• Title/Summary/Keyword: Cu Alloy

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Precipitation Behavior of Al-Zn-Mg-Cu-(Sc) Alloy (Al-Zn-Mg-Cu-(Sc) 합금의 석출특성)

  • Choi, G.S.;Mun, H.J.;Woo, K.D.
    • Journal of the Korean Society for Heat Treatment
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    • v.19 no.5
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    • pp.257-261
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    • 2006
  • Scandium(Sc) in Al-Zn-Mg-Cu based Al alloy on precipitation phenomenon was compared to a 7001(Al-7.2%Zn-3.2%Mg-1.8%Cu) Al alloy. GP zone and ${\eta}^{\prime}$ phases were the main strengthening phases at low aging temperature under $100^{\circ}C$, but ${\eta}^{\prime}$ and $Al_3Sc$ phases were the main strengthening phases at high aging temperature above $1600^{\circ}C$ in Sc added 7000(Al-7.7%Zn-2.0%Mg-1.9%Cu-0.1%Zr) Al alloy. With the addition of 0.1%Sc in 7000 Al alloy, the activation energy for the GP zone, ${\eta}^{\prime}$ and ${\eta}$ phase decreased compared to the 7001 Al alloy. This result indicates that the Sc accelerated the precipitation for the GP zone, ${\eta}^{\prime}$ and ${\eta}$ phases in 7000 Al alloy. Al-7.7%Zn-2.0%Mg-1.9%Cu-0.1%Zr-0.1 Sc alloy has higher strength than 7001 Al alloy, which has high strength.

Strengthening method of a porcelain fused Au-Pt-Cu-0.5In alloy (도재소부용 금속구조물의 강화방법)

  • Lee, Sang-Hyeok;Doh, Jung-Mann;Jung, Ho-Yeon
    • Journal of Technologic Dentistry
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    • v.25 no.1
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    • pp.63-70
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    • 2003
  • The microstructure and hardness of a porcelain fused Au-Pt-Cu-In alloy was investigated using optical microscopy, secondary electron microscopy, electron probe microanalyzer, transmission electron microscope, and vickers hardness. The hardness of the heat-treated Au-Pt-Cu-In quartenary alloy reached a maximum value in 30 min at 550$^{\circ}C$ in the range of 150 to 950$^{\circ}C$. In the aged Au-Pt-Cu-0.5In alloy at 550$^{\circ}C$, the hardness of the alloy rapidly increased until 30min with increasing aging time and after that it was remained nearly constant value. Based on above results, glazing and final aging of the porcelain fused Au-Pt-Cu-0.5In alloy were performed at 920 and 550$^{\circ}C$, respectively. The hardness of Au-Pt-Cu-0.5In alloy glazed at 920$^{\circ}C$ was 90 Hv and that of the alloy aged for 30 min at 550$^{\circ}C$ increased to 160 Hv. This indicates that a ceramic-metal crown with high strength can be manufactured using the glazing at 920$^{\circ}C$ and followed final aging at 550$^{\circ}C$ for 30 min.

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Alloy Design and Powder Manufacturing of Al-Cu-Si alloy for Low-Temperature Aluminum Brazing (저온 알루미늄 브레이징용 Al-Cu-Si-Sn 합금 설계 및 분말 제조)

  • Heeyeon Kim;Chun Woong Park;Won Hee Lee;Young Do Kim
    • Journal of Powder Materials
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    • v.30 no.4
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    • pp.339-345
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    • 2023
  • This study investigates the melting point and brazing properties of the aluminum (Al)-copper (Cu)-silicon (Si)-tin (Sn) alloy fabricated for low-temperature brazing based on the alloy design. Specifically, the Al-20Cu-10Si-Sn alloy is examined and confirmed to possess a melting point of approximately 520℃. Analysis of the melting point of the alloy based on composition reveals that the melting temperature tends to decrease with increasing Cu and Si content, along with a corresponding decrease as the Sn content rises. This study verifies that the Al-20Cu-10Si-5Sn alloy exhibits high liquidity and favorable mechanical properties for brazing through the joint gap filling test and Vickers hardness measurements. Additionally, a powder fabricated using the Al-20Cu-10Si-5Sn alloy demonstrates a melting point of around 515℃ following melting point analysis. Consequently, it is deemed highly suitable for use as a low-temperature Al brazing material.

