• 한국주조공학회지
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• 제30권5호
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• pp.161-166
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• 2010

In this examination, the effect of Sr addition and holding time on microstructure of Al-10.5wt%Si-2wt%Cu secondary die-casting alloy was investigated. Degree of undercooling was improved with increasing the Sr content in this alloy. Up to 0.02wt%Sr addition, acicular and lamellar eutectic structure was observed in the microstructure. Meanwhile, the eutectic Si was modified toward the fine fibrous form by increasing Sr content with more than 0.03wt% and holding time of the melt. The well- modified alloys showed decreased eutectic silicon size from 3.25 ${\mu}m$ to less than 0.8 ${\mu}m$. From these results, the optimal strontium content and holding time were identified on the Al-10.5wt%Si-2wt%Cu secondary die-casting alloy.

• 분석과학
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• 제7권4호
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• pp.517-526
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• 1994

Mn의 함량을 달리하여 제조한 Al-Li-Cu-Mg-Mn-Zr 합금의 미고용상 및 분산상을 EPMA(Electron Probe Microanalyzer)와 SAEM(Scanning Auger Electron Microscope)으로 분석하였다. 또한 미고용상의 부피 분율, 분포 및 형태를 광학현미경으로 관찰하였으며, 상온과 고온에서의 인장 특성을 조사하였다. Mn의 함량이 증가함에 따라 미고용상의 부피분율을 급격히 증가하고 연신율을 감소하였다. Mn은 기지 조직의 결정립을 미세하고 균일하게 분포하도록 하였다. 인장시험 결과, 0.44 wt% Mn이 첨가된 합금이 다른 합금보다 우수한 기계적 특성을 나타내었다.

• 한국재료학회지
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• 제30권8호
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• pp.435-440
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• 2020

The relationship between the precipitation of secondary phase and the thermal properties of Al-4.5%Cu alloy (in wt.%) after various heat treatments has been studied. Solid solution treatment of alloy was performed at 808 K for 6 hours, followed by warm water quenching; then, the samples were aged in air at 473 K for different times. The thermal diffusivity of the Al-4.5%Cu alloy changed with the heat treatment conditions of the alloy at temperatures below 523 K. The as-quenched specimen had the lowest thermal diffusivity, and as the artificial aging time increased, the thermal diffusivity of the specimen increased in the temperature range between 298 and 523 K. For the specimen aged for five hours, the thermal conductivity was 12% higher than that of the as-quenched specimens at 298 K. It is confirmed that the thermal diffusivity and thermal conductivity of the Al-4.5%Cu alloy significantly depend on their thermal history at temperatures below 523 K. The precipitation and dissolution of the Al₂Cu phase were confirmed via DSC for the alloys, and the formation of coefficient of thermal expansion peaks in TMA was caused by precipitation. The precipitation of supersaturated solid solution of Al-4.5%Cu alloys had an additional linear expansion of ≈ 0.05 % at 643 K during thermal expansion measurement.

• 한국분말재료학회지
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• 제17권6호
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• pp.470-476
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• 2010

In this study, Cu-10Sn and Cu-10Sn-2Ni-0.2Si alloys have been manufactured by spray casting in order to achieve a fine scale microstructure and high tensile strength, and investigated in terms of microstructural evolution, aging characteristics and tensile properties. Spray cast alloys had a much lower microhardness than continuous cast billet because of an improved homogenization and an extended Sn solid solubility. Spray cast Cu-Sn-Ni-Si alloy was characterized by an equiaxed grain microstructure with a small-sized (Ni, Si)-rich precipitates. Cold rolling of Cu-Sn-Ni-Si alloy increased a tensile strength to 1220 MPa, but subsequent ageing treatment reduced a ultimate tensile strength to 780 MPa with an elongation of 18%.

• 대한금속재료학회지
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• 제50권4호
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• pp.293-299
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• 2012

Ultrafine-grained or nanostructured alloys usually lack the strain hardening capability needed to sustain uniform tensile deformation under high stresses. To circumvent this problem, we fabricated the Cu-based composite reinforced with the 3-dimensionally interconnected $Cu_5Zr$ phase using the combined technique of rapid quenching and subsequent hot-rolling. The alloy exhibited a tensile ductility of ~2.5% together with a strength of 1.57 GPa, which exceeds the values of most commercially available Cu-Be alloys. In this study, we elucidated the structural origin of the high strength and tensile ductility of the developed alloy by examining the thermal stability of the $Cu_5Zr$ reinforcing phase and the energy (work) absorption capability of the Cu matrix.

