• Title/Summary/Keyword: Cu and Sn

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Application of Oxide Nanofibers Synthesized by Electrospinning to Chemical Sensors

  • Choi, Sun-Woo;Akash, Katoch;Jung, Sung-Hyun;Kim, Sang-Sub
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.10a
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    • pp.3.2-3.2
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    • 2011
  • Nanofibers, one of various one-dimensional nanomaterials such as nanorods, nanowires and nanotubes have been successfully synthesized by many groups in recent years and their applications to chemical sensors, catalytic filters and biomedicine, etc. are extensively tested. In particular, there is a possibility that chemical sensors based on oxide nanofibers can overcome the shortcomings of chemical sensors based on single nanowires. In order to prepare oxide nanofibers, the electrospinning method is most widely used. In this work, we synthesized various oxide nanofibers including ZnO, SnO2 and CuO by employing an electrospinning method and various shapes of nanofibers including core-shell nanofibers and hollow nanofibers as well. The response properties of the various nanofibers to oxidizing and reducing gaseous species have been investigated systematically. The normal oxide nanofibers showed high sensitivity and quite fast response time to many gaseous species. Furthermore, derivatives of normal nanofibers including hollow nanofibers, core-shell nanofibers and heterostructured nanofibers display much superior sensing properties. These results hold promise for the practical application of oxide nanofibers to chemical sensors. In addition, the sensing mechanisms operated in the nanofibers will be discussed in detail.

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The UV Blocking Effect Of Fabrics & Banji Dyed With Green Tea (녹차 염색포의 자외선 차단 효과 연구)

  • Song Myung-Kyun;Song Eun-Young
    • Journal of the Korean Society of Clothing and Textiles
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    • v.29 no.6
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    • pp.745-752
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    • 2005
  • Green tea has various medical effects. It was selected as new natural dyes guessing the effects of the biological activities are still appeared on dyeing. It was examined whether they have the function of Uv-blocker or not. Cotton, linen & Hanji were dyed with Green tea. Al, Cr, Cu, Fe and Sn were selected as the mordant and the UV blocking rate of dyed samples was measured. The results of this study as follows; 1 . The color of dyed samples with Green tea changed yellowish red except Hanji and linen mordanted with Fe. 2. K/S values of dyed samples with Green tea increased by the number of dyeing treatment(p<.01). 3. UVA and UVB blocking rate increased by the number of dyes. Cotton and Linen could block the UV radiation over $93\%$ and Hanji could block over $95\%$ after three times of dyeing. These results suggest that Hanji has possibility far various practical uses of clothing material in beautiful and functional aspect. It could have the biological effects when we put on dyed clothing material with Green tea.

A Study on Cochineal Dyeing by Various Mordants and pH Conditions II -Treatment on Wool Fabric- (염욕의 pH와 매염제의 변화에 따른 코치닐의 염색성 연구 II -양모직물을 중심으로-)

  • Kim Kyung-Sun;Kim Jong-Jun;Jeon Dong-Won
    • The Research Journal of the Costume Culture
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    • v.13 no.2 s.55
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    • pp.248-254
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    • 2005
  • In this study, wool fabric specimens were pre-mordanted using Sn, Al, Cu, Cr, and Fe, and subsequently dyed using cochineal, maintaining the pH of the dye bath constant using pH buffer solutions of 4, 5, 6, 7, and 8. In the case of wool fabric specimen, regardless of the type of mordanting agents, peak dye-uptake amount was obtained at the acidic region, pH 4, and above pH 6, the dye-uptake amount decreased remarkably. Differing from the cotton fabric case, the dyed wool fabric specimen exhibited red shade even in the case of non-mordanting, at the region of pH values of 4 and 5. It is presumed that in the acidic dye bath the effect of cationic amine group present in the structure of wool fiber molecules took place. The amount of color difference, among the mordanting agents, due to the increase of pH value, was highest for the Fe mordanting case. It seems, therefore, that the Fe mordanting is affected most by the pH value.

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Collective laser-assisted bonding process for 3D TSV integration with NCP

  • Braganca, Wagno Alves Junior;Eom, Yong-Sung;Jang, Keon-Soo;Moon, Seok Hwan;Bae, Hyun-Cheol;Choi, Kwang-Seong
    • ETRI Journal
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    • v.41 no.3
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    • pp.396-407
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    • 2019
  • Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.

Measurement of Local Elastic Properties of Flip-chip Bump Materials using Contact Resonance Force Microscopy (접촉 공진 힘 현미경 기술을 이용한 플립 칩 범프 재료의 국부 탄성계수 측정)

  • Kim, Dae-Hyun;Ahn, Hyo-Sok;Hahn, Junhee
    • Tribology and Lubricants
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    • v.28 no.4
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    • pp.173-177
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    • 2012
  • We used contact resonance force microscopy (CRFM) technique to determine the quantitative elastic properties of multiple materials integrated on the sub micrometer scale. The CRFM approach measures the frequencies of an AFM cantilever's first two flexural resonances while in contact with a material. The plain strain modulus of an unknown or test material can be obtained by comparing the resonant spectrum of the test material to that of a reference material. In this study we examined the following bumping materials for flip chip by using copper electrode as a reference material: NiP, Solder (Sn-Au-Cu alloy) and under filled epoxy. Data were analyzed by conventional beam dynamics and contact dynamics. The results showed a good agreement (~15% difference) with corresponding values determined by nanoindentaion. These results provide insight into the use of CRFM methods to attain reliable and accurate measurements of elastic properties of materials on the nanoscale.

