• Journal of the Korean Ceramic Society
• /
• v.35 no.1
• /
• pp.55-65
• /
• 1998

The oxidation behavior of Ag-36.8a%Cu-7.4at%Ti alloy brazed on Si3N4 substrate was investigated at 400, 500 and 600$^{\circ}C$ in air. Under this experimental condition Si3N4 and Ag were not oxidized whereas Cu and Ti among the brazing alloy components were oxidizied obeying the parabolic oxidation rate law. The activation energy of oxidation was found to be 80kj/ mol which was smaller than that of pure Cu owing to the presence of oxygen active element of Ti. The outer oxide scale formed from the initial oxidation state was always composed of Cu oxides which were known to be growing by the outward diffusion of Cu ions. As the oxidation progressed the concentration gradient occurred due to the continuous consumption of Cu as Cu oxides and consequently build-up of an Ag-enriched layer below the Cu oxides resulted in the formation of multiple oxide scales composed of Cu oxide (CuO) /Ag-enriched layer/Cu oxide (Cu2O) /Ag-enriched layer. Also the inward diffusing of oxygen through Cu oxide and Ag-enriched layers led to the formation of internal oxides of TiO2.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.11a
• /
• pp.28-29
• /
• 2006

The magnetic properties of a series of both annealed and as-rolled Ni-$W_y$ alloy tapes with compositions y = 0, 1, 3, and 5 at.%, were studied. To compare with Ni-W alloys, the magnetic properties of a series of both annealed and as-rolled $[Ni_{97at.%}W_{3at.%}]_{100-x}Cu_x$ alloy tapes with compositions x = 0, 1, 3, 5 and 7 at.%, were studied, as well. Both the isothermal mass magnetization M(H) of a series of samples, such as both Ni-W and [Ni-W]-Cu alloy tapes, at different fixed temperatures and M(T) in fixed field, were measured using a PPMS-9 (Quantum Design). The degree of ferromagnetism of Ni-$W_y$ alloys have reduced as W-content y increases. Both the saturation magnetization $M_{sat}$ and Curie temperature $T_c$ decrease linearly with W-content y, and both $M_{sat}$ and $T_c$ go to zero at critical concentration of $y_c$ ~ 9.50 at.% W. The effect of Cu addition on both the saturation magnetization $M_sat$ and Curie temperature $T_c$ decrease linearly with Cu-content x in $[Ni_{97at.%}W_{3at.%}]_{100-x}Cu_x$ alloy tapes with compositions x = 0, 1, 3, 5, and 7 at.%. The results confirm that [Ni-W]-Cu alloy tapes can have much reduced ferromagnetism as Cu-content x increases.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
• /
• 2000.10a
• /
• pp.42-46
• /
• 2000

In this paper, joints of Cu-1Cr-0.1Zr alloy to STS316L were performed by friction welding method. Cu-1Cr-0.1Zr alloy is attractive candidate as nuclear power plant material and exibit the best combination of high sts good electrical and thermal conductivity of any copper alloy examined. The stainless steel is a structural material who alloy acts as a heat sink material for the surface heat flux in the first wall. So, in this paper, not only the develop optimizing of friction welding with more reliability and more applicabililty but also the development of in-process rear quility(such as strength and toughness) evaluation technique by acoustic emission for friction welding of such nuclear component of Cu-1Cr-0.1Zr alloy to STS316L steel were performed.

• Journal of Korea Foundry Society
• /
• v.21 no.4
• /
• pp.232-238
• /
• 2001

Experimental study on the twin roll strip casting of BCuP-5(Cu-15wt%Ag-wt5%P) alloy was carried out using laboratory scale horizontal type twin roll caster. In this study, among the various operating parameters, such as tundish angle, contact angle, pouring temperature, roll speed, presetting gap of the rolls and kinds of roll and tundish materials, effect of pouring temperature for strip casting of BCuP-5 alloy which has long freezing range of about $170^{\circ}C$ was mainly investigated. BCuP-5 alloy strip was successfully produced when pouring molten metal at lower temperature than its liquidus temperature. Microstructure of the cast strip consists of primary Cu and eutectic. Especially the size of primary Cu phase increased with decreasing of pouring temperature.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2007.10a
• /
• pp.143-145
• /
• 2007

The correlation between crystallization and deformation behavior in the supercooled liquid region (SLR) of a $Cu_{54}Ni_{6}Zr_{22}Ti_{18}$ bulk metallic glass (BMG) alloy is investigated by compression tests, differential scanning calorimetry (DSC), electron energy loss spectrometry (EELS) and high resolution transmission electron microscopy (HRTEM). In the SLR, This BMG alloy was strongly depended on the deformation temperature and the alloy exhibits important change in deformation behavior after a given time which is directly connected to the development of crystallization. Compressive stress impeded decomposition and consequently retarded forming of nano-crystal, which led to enlarge the homogeneous deformation region of the BMG alloy in SLR during compression test.

