy solder was thicker than that for the Sn-58Bi solder. According to result of shear test, the shear strength of Sn-58Bi epoxy solder was higher than that of Sn-58Bi solder and the shear strength decreased with increasing aging time.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.3
• /
• pp.43-49
• /
• 2010

Direct printing technology is an attractive metallization method, which has become immerging as "Green technology" to the conventional photolithography, on account of low cost, simple process and environment-friendliness. In order to commercialize the printed electronics in industry, it is essential to evaluate the electrical properties of conductive circuits using direct printing technology. In this contribution, we focused on the electrical characteristics of inkjet-printed circuits. A Cu nanoink was inkjet-printed onto a Bisaleimide triazine(BT) substrate with parallel transmission line(PTL) and coplanar waveguide(CPW) type, then was sintered at $250^{\circ}C$ for 30 min. We calculated the resistivity of printed circuits through direct current resistance by the measurement of I-V curve: the resistivity was approximately 0.558 ${\mu}{\Omega}{\cdot}cm$ which is about 3.3 times that of bulk Cu. Cascade's probe system in the frequency range from 0 to 30 GHz were employed to measure the Scattering parameter(S-parameter) with or without a gap between the substrate and the probe station chuck. The result of measured S-parameter showed that all printed circuits had over 5 dB of return loss in the entire frequency range. In the curve of insertion loss, $S_{21}$, showed that the PTL type circuits had better transmission of radio frequency (RF) than CPW type.