• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 하계학술대회 논문집 C
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• pp.1485-1487
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• 2000

A variety of target configurations in sputtering process have been proposed to deposit various structures of thin film alloys and compound films. In this study, we presented the comparative experimental results regarding to the characterization of properties of Cu-Ni thin films deposited by using a magnetron co-sputtering method, as a function of target configurations; one is using a single target with varying the area of Ni chips attached on the Cu target and another is using a dual-type target with two targets of Ni and Cu separated each other. Structural(d-spacing, crystal orientation, crystallite size, cross-sectional morphology) and electrical(resistivity) properties of deposited films are characterized and compared as a function of target configurations as well as deposition conditions.

• 한국재료학회지
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• 제8권4호
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• pp.362-367
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• 1998

Mg-6Zn-2Cu 및 Mg-6Zn-1.5Si(wt%)합금의 미세조직 및 석출거동을 조사하였다. 합금은 $4 x 10^{-4}$ 의 진공분위기에서 제조하였고 용체화처리는 $435^{\circ}C$에서 8시간 행하였다. Mg-6Zn합금에 1.5wt.%Si를 첨가한 합금에서는 입계 및 입내에 $10\mu\textrm{m}$-2$\mu\textrm{m}$크기의 구형의 $MgZn_{2}$와 $Mg_{2}$Si상이 존재한다. 시효경화거동은 용체화처리된 Mg-6Zn-2Cu 및 Mg-6Zn-1.5Si합금에서 조사되었다. 결정립 미세화에 의한 경도증가효과는 Mg-6Zn-2Cu합금계에서 크게 나타났으나, 시효에 의한 경도증가효과는 Mg-Zn-Si합금계에서 크게 나타났다. 시효처리 후 생성된 석출상들은 투과전자현미경 분석결과 Mg-6Zn-2Cu합금에서는$ Mg_{2}$$Zn_{3}$이었고 Mg-6Zn-1.5Si 합금에서는 $Mg_{2}$$Zn_{11}$ /이었다.

• 한국자기학회지
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• 제5권5호
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• pp.421-426
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• 1995

The magnetic properties of the hot-pressed magnets made from the Fe-Nd-B alloys, mechanically ground and subsequently blended with binary additives such as Al-Cu and Ag-Zn before hot pressing, were investigated. The coercivities of the magnets increased as the concentration of Al-Cu increased up to 1 wt.% or up to 3 wt.% in the case of Ag-Zn. At higher concentrations the coercivities decreased markedly. The maximum gain in coercivity by the addition was about 20 %. typical values of $_{i}H_{c}$ and $B_{r}$ of a hotpressed magnet containing 1 wt.% Al-Cu were 18 kOe and 7 kG, respectively. It was found that Cu, Ag, and Zn, which diffused into the magnet during hot pressing, were mostly concentrated on the Nd-rich grain boundary phase whereas Al was present not only in the grain boundary region but also in the matrix grains.

• 마이크로전자및패키징학회지
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• 제14권4호
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• pp.27-36
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• 2007

본 논문에서는 다양한 조성의 주석-은-구리 합금계 솔더볼과 ENIG 및 Cu-OSP 패드와의 계면 반응에 대해 연구하였다. ENIG 패드와 미량의 Sb이 첨가된 합금 솔더와의 계면 반응 시 다른 솔더에 비해 매우 얇은 100 nm 내외의 두께를 가진 P-rich Ni layer가 형성되었다. 미량의 Ni이 첨가된 합금 솔더와 Cu-OSP 금속 패드와의 계면 반응 시에는 다른 솔더와는 달리 균일한 두께의 $Cu_6Sn_5$ 금속간화합물이 형성되었으며 추가 리플로우 시에 금속간화합물 입자가 거의 성장하지 않았다. 또한 $150^{\circ}C$의 장시간 열처리 시에 다른 솔더에 비해 매우 얇은 두께의 $Cu_3Sn$ 금속간화합물이 형성되었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• 대한금속재료학회지
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• 제49권4호
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• pp.298-303
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• 2011

Mg-23.5 wt%Ni-xwt%Cu (x = 2.5, 5 and 7.5) samples for hydrogen storage were prepared by melt spinning and crystallization heat treatment from a Mg-23.5 wt%Ni-5 wt%Cu alloy synthesized by the gravity casting method. They were then ground under $H_2$ to obtain a fine powder. Among these samples the Mg-23.5Ni-2.5Cu sample had the highest hydriding and dehydriding rates after activation. The Mg-23.5Ni-2.5Cu sample absorbed 3.59 and 4.01 wt%H for 10 and 60 min, respectively, at 573K under 12 bar $H_{2}$. The activated 88(87.5Mg-10Ni-2.5Cu)-$5Nb_{2}O_{5}-7NbF_{5}$ sample absorbed 2.93 wt%H for 10 min, and 3.14 wt%H for 60 min at 573K under 12 bar $H_{2}$.

