• 한국표면공학회지
• /
• 제38권2호
• /
• pp.49-54
• /
• 2005

Flexible copper clad laminates (FCCL) fabricated by sputtering has advantages in fine pitch etching and dimensional accuracy than previous casting or laminating type FCCL, But its lower adhesion is inevitable technical challenge to solve for commercializing it. Chromium (Cr) which strongly reacts with O moiety was used as tie-coating layer in order to improve low adhesion between copper (Cu) and polyimide (PI). Sputtering raw polyimide (SRPI) and casting raw polyimide (CRPI) were used as substrates at this research. PI was pretreated by plasma before sputtering, and each sample was varied with RF power and Cr thickness on sputtering. Peel strength of the FCCL on SRPI was higher than that on CRPI. Adhesion had maximum value when 10 nm of Cr was deposited on SRPI by RF power of 50 W. It seems to be by the formation of Cu-Cr-O solid solution at the metal-PI interface.

• 한국진공학회지
• /
• 제4권S2호
• /
• pp.1-7
• /
• 1995

Cu(400$\AA$)/Polyimide has been mixed with 80 keV Ar+ and N2+from 1.0X1015ions/$\textrm{cm}^2$ to 2.0X1016 ions/$\textrm{cm}^2$. The changes of chemical bond and internal properties of sample are investigated by X-ray photoelectron spectroscopy(XPS). The quantitative adhesion strength is measured by using scratch test. The optimized mixing condition is that Cu/PI is irradiated with 80 keV N2+ at a dose of 1.0X1015 ions/$\textrm{cm}^2$, because N2+ ions can product more pyridine-like moiety, amide group, and tertiary amine moiety which are known as adesion promoters than Ar+.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 1997년도 제13회 학술발표회 논문개요집
• /
• pp.126-127
• /
• 1997

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 1997년도 제13회 학술발표회 논문개요집
• /
• pp.128-129
• /
• 1997

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 1997년도 제13회 학술발표회 논문개요집
• /
• pp.134-134
• /
• 1997

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 1995년도 제9회 학술발표회 논문개요집
• /
• pp.135-135
• /
• 1995

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2006년도 춘계학술발표회 초록집
• /
• pp.144-144
• /
• 2006

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2003년도 춘계학술발표회 초록집
• /
• pp.88-88
• /
• 2003

• 마이크로전자및패키징학회지
• /
• 제10권2호
• /
• pp.39-47
• /
• 2003

감광성 폴리이미드 위에 Cr을 RF 바이어스 스퍼터링 및 RF클리닝 후 DC 스퍼터링한 Cr/폴리이미드의 계면을 TEM으로 관찰하였다. RF power 밀도를 $0.13W/cm^2$에서 $2.12W/cm^2$로 증가시키면서 RF클리닝을 실시한 결과 폴리이미드의 에칭 양상이 둥근 모양에서 뾰족한 모양으로 변하였고 이방성 에칭으로 인해 거칠기가 크게 증가하였다. RF 바이어스 스퍼터링의 경우 RF power를 올리는 동안 RF 클리닝에 의해 폴리이미드가 에칭되었고, 에칭된 부분에 Cr이 증착된 계면을 단면으로 관찰한 결과 Cr과 폴리이미드가 겹쳐져서 혼합된 것처럼 보였다. 그러나 RF power를 올리는 시간을 단축시켜 Cr을 바이어스 스퍼터링했을 때에는 계면이 분명하게 관찰되어 Cr의 implantation이 일어나지 않았음을 알 수 있었다. RF 클리닝한 Cu/Cr/Polyimide를 필 테스트한 결과 짧은 시간의 RF 클리닝으로도 접착력이 크게 증가하였다. 그러므로 RF power를 올리는 동안 실시되었던 RF 클리닝이 RF 바이어스 스퍼터링한 Cr/Polyimide의 접착력 향상에 영향을 주었을 것으로 예상된다.

• 한국표면공학회지
• /
• 제50권3호
• /
• pp.164-169
• /
• 2017

Ni-Cr-X ternary interlayers were investigated to improve the adhesion of Cu/Ni-Cr/Polyimide flexible copper clad laminates. The ternary compounds are sputtered Ni-Cr-X films (where X is one of Nb, V, Mo, or Ti), and the effect of third elements on the adhesion was evaluated and investigated chemically and mechanically. The feel strength was higher in the order of Ni-Cr-Nb > Ni-Cr-V > Ni-Cr > Ni-Cr-Mo > Ni-Cr-Ti. Nb, which has a comparable standard electrode potential to Cr, increased the adhesion, while Ti, with a low standard electrode potential, degraded the adhesion. The Ni-Cr-Nb interlayer was amorphous, while Ni-Cr-Ti was partially crystalline. The similar morphology structure of the Ni-Cr-Nb interlayer with polyimide resulted in a better adhesion.