• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.640-644
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• 2000

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, Ag$_3$Sn and Cu$\sub$6/Sn$\sub$5/ phases in the matrix Sn and 1∼2$\mu\textrm{m}$ thick Cu$\sub$6/Sn$\sub$5/ Phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5AAg/A11oy42, only Ag$_3$Sn Phase of low density in the matrix Sn and 0.5∼1.5$\mu\textrm{m}$ thick FeSn$_2$phase at the interface of solder/lead-frame were formed. Comparing to Cu, Alloy42 shear strength of Alloy 42 solder joints was smaller than that of Cu and all declined after aging. After aging at 180$^{\circ}C$ for 1 week, η-Cu$\sub$6/Sn$\sub$5/ layer was formed on Cu lead-frame, while AgSn$_3$ phase in the matrix and thickened FeSn$_2$at the interface were formed on Alloy42 lead-frame.

• Journal of Korea Foundry Society
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• v.42 no.5
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• pp.273-281
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• 2022

In order to understand the solidification behavior and microstructural evolution of the Al-Cu-Si ternary eutectic alloy system, changes of the microstructure of the Al-Cu-Si ternary eutectic alloy with different cooling rates were investigated. When the mold preheating temperature is 500℃, primary Si and Al2Cu dendrites are observed, with (α-Al+Al2Cu) binary eutectic and needle-shaped Si subsequently observed. In addition, even when the mold preheating temperature is 300℃, primary Si and Al2Cu dendrites can be observed, and both (α-Al+Al2Cu+Si) areas observed and areas not observed earlier appear. When the mold preheating temperature is 150℃, bimodal structures of the binary eutectic (α-Al+Al2Cu) and ternary eutectic (α-Al+Al2Cu+Si) are observed. When the preheating temperature of the mold is changed to 500℃, 300℃, and 150℃, the greatest change is in the Si phase, and upon reaching the critical cooling rate, the ternary eutectic of (α-Al+Al2Cu+Si) forms. If the growth of the Si phase is suppressed upon the formation of (α-Al+Al2Cu+Si), the growth of both Al and Cu is also suppressed by a cooperative growth mechanism. As a result of analyzing the Al-27wt%Cu-5wt%Si ternary eutectic alloy with a different alloy design simulation programs, it was confirmed that different results arose depending on the program. A computer simulation of the alloy design is a useful tool to reduce the trial and error process in alloy design, but this effort must be accompanied by a task that increases reliability and allows a comparison to microstructural results derived through actual casting.

• Journal of Powder Materials
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• v.7 no.1
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• pp.12-18
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• 2000

Effects of the microstrucrure of rapidy solidified Al-Pb-Cu-Mg alloys on the wear investigated. In order to overcome the miscility gap between Al and pb under equilibrium conditions, both in the solid and the liquid states, the alloy were rapidy solidifies to produce them in a segregation-free condition. Although the Pb particles showed relatively fine dispersion in the Al matrix in all the alloys by this process. the Al-16Pb alloy was found to have the most favorable microstructure with discretre with discrete Pb particles of abount 0.5 ${\mu}$m in size. With the addition of Cu and Cu-Mg to Al-16Pb, cellular structures were newly formed; not seen in the binary Al-Pb alloy. Wear properties of the Al-Pb binary alloys measured as a function of the sliding speen, sliding distance, and applied load showed that the Al-16Pb alloy has the best wear resistance, as expected from the fine microstructural features in this alloy. The were resistance of the alloy containing Cu-and Cu-Mg was higher than that of the Al-16Pvb alloy, due to matrix strengthening by precipitation hardeing. The wear mechanism was identified by examining the traces and wear debris.

• Applied Microscopy
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• v.26 no.2
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• pp.235-241
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• 1996

Amophization and decomposition behaviour in $Mg_{62}Cu_{26}Y_{12}$ alloy prepared by melt spinning method and wedge type metal mold casting method have been investigated by a detailed transmission electron microscopy. Amorphous phase has formed in melt-spun ribbon. In the case of the wedge type specimen, however, the amorphous phase has formed only around the tip area within about 2 mm thickness. The remaining part of the wedge type specimen consists of crystalline phases, $Mg_{2}Cu\;and\;Cu_{2}Y$. The supercooling for crystallization behaviour of the amorphous $Mg_{62}Cu_{26}Y_{12}$ alloy, ${\Delta}T_x$ has been measured to be about 60 K. Such a large undercooling of the crystallization bahaviour enables formation of the amorphous phase in the $Mg_{62}Cu_{26}Y_{12}$ alloy under the cooling rate of $10^{2}K/s$. The amorphous $Mg_{62}Cu_{26}Y_{12}$ has decomposed into crystalline phases, $Mg_{2}Cu\;and\;Cu_{2}Y$ after heat treatment at $170^{\circ}C\;and\;250^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.1
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• pp.21-28
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• 2002

Bismuth and Indium added Sn-Cu-Ni solder alloy was investigated for a new lead free solder. The thermal, electrical and mechanical properties were characterized for the Sn-0.7%(Cu+Ni) solder alloy by adding 2~5% Bi and 2~ 10% In. The melting point of solder alloy was in range of 200 to $222^{\circ}C$ and the mushy zone was in range of 20 to $37^{\circ}C$. This alloys could be adapted to middle and high temperature solder materials. A new solder alloy composition. Sn-0.7%(Cu+Ni) -3.5%Bi-2%In is very promising with high performance and effective cost. The melting point was $220^{\circ}C$, the mushy zone range was $25^{\circ}C$, and mechanical, electrical and wetting properties were competitive with those of other lead-free solder except the lower elongation value.