• Corrosion Science and Technology
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• 제21권4호
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• pp.273-281
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• 2022

The effect of addition of Cu on the localized corrosion performance of aged duplex stainless steel in chloride media has yet to be explained in a consistent manner, and there is some controversy in the literature regarding the composition of stainless steel and the experimental conditions (pH, temperature, chloride concentration, etc.) used. In this work, the effect of the addition of Cu on the microstructure, hardness, and corrosion resistance of duplex stainless steel in an acidic chloride or high concentration sulfuric acid solutions was investigated for annealed and aged alloys. The Cu addition of annealed duplex stainless steel strengthened the alloy and reduced the ferrite contents of the alloy, and it also increased the polarization behavior in chloride or sulfuric solutions, except for the case of a high potential in acidic chloride solution. However, the Cu addition of aged duplex stainless steel reduced the formation of harmful phases such as sigma and kai and increased the polarization behavior in acidic chloride or sulfuric solutions up to 0.8 wt% of the Cu content, after which it slightly decreased at 0.8 wt% Cu or more.

• 한국재료학회지
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• 제27권11호
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• pp.624-630
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• 2017

In this study, we investigated the overpotential of precipitation related to the catalytic activity of electrodes on the initial process of electrodeposition of Co and Co-Ni alloys on polycrystalline Cu substrates. In the case of Co electrodeposition, the surface morphology and the magnetic property change depending on the film thickness, and the relationship with the electrode potential fluctuation was shown. Initially, the deposition potential(-170 mV) of the Cu electrode as a substrate was shown, the electrode potential($E_{dep}$) at the $T_{on}$ of electrodeposition and the deposition potential(-600 mV) of the surface of the electrodeposited Co film after $T_{off}$ and when the pulse current was completed were shown. No significant change in the electrode potential value was observed when the pulse current was energized. However, in a range of number of pulses up to 5, there was a small fluctuation in the values of $E_{dep}$ and $E_{imm}$. In addition, in the Co-Ni alloy electrodeposition, the deposition potential(-280 mV) of the Cu electrode as the substrate exhibited the deposition potential(-615 mV) of the electrodeposited Co-Ni alloy after pulsed current application, the $E_{dep}$ of electrodeposition at the $T_{on}$ of each pulse and the $E_{imm}$ at the $T_{off}$ varied greatly each time the pulse current was applied. From 20 % to less than 90 % of the Co content of the thin film was continuously changed, and the value was constant at a pulse number of 100 or more. In any case, it was found that the shape of the substrate had a great influence.

• 한국주조공학회지
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• 제36권1호
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• pp.1-9
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• 2016

Improvement of the mechanical properties of a commercial aluminium casting alloy, A356, was achieved through an optimised combination of alloying elements, modification, and heat treatment. 0.7 wt.% Cu and an additional 0.2 wt.% Mg were added to an Al-7Si-0.35Mg alloy for strengthening at both room and elevated temperatures, whilst a subsequent decrease in the ductility was compensated for by the modification of eutectic Si by Sr addition at a level of up to 110 ppm. It was found that the dissolution of Cu-rich or Mg-rich phases could be maximised by solid-solutionising an alloy with 40 ppm Sr at $530^{\circ}C$, increasing the tensile and yield strengths to 350 MPa and 297 MPa, respectively, with a reasonably high strain of 5% after peak-aging at $210^{\circ}C$. Further addition of Sr up to 110 ppm is, however, more likely to interfere with the dissolution of the Cu-rich or Mg-rich phases during solid solution treatment, resulting in a slight decrease in both tensile and yield strengths at room temperature. Besides the Cu addition, such undissolved phases, on the other hand, may contribute to elevated temperature strength at $200^{\circ}C$.

• 한국주조공학회지
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• 제29권5호
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• pp.225-232
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• 2009

For comprehensive understanding of the formation behavior of $\beta-Al_5FeSi$ phase in Al-Si-Cu alloys with the existence of Fe element, microstructure characterizations were performed using combined analysis of OM, SEM-EDS, XRD. Especially, experimental and predictive works on solidification events of $\beta-Al_5FeSi$ phase as well as other phases formed together with $\beta-Al_5FeSi$ have been carried out by using DSC analysis and Java-based Materials Properties software (J. Mat. Pro.). Primary and eutectic $\beta-Al_5FeSi$ phases were able to distinguish from each other on microstructures by their morphological features. Primary $\beta-Al_5FeSi$ phase was seen to have rough surface perpendicular to growth direction, indicating free attachment of solute atoms in liquid state. On the other hand, the eutectic $\beta-Al_5FeSi$ phase was formed with plain and straight surface during eutectic reaction together with $\alpha$-Al phase. The eutectic reaction of $\beta-Al_5FeSi$ and $\alpha$-Al phases was seen to be able to separate into each formation depending on cooling rate.