Solder Joints Fatigue Life of BGA Package with OSP and ENIG Surface Finish (OSP와 ENIG 표면처리에 따른 BGA 패키지의 무연솔더 접합부 피로수명)

  • Oh, Chulmin;Park, Nochang;Hong, Wonsik
    • Korean Journal of Metals and Materials
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    • v.46 no.2
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    • pp.80-87
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    • 2008
  • Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than $1,000{\Omega}$. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution.

Dyeing Properties Wood Dyes by Screen Printing (날염을 이용한 소목의 염색성에 관한 연구)

  • 김은경;장지혜
    • Journal of the Korean Home Economics Association
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    • v.38 no.9
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    • pp.119-130
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    • 2000
  • The purpose of this study was to confirm the possibility of screen printing with Natural dyes. The coloring matter such as sappan wood was used in order to obtain the colorant powder through the processes of extraction, low pressure concentration and the spray dry. After the screen printing on silk and cotton fabrics with colorant, K/S value changes of color and color fastness were measured. The main resets were as follows : 1. The viscosity of printing thickeners of sappan wood powder was about 15,200 cps, and the highest K/S value of the fabrics printed with sappan wood was obtained at 90$\pm$2$\^{C}$ of steaming temperature and 80 minutes of steaming time. 2. For the fabrics printed with sampan wood, adding of urea was not effective, since the more the concentration of urea increased, the more K/S values decreased. 3. For the natural dyes printing, the more the concentration of colorants increased, the more K/S values increased. In general, the K/S values of the printed fabrics were higher when treated with mordants rather than without mordants. Specifically, the λmax sappan wood was 520∼570 nm, and the K/S value was highest when treated with Cu mordant and lowest when treated with Sn. 4. Generally, the color fastness was relatively fair.

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Prediction of Impact Life Time in Solder Balls of the Board Level Flip Chips by Drop Simulations (낙하해석을 통한 보드 레벨 플립칩에서의 솔더볼 충격수명에 관한 연구)

  • Jang, Chong Min;Kim, Seong Keol
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.23 no.3
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    • pp.237-242
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    • 2014
  • Recently much research are has been done into the compositions of lead-free solders. As a result, there has been a rapid increase in the number of new compositions. In the past, the properties of these new compositions were determined and verified through drop-impact tests. However, these drop tests were expensive and it took a long time to obtain a result. The main goal of this study was to establish an analytical method capable of predicting the impact life-time of a new solder composition for board-level flip chips though the application of drop simulations using LS-DYNA. Based on the reaction load obtain with LS-DYNA, the drop-impact fracture cycles were predicted. The study was performed using a Sn-3.0Ag-0.5Cu solder (305 composition). To verify the reliability of the proposed analytical method, the results of the drop-impact tests and life-time analysis were compared, and were found to be in good agreement. Thus, the new analytical method was shown to be very useful and effective.

The Dry Sliding Wear Properties of $SiC_w$ and $SiC_p$ Reinforced Bronze Matrix Composites (무윤활 미끄럼 마찰하에서 SiC 휘스커 및 입자강화 청동기지 복합재의 마모특성)

  • 이상로;허무영
    • Tribology and Lubricants
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    • v.9 no.2
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    • pp.49-55
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    • 1993
  • The dry sliding wear properties of the sintered Cu-10 wt%Sn bronze alloys reinforced with $SiC_w$ and $SiC_p$ were investigated by a pin-on-disc wear testing machine. The worn surfaces and the cross sections of the wear specimens and the wear debris were observed by SEM to study the effect of the variation of the ceramic phase contents in the composite and the wear condition on the wear behaviors. The wear of bronze matrix was dominated by the adhesive wear. The transition from mild to severe wear was found in the bronze matrix specimens at the applied load higher than 20N where the surface delamination caused the severe wear. The addition of $SiC_w$ and $SiC_p$ reinforcements in the romposites was proved to reduce the wear rate by the matrix strengthening at the applied load higher than 20N. SiC whiskers having a large length to diameter ratio which hold the deformed matrix were effective to hinder the crack propagation near the worn surface. Thus the maximum wear resistance was obtained in the composite reinforced by $SiC_w$ at the higher applied load.

AN EXPERIMENTAL STUDY ON THE INITIAL AMALGAM CORROSION IN ARTIFICIAL SALIVA (인공타액에서 아말감 초기부식에 대한 실험적 연구)

  • Kim, Mi-Ja;Lee, Myung-Jong
    • Restorative Dentistry and Endodontics
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    • v.17 no.2
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    • pp.287-306
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    • 1992
  • The amounts of copper, mercury, silver, tin, and zinc released from conventional, dispersed phase and spherical high copper content amalgam immersed in artificial saliva soln. for periods of 2 hours, 1 day, 7 days, 30 days has been measured using Neutron Activation analysis and Atomic Absorption Spectrophotometry. The second electron image and EDX of the surface of samples immersed in artificial saliva were observed using SEM. The following results were obtained. 1. The dispersed non-$\gamma_2$ amalgam released more Hg, Ag than the $\gamma_2$-amalgams. Later a decrease of the release rate could be observed. 2. The dispersed high copper amalgam released more copper than low-copper amalgam and the release rate was decreased with time. But the amounts of copper released from Tytin increased with time. 3. Zinc was released all the experiment time. 4. EDAX showed that surface was composed of Ca,P, Sn, Ag, Zn, and Cu, but C1 was not detected. 5. The discontinued destructed surface was observed from the polished amalgam surface. High copper amalgam was destructed more than low copper amalgam.

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