• KIEE International Transactions on Electrophysics and Applications
• /
• v.3C no.1
• /
• pp.23-27
• /
• 2003

Structural properties of Cu-Ni alloy films, such as preferred orientation, crystallite size, in-ter-planar spacing, cross-sectional morphology, and electrical resistivity, are investigated in terms of tar-get configurations that are used in the film deposition by means of magnetron co-sputtering. Two different target configurations are considered in this study: a dual-type configuration in which two separate tar-gets (Cu and Ni) and different bias types (RF and DC) are used and a Ni-on-Cu type configuration in which Ni chips are attached to a Cu target. The dual-type configuration appears to have some advantages over the Ni-on-Cu type regarding the accurate control of atomic composition of the deposited Cu-Ni alloy. However, the dual-type-produced film exhibits a porous and columnar structure, the relatively large internal stress, and the high electrical resistivity, which are mainly due to the relatively low mobility of adatoms. The affects of thermal treatment and deposition conditions on the structural and electrical properties of dual-type Cu-Ni films are also discussed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.32 no.2
• /
• pp.134-140
• /
• 2019

Oxide ($SnO_2$)/metal alloy (Cu(Ni))/oxide ($SnO_2$) multilayer films were fabricated using the magnetron sputtering technique. The oxide and metal alloy were $SnO_2$ and Ni-doped Cu, respectively. The structural, optical, and electrical properties of the multilayer films were investigated using X-ray diffraction (XRD), ultraviolet-visible (UV-vis) spectrophotometry, and 4-point probe measurements, respectively. The properties of the $SnO_2/Cu(Ni)/SnO_2$ multilayer films were dependent on the thickness and Ni doping of the mid-layer film. Since Ni atoms inhibit the diffusion and aggregation of Cu atoms, the grain growth of Cu is delayed upon Ni addition. For $250^{\circ}C$, the Haccke's figure of merit (FOM) of the $SnO_2$ (30 nm)/Cu(Ni) (8 nm)/$SnO_2$ (30 nm) multilayer film was evaluated to be $0.17{\times}10^{-3}{\Omega}^{-1}$.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.1193-1196
• /
• 2009

Low resistivity interconnection and high-mobility channel are required to realize ultrahigh-definition LCDs such as 4k ${\times}$ 2k TVs. We evaluated fully Cu-based gate and Source/Drain interconnections, consisting of stacked pure-Cu/Cu-Mn layers for TFT-LCDs, and found the underlying Cu-Mn alloy film has superior adhesion to glass substrates and CVD-SiOx films. It was also confirmed that wet etching of the Cu/Cu-Mn films without residues and low contact resistance with both channel IGZO and pixel ITO films can be obtained. It is thus considered that the stacked Cu/Cu-Mn structure is one of candidates to replacing conventionally pure-Cu/refractory metal.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2003.10a
• /
• pp.55-59
• /
• 2003

Rotor in small-medium induction motor has been usually manufactured by aluminum diecasting. In order to improve efficiency of induction motors, however, it is desirable that pure aluminum is replaced by high electrical conductivity copper alloy. For this purpose, a rotor is thixoformed with Cu-Ca alloy. Thermomechanical processing(TMP) is carried out to modify the semi-solid microstructure of the alloy and final microstructures and filling defects of thixoformed Cu- rotors are investigated. The characteristics of thixoformed Cu-rotor such as motor efficiency and torque are compared with those of Al rotor.

• Journal of Korea Foundry Society
• /
• v.21 no.5
• /
• pp.286-289
• /
• 2001

The glass formation behavior was investigated in the melt spun Zr-Ti-Cu-Ni-X (X=B, P and Si) ribbons. The magnitude of supercooled liquid region of Zr-Ti-Cu-Ni alloy increased with an addition of alloying element. The glass transition temperature and the crystallization temperature increased and the magnitude of supercooled liquid region decreased with increasing the content of alloying elements. The largest supercooled liquid region was observed in the Si containing alloy. This is believed to be due to the dense atom packing with the optimum atomic size ratio of constituent elements.