• 대한치과기공학회지
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• 제19권1호
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• pp.21-35
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• 1997

Au 함량이 20% 미만인 Au-Ag-Pd합금의 기초합금인 Ag-Pd-Cu 3원계 합금의 시효경화 특성을 규명할 목적으로 20wt% Pd 및 20wt% Cu의 용질농도구성비가 1이 되는 3원 합금과 여기에 2wt% Au의 첨가합금에 미치는 석출상의 영향을 분석, 조사하여 아래와 같은 결론을 얻었다. Ag-20wt% Pd-20wt% Cu 3원 함금은 ${\alpha}$의 단일상에서 Ag-rich의 ${\alpha}2$상 및 PdCu규칙상에 의하여 경화반응이 진행되며 연속승온과정에서 $100{\sim}300^{\circ}C$의 경도증가와 $300{\sim}500^{\circ}C$의 경도감소의 2단계 경화특성이 얻어졌다. 연속승온시효과정은 Au첨가에 관계없이 2단계의 석출반응이 저온영역에서는 stage I, stage II로 나타나고 stage I은 고온에서의 소입에 의해 도입된 과잉공공의 이동 및 소멸에 의한 반응이고 stage II는 평형농도의 공공확산에 의한 반응에 대응하였다. 또한 본 합금의 시효석출과정은 ${\alpha}\to{\alpha}+{\alpha}2+PdCu\to{\alpha}_1+{\alpha}_2+PdCu$이고 최대 경화는 ${\alpha}_1,\;{\alpha}_2$, PdCu의 3상공존구역에서 나타났다. 이들 석출반응은 입계반응이고 반응의 진행과 함께 경도값은 상승하며 경화능에 직접적으로 기여하였다. 또한 석출상은 미세한 lamella조직의 nodule을 나타내고 이들 ${\alpha}_1,\;{\alpha}_2$ 및 PdCu상과의 미세한 혼합상의 형성이 시효경화능에 기여하는 주된 원인이 되었다. 과시효는 lamella의 조대화와 PdCu상의 ${\alpha}_2$상으로의 용해에 따른 정량적 감소에 대응하였다. 본 합금의 시효열처리 온도는 $450^{\circ}C$가 적절하며 $1{\sim}120min$ 시효시간에 걸쳐서 소정의 경화특성을 얻을 수 있었다.

• Journal of Welding and Joining
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• 제25권3호
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• pp.57-63
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• 2007

Electrochemical migration characteristics of Pb-free solder alloys are quantitatively correlated with corrosion characteristics in harsh environment conditions. In-situ water drop test and corrosion resistance test for Sn-3.0Ag-0.5Cu solder alloys were carried out in NaBr and NaF solutions to obtain the electrochemical migration lifetime and pitting potential, respectively. Sn-3.0Ag-0.5Cu solder alloy shows similar ionization and electrochemical migration behavior with pure Sn because of Ag and Cu do not migrate due to the formation of resistant intermetallic compounds inside solder itself. Electrochemical migration lifetime in NaBr is longer than in NaF, which seems to be closely related to higher pitting potential in NaBr than NaF solution. Therefore, it was revealed that electrochemical migration lifetime of Sn-3.0Ag-0.5Cu solder alloys showed good correlation to the corrosion resistance, and also the initial ionization step at anode side is believed to be the rate-determining step during electrochemical migration of Pb-free solders in these environments.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.389-393
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• 2007

The most demanded bimetals in home appliances are manufactured by mainly cladding process and these are mainly consist of Cu alloy and Ni alloy. But it is very difficult to clad these alloys, because the brittle ${Cu_3}{O_4}$ oxide film formed easily on Cu alloy surface during cladding process. Clad rolling and heat treatment processes were applied for the development of bimetals by using the Ni alloy and the 3 types of Cu alloys. Optical microstructure was observed and micro-hardness, specific resistance, deflection were measured from the manufactured new bimetals specimens.

• 한국주조공학회지
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• 제15권4호
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• pp.416-421
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• 1995

Recently Al-Cu-P alloys are used to refine primary Si of hypereutectic Al-Si alloys. Because it has inside AlP compound that acts as nucleation site in the melt, Al-Cu-P alloy has good refinement effect in lower holding temperature and after shoter holding times. In this study Al-Cu-P refinement agent was made by mechanical alloying method. When Al-13.5wt%Cu-1.5wt%P was alloyed mechanically for 30hr in Ar atmosphere by high energy ball mill, it had the refinement effect that showed primary Si size of about $30{\mu}m$ in Al-20wt%Si at $760^{\circ}C$, treated for 15min.

• 한국정밀공학회지
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• 제10권2호
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• pp.146-153
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• 1993

Thd specimens were melited in high frequency induction furnace. The samples for measurements were prepared by machining cylinder of 9.5mm diameter and 15mm height. These samples were then hot-pressed according to strain rate ( .epsilon. ). These samples were decanned and cut out, and subsequently heat treated at 1000 .deg. C for 4hours. These were investigated for the change of microstructure, domain pattern, X-ray diffraction and magnetic properties. The stress distributions in the specimens during compressing process were calculated by a finite element method program(SPID). The calculated stresses were effective stress( .sigma. $_{eff}$), compressive direction stress( .sigma. $_{z}$), and shear stress( .tau. $_{rz}$ ). These stresses were compared with the experimental data.a.a.