• 한국진공학회지
• /
• 제9권2호
• /
• pp.144-149
• /
• 2000

Cu(4.5at.% Mg) target을 이용하여 sputtering에 의해 증착된 Cu(Mg) alloy박막의 열처리시 형성되는 산화 방지막 MgO의 박막 특성에 영향을 주는 인자에 대해 살펴보았다. MgO 박막의 산화방지 능력 및 막질에 영향을 주는 인자로는 열처리 온도, $O_2$ 압력, Mg 농도 등으로 나타났다. MgO 박막의 두께는 열처리 온도가 증가함에 따라 증가하다 $500^{\circ}C$ 이상에서는 150 $\AA$ 정도의 성장한계두께를 나타내었다. 표면에 형성되는 MgO 박막은 $O_2$압력이 낮을수록, Mg의 농도가 높을수록 치밀한 MgO가 형성되어 산화방지에 우수한 특성을 보였으며 전 열처리 과정인 진공 열처리 공정은 1at.%정도의 낮은 Mg 농도에서도 치밀한 MgO형성에 매우 효과적임이 확인되었다. 본 연구에서 Cu(Mg) alloy박막의 열처리를 통해 낮은 저항의 Cu박막의 형성과 동시에 산화방지에 우수한 특성을 보이는 MgO 박막을 열처리 온도, $O_2$ 압력, Mg 농도 등의 최적조건을 이용하여 얻어질 수 있음을 확인하였다.

• Applied Microscopy
• /
• 제26권2호
• /
• pp.235-241
• /
• 1996

Amophization and decomposition behaviour in $Mg_{62}Cu_{26}Y_{12}$ alloy prepared by melt spinning method and wedge type metal mold casting method have been investigated by a detailed transmission electron microscopy. Amorphous phase has formed in melt-spun ribbon. In the case of the wedge type specimen, however, the amorphous phase has formed only around the tip area within about 2 mm thickness. The remaining part of the wedge type specimen consists of crystalline phases, $Mg_{2}Cu\;and\;Cu_{2}Y$. The supercooling for crystallization behaviour of the amorphous $Mg_{62}Cu_{26}Y_{12}$ alloy, ${\Delta}T_x$ has been measured to be about 60 K. Such a large undercooling of the crystallization bahaviour enables formation of the amorphous phase in the $Mg_{62}Cu_{26}Y_{12}$ alloy under the cooling rate of $10^{2}K/s$. The amorphous $Mg_{62}Cu_{26}Y_{12}$ has decomposed into crystalline phases, $Mg_{2}Cu\;and\;Cu_{2}Y$ after heat treatment at $170^{\circ}C\;and\;250^{\circ}C$.

• 열처리공학회지
• /
• 제20권5호
• /
• pp.243-249
• /
• 2007

The age hardening behavior and mechanical properties of an extruded Al-Zn-Mg-(Cu)-0.1 wt.%Sc alloy were investigated with the Sc addition and ageing temperature. The results showed that the $Al_3Sc$ compounds were formed by Sc addition and distributed preferentially along the extrusion direction. The age hardening of Al-Zn-Mg-Cu-0.1 wt.%Sc alloy which was treated by T6 process was more significant than that of Al-Zn-Mg-0.1 wt.%Sc alloy. The tensile property of Al-Zn-Mg-Cu+0.1 wt.%Sc alloy was also higher than that of Al-Zn-Mg-0.1 wt.%Sc alloy, which is 691 MPa and 584 MPa in strength and 9% and 11% in elongation, respectively.

• 열처리공학회지
• /
• 제19권5호
• /
• pp.257-261
• /
• 2006

Scandium(Sc) in Al-Zn-Mg-Cu based Al alloy on precipitation phenomenon was compared to a 7001(Al-7.2%Zn-3.2%Mg-1.8%Cu) Al alloy. GP zone and ${\eta}^{\prime}$ phases were the main strengthening phases at low aging temperature under $100^{\circ}C$, but ${\eta}^{\prime}$ and $Al_3Sc$ phases were the main strengthening phases at high aging temperature above $1600^{\circ}C$ in Sc added 7000(Al-7.7%Zn-2.0%Mg-1.9%Cu-0.1%Zr) Al alloy. With the addition of 0.1%Sc in 7000 Al alloy, the activation energy for the GP zone, ${\eta}^{\prime}$ and ${\eta}$ phase decreased compared to the 7001 Al alloy. This result indicates that the Sc accelerated the precipitation for the GP zone, ${\eta}^{\prime}$ and ${\eta}$ phases in 7000 Al alloy. Al-7.7%Zn-2.0%Mg-1.9%Cu-0.1%Zr-0.1 Sc alloy has higher strength than 7001 Al alloy, which has high strength.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2017년도 춘계학술대회 논문집
• /
• pp.97-97
• /
• 2017

