• Title/Summary/Keyword: Cu(copper)

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Recovery of copper from the copper converter slag(II) (동제연소 전노슬래그로부터 동의 회수(II))

  • Oh, Jae-Hyun;Kim, Mahn;Kim, Mi-Sung;Yoo, Taik-Soo
    • Resources Recycling
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    • v.2 no.4
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    • pp.33-41
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    • 1993
  • In recovering copper from the copper converter slag, various separation methods, such as flotation, sieving and magnetic separation had been tried. The copper converter slag used in this study was prepared in two ways, i.e. 2 hour cooled and 10 hour cooled. From the flotation of copper slag, 45% Cu concentrate is obtained and the amount of copper recovery is about 93%. Before the flotation, copper in the slag could be also pre-recovered using sieving and separation. It is also found that as the content of copper in the concentrate increa-ses, that of arsenic increase, while zinc and iron contents decrease.

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Adhesion Improvement for Copper Process in TFT-LCD

  • Tu, Kuo-Yuan;Tsai, Wen-Chin;Lai, Che-Yung;Gan, Feng-Yuan;Liau, Wei-Lung
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.1640-1644
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    • 2006
  • The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

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Evaluation of Zinc and Copper Status in Korean College Women (일부 여대생의 구리와 아연 영양상태 평가)

  • 김정혜
    • Journal of Nutrition and Health
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    • v.32 no.3
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    • pp.277-286
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    • 1999
  • This study was conducted to assess dietary intake and nutritional status of zinc and copper in Korean college women. Dietary survey was conducted by 24-hour recall method and fasting serum samples were collected from 111 apparently healthy subjects. Intake levels of zinc and copper were calculated using newly developed database for Zn & Cu of Korea food. Serum levels of Zn, Cu and activities of ALP, EC-SOD were measured from fasting serum sample. Mean daily zinc and copper intakes were 6.72mg/day(56.0% RDA) and 1.11mg/day respectively. Mean values of serum ALP activity, zinc and copper concentration were 43.9U/L, 14.8umol/1, 15.5umol/1and these values were mostly within normal range. EC-SOD activitis of the subjects were low and had no correlation with intake or serum levels of Zn, Cu. In conclusion, these results show that zinc and copper intake of Koran college women are lower than those from other counties but higher than those of adults in rural area of Korea. Their serum levels of Zn, Cu, ALP are relatively normal. These results indicate that marginal deficiency of Zn and Cu may be quite prevalent in these subjects but serum indicators measured may not be sensitive enough to detect such marginal deficiency. Further study in needed to develop a biochemical index sensitive enough to evaluate Zn and Cu status.

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Study on the Preparation of Copper Sulfate by Copper Powder using Cation Membrane Electrowinning Prepared from Waste Cupric Chloride Solution (염화동 폐액으로부터 양이온격막 전해 채취된 구리 분말을 이용한 황산동의 제조방법 연구)

  • Kang, Yong-Ho;Hyun, Soong-Keun
    • Resources Recycling
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    • v.28 no.1
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    • pp.62-72
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    • 2019
  • Generally, $H_2SO_4$ and Cu metal are used as raw materials for producing copper sulfate. The study relates to a method for producing copper sulfate using electrowinning from a waste solution of copper chloride. Uses are used for copper plating for industry, plating, feed, agriculture, electronic grade PCB. Conventional methods for producing copper sulfate have a problem of a large amount of waste water and a high energy cost. A study on the production method of copper sulfate ($CuSO_4$), which is the most used among copper (Cu) compounds, has a low process operation ratio, a small amount of waste water, and a simple manufacturing process. It is easy to remove Na, Ca, Mg, and Al as impurities by using a cationic membrane. At the same time, high purity copper powder could be recovered by an electrowinninng method. Using the recovered copper powder, high purity copper sulfate could be produced.

Deposition of copper dots with new copper precursors (새로운 Copper 전구체를 이용한 구리점 증착)

  • Kang, Sang-Woo;Seong, Dae-Jin;Shin, Yong-Hyoen;Rhee, Shi-Woo;Yun, Ju-Young
    • Journal of the Korean Vacuum Society
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    • v.15 no.5
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    • pp.485-492
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    • 2006
  • Two new copper(I) complexes with organic ligands, $[Cu^I(hfac)]_2(DVTMSO)$ and $[Cu^I(hfac)]_2(HD)$ (hfac=hexafluoroacetylacetonate, DVTMSO=1,2-divinylte-tramethyl-disiloxane, HD=1,5-hexadiene) were synthesized and used for copper metal-organic chemical vapor deposition. In these compounds, two Cu(hfac) fragments are bonded by one neutral ligand forming unusual structure with respect to other Cu(I) complexes. The compounds exhibited relatively high volatility and stability when compared to other copper(I) precursors. By using the reported compounds as precursors, a continuous Cu layer was not formed but the Cu islands were only observed. And the shape and size of Cu islands are significantly changed as a function of the substrate temperature.

