• 소성∙가공
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• 제29권3호
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• pp.135-143
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• 2020

Low-cost alloying elements were added to a modified Al-6.5Si alloy and its microstructure, tensile and impact toughness properties were investigated. The alloying elements added were Mg, Zn, and Cu, and two kinds of alloy A (Mg:0.5, Zn:1, Cu:1.5 wt.%) and alloy B (Mg:2, Zn:1.5, Cu:2 wt.%) were prepared. In the as-cast Al-6.5Si alloys, Si phases were distributed at the dendrite interfaces, and Al₂Cu, Mg₂Si, Al₆ (Fe,Mn) and Al₅ (Fe,Mn)Si precipitates were also observed. The size and fraction of casting defects were measured to be higher for alloy A than for alloy B. The secondary dendrite arm spacing of alloy B was finer than that of alloy A. It was confirmed by the JMatPro S/W that the cooling rate of alloy B could be more rapid than alloy A. The alloy B had higher hardness and strength compared to the values of alloy A. However, the alloy A showed better impact toughness than alloy B. Based on the above results, the deformation mechanism of Al-6.5Si alloy and the improving method for mechanical properties were also discussed.

• 한국전기전자재료학회논문지
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• 제30권6호
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• pp.376-380
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• 2017

In this paper, we prepared a metal alloy resistor with stable thermal electro motive force (thermal EMF) as well as a low temperature coefficient of resistance (TCR) by adjusting the manganese proportion from 3 to 12 wt% in the Cu-Mn-Ni alloy. Composition of the fabricated metal alloy was investigated using energy dispersive X-ray (EDX) analysis. The TCR of each sample was measured as 44.56, 40.54, 35.60, and 31.56 ppm for Cu-3Mn-2Ni, Cu-5Mn-2Ni, Cu-10Mn-2Ni, and Cu-12Mn-2Ni, respectively. All the resistor samples were available for the F grade (${\pm}1%$ of the allowable error of resistance) high-precision resistor. All the samples satisfied the baseline of high thermal EMF (under 3 mV at $60^{\circ}C$); however, Cu-3Mn-2Ni and Cu-5Mn-2Ni satisfied the baseline of low thermal EMF (under 0.3 mV at $25^{\circ}C$). We were thus able to design and fabricate the metal alloy resistor of Cu-3Mn-2Ni and Cu-5Mn-2Ni to have low TCR and stable thermal EMF at the same time.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.501-502
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• 2010

• 한국재료학회지
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• 제20권2호
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• pp.60-64
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• 2010

This study looked at high performance copper-based alloys as LED lead frame materials with higher electrical-conductivity and the maintenance of superior tensile strength. This study investigated the effects on the tensile strength, electrical conductivity, thermal softening, size and distribution of the precipitation phases when Cr was added in Cu-Fe alloy in order to satisfy characteristics for LED Lead Frame material. Strips of the alloys were produced by casting and then properly treated to achieve a thickness of 0.25 mm by hot-rolling, scalping, and cold-rolling; mechanical properties such as tensile strength, hardness and electrical-conductivity were determined and compared. To determine precipitates in alloy that affect hardness and electrical-conductivity, electron microscope testing was also performed. Cr showed the effect of precipitation hardened with a $Cr_3Si$ precipitation phase. As a result of this experiment, appropriate aging temperature and time have been determined and we have developed a copper-based alloy with high tensile strength and electrical-conductivity. This alloy has the possibility for use as a substitution material for the LED Lead Frame of Cu alloy.

• 한국해양공학회지
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• 제15권2호
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• pp.88-93
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• 2001

In this paper, joints of Cu-1Cr-0.1Zr alloy to STS316L were performed by friction welding method. Particularly, Cu-1Cr-0.1Zr alloy is attractive candidate as nuclear power plant material and exibit the best combination of high strength and good electrical and thermal conductivity of any copper alloy examined. The stainless steel is a structural material while copper alloy acts as a heat sink material for the surface heat flux in the first wall. So, in this paper, not only the development of optimizing of friction welding with more reliability and more applicability but also the development of in-process real-time weld quality (such as strength and toughness) evaluation technique by acoustic emission for friction welding of such nuclear reactor component of Cu-1Cr-0.1Zr alloy to STS316L steel sere performed.