The Effect of Cu Reflow on the Pd-Cu Alloy Membrane Formation for Hydrogen Separation (수소분리용 Pd-Cu 합금 분리막의 Cu Reflow 영향)

  • Mun, Jin-Uk;Kim, Dong-Won
    • Journal of the Korean institute of surface engineering
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    • v.39 no.6
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    • pp.255-262
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    • 2006
  • Pd-Cu alloy membrane for hydrogen separation was fabricated by sputtering and Cu reflow process. At first, the Pd and Cu was continuously deposited by sputtering method on oxidized Si support, the Cu reflow process was followed. Microstructure of the surface and permeability of the membrane was investigated depending on various reflow temperature, time, Pd/cu composition and supports. With respect to our result, Pd-Cu thin film (90 wt.% Pd/10 wt.% Cu) deposited by sputtering process with thickness of $2{\mu}m$ was heat-treated for Cu reflow The voids of the membrane surface were completely filled and the dense crystal surface was formed by Cu reflow behavior at $700^{\circ}C$ for 1 hour. Cu reflow process, which is adopted for our work, could be applied to fabrication of dense Pd-alloy membrane for hydrogen separation regardless of supports. Ceramic or metal support could be easily used for the membrane fabricated by reflow process. The Cu reflow process must result in void-free surface and dense crystalline of Pd-alloy membrane, which is responsible for improved selectivity oi the membrane.

Interrelationship between Structure and Mechanical Properties of Al-Cu-Li-X(In,Be) Alloy (Al-Cu-Li-X(In,Be) 합금(合金)의 조직(組織)과 기계적성질(機械的性質)의 상호관계(相互關係))

  • Lee, Sung-Ho;Lee, Jong-Soo;Kim, Suk-Won;Woo, Kee-Do
    • Journal of Korea Foundry Society
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    • v.15 no.4
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    • pp.351-359
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    • 1995
  • The effects of In and Be additions on the aging behaviors and mechanical properties in the Al-Cu-Li alloy were investigated using the transmission electron microscope, the scanning electron microscope, hardness and tensile strength measurement. The aging is promoted and the double hardness peak is appeared by the addition of In and Be in the Al-Cu-Li alloy. The strength is increased, but the elongation and toughness are decreased by the addition of In in the Al-Cu-Li alloy. And the Al-Cu-Li-In-Be alloy has good combination with the strength, the elogation and toughness than Al-Cu-Li-In alloy.

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Effect of Sc Addition on the Microstructure Modification of Al-6Si-2Cu Alloy (Sc 첨가에 따른 Al-6Si-2Cu 합금의 미세조직 개량화)

  • An, Seongbin;Kim, Chungseok
    • Journal of the Korean Society for Heat Treatment
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    • v.35 no.3
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    • pp.150-158
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    • 2022
  • The effects of scandium addition on the Al-6Si-2Cu Alloy were investigated. The Al-6Si-2Cu-Sc alloy was prepared by gravity die casting process. In this study, scandium was added at 0.2 wt%, 0.4 wt%, 0.8 wt%, and 1.0 wt%. The microstructure of Al-6Si-2Cu-Sc alloy was investigated using Optical Microscope, Field Emission Scanning Electron Microscope, Electron Back Scatter Diffraction, and Transmission Electron microscope. The microstructure of Al-6Si-2Cu alloy with scandium added changed from dendrite structure to equiaxed crystal structure in specimens of 0.4 wt% Sc or more, and coarse needle-shape eutectic Si and β-Al5FeSi phases were segmented and refined. The nanosized Al3Sc intermetallic compound was observed to be uniformly distributed in the modified Al matrix.

Cu-based Bulk Amorphous Alloys in the Cu-Zr-Ti-Ni-Pd System (Cu-Zr-Ti-Ni-Pd계 비정질 벌크합금의 형성과 성질)

  • Kim, Sung-Gyoo;Bae, Cha-Hurn
    • Journal of Korea Foundry Society
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    • v.22 no.6
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    • pp.304-308
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    • 2002
  • The new Cu-Zr-Ti-Ni-Pd amorphous alloy system has been introduced and manufactured using melt-spinning and Cu-mold die casting methods. Amorphous formability, the supercooled liquid region before crystallization and mechanical properties of the alloys were examined. The reduced glass transition temperature(Trg = Tg/Tm) and the supercooled liquid region(${\Delta}$Tx = Tx-Tg) of $Cu_{49}Zr_{30}Ti_{10}Ni_5Pb_6$ alloy were 0.620 and 57 K respectively. $Cu_{49}Zr_{30}Ti_{10}Ni_5Pb_6$ amorphous alloy was produced in the rod shape with 2mm diameter using the Cu-mold die casting. The hardness value of the amorphous bulk alloy was 432 DPN.