• Journal of Korea Foundry Society
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• v.20 no.2
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• pp.89-96
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• 2000

The effects of modification processing on the refinement of primary Si and the wear behavior of hyper-eutectic Al-Si alloys have been mainly investigated. Refining effects of primary Si in Al-17%Si alloy was more efficient than that of B.390 alloy. Optimum condition of getting the finest primary Si microstructure was when AlCuP modifier is added into the melt at $750^{\circ}C$ and held it at $700^{\circ}C$ for 30 minutes. Wear loss in the specimens of as-cast condition decreases as the size of primary Si decreases, in the order of B.390 alloy, B.390 alloy with AlCuP addition, Al-17%Si alloy and Al-17%Si alloy with AlCuP addition. Wear loss in the aged condition of Al-17%Si alloy, B.390 alloy and B.390 alloy with AlCuP addition decreased due to the increase of compressive residual stress in the matrix by the aging treatment. While, wear loss increased in the aged specimens of Al-17%Si alloy with AlCuP addition and Hepworth addition in which compressive residual stress decreases by the aging treatment. Therefore, it is assumed that higher compressive residual stress in the matrix can reduce the wear loss in composite materials such as hyper-eutectic Al-Si alloys.

• Journal of the Korean Chemical Society
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• v.47 no.4
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• pp.315-324
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• 2003

In this study, a new method is presented to produce stable hydrophobic metal alloy nanocluster in chloroform solution including surfactant NaAOT(sodium bis(2-ethylhexyl)-sulfosuccinate) via the chemical reduction of metal salt $(HAuCl_4,\AgNO_3,\Cu(NO_3)_2)$ by sodium borohydride. For the alloy nanocluster, several samples were prepared by changing the molar ratio of Au/Cu, Au/Ag alloy nanocluster, 3:1, 1:1, 1:3. The alloy nanoclusters were characterized by UV-Visible spectrophotometer, TEM(Transmission Electron Microscope), and XPS(X-ray Photoelectron Spectrometer). With the change of the mole ratio of the alloy component, the wavelengths of the surface plasmon absorption shift linearly from 520 nm of the pure Au nanocluster to 570 nm of the pure Cu nanocluster for Au/Cu alloy nanoclusters and from 405 nm to 520 nm for Au/Ag alloy nanoclusters. The chemical shifts of the Au4f, Ag3d, Cu2p XPS peaks were observed with changing the molar ratio of the alloy element. The alloy nanoclusters in chloroform solution were made uniformly in size and colloidally stable for long periods of time. These results indicate that the method here is a very effective method for synthesizing hydrophobic alloy nanoclusters with uniform or nearly uniform particle size distribution.

• Korean Journal of Materials Research
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• v.10 no.11
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• pp.770-777
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• 2000

Microstructure and mechanical properties of the $Cu_6Sn_5$-dispersed 63Sn-37Pb solder alloy, for which $Cu_6Sn_5$ powders less than $1{\mu\textrm{m}}$ size were fabricated by mechanical alloying, were characterizde and compared with those of the Cu-dispersed solder alloy. Compared to the $Cu_6Sn_5$-dispersed solder alloy, large amount of $Cu_6Sn_5$ and fast growth of $Cu_6Sn_5$ were observed in the Cu-dispersed alloy. The $Cu_6Sn_5$-dispersed solder alloy exhibited lower yield strength, but higher ultimate tensile strength than those of the Cu-dispersed alloy. With dispersion of 1~9 vol% $Cu_6Sn_5$ and Cu, the yield strength increased from 23 MPa and to 40 MPa, respectively. The ultimate tensile strength increased from 34.7 MPa to 45.3 MPa and to 43.1 MPa with dispersion of 5 vol% $Cu_6Sn_5$ and Cu, respectively.

• Journal of the Korean Society for Heat Treatment
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• v.20 no.5
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• pp.243-249
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• 2007

The age hardening behavior and mechanical properties of an extruded Al-Zn-Mg-(Cu)-0.1 wt.%Sc alloy were investigated with the Sc addition and ageing temperature. The results showed that the $Al_3Sc$ compounds were formed by Sc addition and distributed preferentially along the extrusion direction. The age hardening of Al-Zn-Mg-Cu-0.1 wt.%Sc alloy which was treated by T6 process was more significant than that of Al-Zn-Mg-0.1 wt.%Sc alloy. The tensile property of Al-Zn-Mg-Cu+0.1 wt.%Sc alloy was also higher than that of Al-Zn-Mg-0.1 wt.%Sc alloy, which is 691 MPa and 584 MPa in strength and 9% and 11% in elongation, respectively.

• Journal of the Korean Society for Heat Treatment
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• v.13 no.6
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• pp.391-397
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• 2000

Addition of Ca element and nonequilibrium heat treatment which promotes shape modification of eutectic Si and ${\beta}$ intermetallic compound were conducted to improve the mechanical properties of Al-Si-Cu alloy. Modification of eutectic Si and dissolution of needle-shape ${\beta}$ intermetallic compounds were possible by nonequilibrium heat treatment in which specimens were held at $505^{\circ}C$ for 2 hours in Al-Si-Cu alloy with Fe. Owing to the decrease in aspect ratio of eutectic Si by the heat treatment of the alloy with 0.33wt.% Fe, the increase in elongation was prominent to be more than double that in the as-cast specimen. Dissolution of needle-shape ${\beta}$ intermetallic compounds in the alloy with 0.85wt.% Fe led to the improvement of tensile strength as the length of ${\beta}$ compounds decreased to 50%.