• 대한금속재료학회지
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• 제48권3호
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• pp.248-255
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• 2010

The effect of various alloying elements and melt treatment on the microstructural control of Al-Sn metallic bearing alloy was investigated. The thickness of tin film crystallized around primary aluminum decreased with the addition of 5% Cu in Al-Sn alloy, with tin particles being reduced in size by intervening the Ostwald ripening. With the addition of Si in Al-10%Sn alloy, the tin particles were crystallized with eutectic silicon, resulting in uniform distribution of tin particles. With the addition of Cu and Si in Al-Sn alloy, both the tensile strength and yield strength increased, with the increasing rate of yield strength being less than that of tensile strength. Although the Al-10%Sn-7%Si alloy has similar tensile strength compared with Al-10%Sn-5%Cu, the former showed superior abrasion resistance, resulting from preventing the tin particles from movement to the abrasion surface.

• 한국분말재료학회지
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• 제20권2호
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• pp.138-141
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• 2013

The microstructure evolution during sintering of the W-5 wt.%Cu nanocomposite powders was investigated for the purpose of developing a high density W-Cu alloy. The W-5 wt.%Cu nanopowder compact, fully-densified during sintering at 1623 K, revealed a homogeneous microstructure that consists of high contiguity structures of W-W grains and an interconnected Cu phase located along the edges of the W grains. The Vickers hardness of the sintered W-5 wt.%Cu specimen was $427{\pm}22$ Hv much higher than that ($276{\pm}19$ Hv) of the conventional heavy alloy. This result is mostly due to the higher contiguity microstructure of the W grains compared to the conventional W heavy alloy.

• 소성∙가공
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• 제14권7호
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• pp.642-648
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• 2005

Rotor in small-medium induction motor has been usually manufactured by aluminum diecasting. In order to improve the efficiency of induction motors, newly developed Cu-Ca alloys have been investigated. The electrical conductivity in the Cu alloys containing Ca less than $1.0wt\%$ was higher than $80\%$ IACS. Cu-Ca alloy is desirable for the thixoforming process because it has wide semi-solid range over $150^{\circ}C$. In this study, Cu-rotor with thixoforming process was developed to replace the conventional aluminum diecasting rotor. Analysis was performed for the microstructure of thixoforming rotor. Effect of incomplete filling on the efficiency of induction motor was discussed.

• Applied Microscopy
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• 제24권4호
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• pp.132-144
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• 1994

The application of TEM in investigating the evolution of microstructure during solid phase crystallization of the amorphous Si, $Si_{1-x}Ge_x,\;and\;Si_{1-x}Ge_x/Si$ films deposited on $SiO_2$ substrate, in identifying the failure mechanism of the TiN barrier layer in the Cu-metallization scheme, and in comparing the microstructure of the as-deposited Cu-Cr and Cu-Ti alloy films are discussed. First, it is identified that the evolution of microstructure in Si and $Si_{1-x}Ge_x$ alloy films strongly depends on the concentration of Ge in the film. Second, the failure mechanism of the TiN diffusion barrier in the Cu-metallization is the migration of the Cu into the Si substrate, which results in the formation of a dislocation along the Si {111} plane and precipitates (presumably $Cu_{3}Si$) around the dislocation. Finally, the microstructure of the as-deposited Cu-Cr and Cu-Ti alloy films is also quite different in these two cases. From these several cases, we demonstrate that the information which we obtained using TEM is critical in understanding the behavior of materials.

• 한국분말재료학회지
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• 제10권3호
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• pp.164-167
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• 2003

The mechanical alloying effect has been studied on the three Cu-based alloy systems with a positive heat of mixing. The extended bcc solid solution has been formed in the Cu-V system and an amorphous phase in the Cu-Ta system. However, it is round that a mixture of nanocrystalline Cu and Mo Is formed in the Cu-Mo system. The neutron diffraction has been employed at a main tool to characterize the detailed amorphization process. The formation of an amorphous phase in Cu-Ta system can be understood by assuming that the smaller Cu atoms preferentially enter into the bcc Ta lattice during ball milling.