Microstructural Evolution in CuCrFeNi, CuCrFeNiMn, and CuCrFeNiMnAl High Entropy Alloys

  • Hyun, Jae Ik;Kong, Kyeong Ho;Kim, Kang Cheol;Kim, Won Tae;Kim, Do Hyang
    • Applied Microscopy
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    • v.45 no.1
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    • pp.9-15
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    • 2015
  • In the present study, microstructural evolution in CuCrFeNi, CuCrFeNiMn, and CuCrFeNiMnAl alloys has been investigated. The as-cast CuCrFeNi alloy consists of a single fcc phase with the lattice parameter of 0.358 nm, while the as-cast CuCrFeNiMn alloy consists of (bcc+fcc1+fcc2) phases with lattice parameters of 0.287 nm, 0.366 nm, and 0.361 nm. The heat treatment of the cast CuCrFeNiMn alloy results in the different type of microstructure depending on the heat treatment temperature. At $900^{\circ}C$ a new thermodynamically stable phase appears instead of the bcc solid solution phase, while at $1,000^{\circ}C$, the heat treated microstructure is almost same as that in the as-cast state. The addition of Al in CuCrFeNiMn alloy changes the constituent phases from (fcc1+fcc2+bcc) to (bcc1+bcc2).

Effect of Additional Ag Layer on Corrosion Protection of Cu-Electrodeposited AZ31 Mg Alloy

  • Phuong, Nguyen Van;Moon, Sungmo
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2017.05a
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    • pp.97-97
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    • 2017
  • This study investigated the corrosion protection by electrodeposited copper layer on AZ31 Mg alloy with and without additional silver layer by immersion test, salt spray test, OCP transient and potentiodynamic polarization experiment. The single electrodeposited Cu layer on AZ31 Mg alloy showed a nodular structure with many imperfections of crevices between the nodules, which resulted in the fast initiation of pitting corrosion within first few hours of immersion. Double-layer coating of Cu and outer Ag layer slightly increased the initiation time for pitting corrosion. Triple-layer coatings of Cu/Ag/Cu exhibited the most efficient corrosion protection of AZ31 Mg alloy, compared to the single- and double-layer coatings. Surface morphology of the outer Cu layer in the triple-layer was changed from the nodular structure to fine particle structure with no crevices due to the presence of an additional Ag layer. Thus, the improved corrosion resistance of AZ31 Mg alloy by electrodeposited Cu/Ag or Cu/Ag/Cu layers is readily ascribed to the decreased number of imperfections in the electrodeposited layers due to the additional silver layer. It is concluded that the additional silver layer provides many nucleation sites for the second Cu plating, resulting in the formation of finer and denser structure than the first Cu electrodeposit.

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Microstructural Feature and Aging Characteristics of Spray-Formed Cu-5Ni-10Sn Alloy (가스분무성형 Cu-5Ni-10Sn 합금의 미세조직 및 시효강화)

  • Roh, Dae-Gyun;Kang, Hee-Soo;Baik, Kyeong-Ho
    • Journal of Powder Materials
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    • v.19 no.4
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    • pp.317-321
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    • 2012
  • In this study, Cu-5Ni-10Sn(wt%) spinodal alloy was manufactured by gas atomization spray forming, and the microstructural features and mechanical properties of Cu-5Ni-10Sn alloy have been investigated during homogenization, cold working and age-hardening. The spray formed Cu-5Ni-10Sn alloy consisted of an equiaxed microstructure with a mixture of solid solution ${\alpha}$-(CuNiSn) grains and lamellar-structure grains. Homogenization at $800^{\circ}C$ and subsequent rapid quenching formed a uniform solid solution ${\alpha}$-(CuNiSn) phase. Direct aging at $350^{\circ}C$ from the homogenized Cu-5Ni-10Sn alloy promoted the precipitation of finely distributed ${\gamma}$' or ${\gamma}-(Cu,Ni)_3Sn$ phase throughout the matrix, resulting in a significant increase in microhardness and tensile strength. Cold working prior to aging was effective in strengthening Cu-5Ni-10Sn alloy, which gave rise to a maximum tensile strength of 1165 MPa. Subsequent aging treatment slightly reduced the tensile strength to 1000-1100 MPa due to annealing effects.