Manufacturing of Copper(II) Oxide Powder for Electroplating from NaClO3 Type Etching Wastes

  • Hong, In Kwon;Lee, Seung Bum;Kim, Sunhoe
    • Journal of Electrochemical Science and Technology
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    • v.11 no.1
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    • pp.60-67
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    • 2020
  • In this study, copper (II) oxide powder for electroplating was prepared by recovering CuCl2 from NaClO3 type etching wastes via recovered non-sintering two step chemical reaction. In case of alkali copper carbonate [mCuCo3·nCu(OH)2], first reaction product, CuCo3 is produced more than Cu(OH)2 when the reaction molar ratio of sodium carbonate is low, since m is larger than n. As the reaction molar ratio of sodium carbonate increased, m is larger than n and Cu(OH)2 was produced more than CuCO3. In the case of m has same values as n, the optimum reaction mole ratio was 1.44 at the reaction temperature of 80℃ based on the theoretical copper content of 57.5 wt. %. The optimum amount of sodium hydroxide was 120 g at 80℃ for production of copper (II) oxide prepared by using basic copper carbonate product of first reaction. At this time, the yield of copper (II) oxide was 96.6 wt.%. Also, the chloride ion concentration was 9.7 mg/L. The properties of produced copper (II) oxide such as mean particle size, dissolution time for sulfuric acid, and repose angle were 19.5 mm, 64 second, and 34.8°, respectively. As a result of the hole filling test, it was found that the copper oxide (II) prepared with 120 g of sodium hydroxide, the optimum amount of basic hydroxide for copper carbonate, has a hole filling of 11.0 mm, which satisfies the general hole filling management range of 15 mm or less.

Decomposition and Reduction of Nitrogen Oxide on Copper Loaded Mordenites (동이 담지된 모더나이트 상에서 NO의 분해 및 환원 반응)

  • Lee, Chang-Yong;Mo, Yong-Ki;Choi, Ko-Yeol
    • Clean Technology
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    • v.8 no.3
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    • pp.111-117
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    • 2002
  • Catalytic decomposition and reduction of NO have been carried out on copper loaded mordenites in a packed bed flow reactor. For the decomposition of NO, $Cu^{\circ}/HM$ exhibited higher activities than CuO/HM at high copper content, which may be related to the difference in the amount of $Cu^{2+}$ ions and the reducibility of CuO between $Cu^{\circ}/HM$ and Cuo/HM. However, $Cu^{\circ}/HM$ showed higher reduction activities than CuO/HM at low copper content. This result may be dependent on the difference in the amount of high-reducibility CuO between $Cu^{\circ}/HM$ and CuO/HM.

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Synthesis of Graphene Oxide Based CuOx Nanocomposites and Application for C-N Cross Coupling Reaction

  • Choi, Jong Hoon;Park, Joon B.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.176.1-176.1
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    • 2014
  • Graphene has attracted an increasing attention due to its extraordinary electronic, mechanical, and thermal properties. Especially, the two dimensional (2D) sheet of graphene with an extremely high surface to volume ratio has a great potential in the preparation of multifunctional nanomaterials, as 2D supports to host metal nanoparticles (NPs). Copper oxide is widely used in various areas as antifouling paint, p-type semiconductor, dry cell batteries, and catalysts. Although the copper oxide(II) has been well known for efficient catalyst in C-N cross-coupling reaction, copper oxide(I) has not been highlighted. In this research, CuO and Cu2O nanoparticles (NPs) dispersed on the surface of grapehene oxide (GO) have been synthesized by impregnation method and their morphological and electronic structures have been systemically investigated using TEM, XRD, and XAFS. We demonstrate that both CuO and Cu2O on graphene presents efficient catalytic performance toward C-N cross coupling reaction. The detailed structural difference between CuO and Cu2O NPs and their effect on catalytic performance are discussed.

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Adsorption of Oxygen and Segregation of Impurity on Copper Surface(polycrystal): An AES Study (다결정 구리 표면에서 산소 흡착과 불순물 표면적출 : AES에 의한 연구)

  • Byoung Sung Han
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.25 no.8
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    • pp.966-971
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    • 1988
  • AES was used to study oxygen adsorption due to the oxygen exposure at 300\ulcorner temperature and segregation of impurities due to annealing on polycrystal copper surface. The intensity of peak of CuM2, 3VV and CuL3 VV increased with annealing time and the peak of CKLL increased after Ar ion bombardment. The effect of oxygen adsorption on copper surface at 300\ulcorner was verified by the decreased of peak of CuM2, 3VV and CuL3 VV as oxygen exposure increase. The binding energy of copper atoms gradualy shifts from 0.7eV to 1.5eV of copper atoms gradually shifts from 0.7eV to 1.5eV after a oxygen exposure. After the oxygen exposure, the width at half the height of CuM2, 3VV is larger 2V*C/S by the effect of chemical liaison of the copper aton with oxygen atom.

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Recovery of Copper from Sludge of Copper Electro-Plating Plant (동전해도금공장 Sludge로부터 동의 회수)

  • Young-Gil Hwang;Youn-Soo Kim;Jae-Il Kim
    • Resources Recycling
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    • v.5 no.3
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    • pp.31-36
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    • 1996
  • The metallic copper was recovered from sludge of the copper electro-plating plant by pyrometallurgical process. The reducing agent was Pyrolysized from waste tires and the flux was a mixture $Na_2CO_3$, $NaB_4O_7$, and glass. The green sludge contained 87.5% moisture and 12.5% solid with 56.5% Cu and 1.59% Fe. The sludge dried at $100^{\circ}C$ was analyized to be $Cu_4SO_4(OH)_6{\cdot}2H_2O$ and CuO by XRD analysis. The former was 84% and the latter 16%, However, the calcined sludge at $500^{\circ}C$ was 49% $Cu_2O(SO_4)$ and 51% CuO. The sludge could by smelted at $1100^{\circ}C$ for two hours with 6 to 8 moles carbon with respect to copper to produce metallic copper (>90%) with recovery of 9% above.

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