This study investigated the corrosion protection by electrodeposited copper layer on AZ31 Mg alloy with and without additional silver layer by immersion test, salt spray test, OCP transient and potentiodynamic polarization experiment. The single electrodeposited Cu layer on AZ31 Mg alloy showed a nodular structure with many imperfections of crevices between the nodules, which resulted in the fast initiation of pitting corrosion within first few hours of immersion. Double-layer coating of Cu and outer Ag layer slightly increased the initiation time for pitting corrosion. Triple-layer coatings of Cu/Ag/Cu exhibited the most efficient corrosion protection of AZ31 Mg alloy, compared to the single- and double-layer coatings. Surface morphology of the outer Cu layer in the triple-layer was changed from the nodular structure to fine particle structure with no crevices due to the presence of an additional Ag layer. Thus, the improved corrosion resistance of AZ31 Mg alloy by electrodeposited Cu/Ag or Cu/Ag/Cu layers is readily ascribed to the decreased number of imperfections in the electrodeposited layers due to the additional silver layer. It is concluded that the additional silver layer provides many nucleation sites for the second Cu plating, resulting in the formation of finer and denser structure than the first Cu electrodeposit.

• 한국재료학회지
• /
• 제14권1호
• /
• pp.46-51
• /
• 2004

The annealing of a Cu(4.5at.% Mg)/$SiO_2$/Si structure in ambient $O_2$, at 10 mTorr, and $300-500^{\circ}C$, allows for the outdiffusion of the Mg to the Cu surface, forming a thin MgO (15 nm) layer on the surface. The surface MgO layer was patterned, and successfully served as a hard mask, for the subsequent dry etching of the underlying Mg-depleted Cu films using an $O_2$ plasma and hexafluoroacetylacetone [H(hfac)] chemistry. The resultant MgO/Cu structure, with a taper slope of about $30^{\circ}C$ shows the feasibility of the dry etching of Cu(Mg) alloy films using a surface MgO mask scheme. A dry-etched Cu(4.5at.% Mg) gate a-Si:H TFT has a field effect mobility of 0.86 $\textrm{cm}^2$/Vs, a subthreshold swing of 1.08 V/dec, and a threshold voltage of 5.7 V. A novel process for the dry etching of Cu(Mg) alloy films, which eliminates the use of a hard mask, such as Ti, and results in a reduction in the process steps is reported for the first time in this work.

• 한국재료학회지
• /
• 제10권2호
• /
• pp.160-165
• /
• 2000

Sputter Cu(1-4.5at.%Mg) alloy를 100mTorr이하의 산소압력에서 온도를 증가시키며 열처리하였을 때 표연과 계면에서 형성된 MgO의 확산방지막 특성을 살펴보았다 먼저, $Cu(Mg)/SiO_2/Si$ 구조의 샘플을 열처리했을 때 계면에서는 $2Mg+SiO_2{\rightarrow}2MgO+Si$의 화학반응에 의해 MgO가 형성되는데 이 MgO충에 의해 Cu가 $SiO_2$로 확산되는 것이 현저하게 감소하였다. TiN/Si 기판 위에서도 Cu(Mg)과 TiN 계면에 MgO가 형성되어 Cu(4.5at.%Mg)의 경우 $800^{\circ}C$까지 Cu와 Si의 확산을 방지할 수 있었다. 표면에 형성된 MgO위에 Si을 증착하여 $Si/MgO(150\;{\AA})/Cu(Mg)/SiO_2/Si$구조로 만든 후 열처리했을 때 $150\;{\AA}$의 MgO는 $700^{\circ}C$까지 Si과 Cu의 확산을 방지할 수 있었다. 표면에 형성된 MgO($150\;{\AA}$)의 누설전류특성은 break down 5V, 누설전류 $10^{-7}A/\textrm{cm}^2$의 값을 나타냈다. 또한 $Si_3N_4/MgO$ 이중구조에서는 매우 낮은 누설전류밀도를 나타냈으며 MgO에 의해 $Si_3N_4$ 증착시 안정적인 계면이 형성됨을 확인하였다.

• 한국주조공학회지
• /
• 제29권6호
• /
• pp.265-269
• /
• 2009

The optimum RRA heat treating conditions and SCC (stress corrosion cracking) resistance of semi-solid Al-Zn-Mg-Cu alloy fabricated by inclined cooling plate were compared with those of conventional mould cast alloys. The non-stirring method characterized by using a cooling plate can effectively eliminate dendritic structure and form a fine globular semisolid microstructure in as-cast Al-Zn-Mg-Cu alloy and the SCC resistance of semi-solid Al-Zn-Mg-Cu alloy was higher than that of conventional mold cast alloy. Also, after retrogressed treatment at RRA heat treatment of semi-solid Al-Zn-Mg-Cu alloy, retrogressed treatment time has increased more than 10 minutes at $180^{\circ}C$ to recovery the T6 heat treatment strength.

• 한국분말재료학회지
• /
• 제7권1호
• /
• pp.12-18
• /
• 2000

Effects of the microstrucrure of rapidy solidified Al-Pb-Cu-Mg alloys on the wear investigated. In order to overcome the miscility gap between Al and pb under equilibrium conditions, both in the solid and the liquid states, the alloy were rapidy solidifies to produce them in a segregation-free condition. Although the Pb particles showed relatively fine dispersion in the Al matrix in all the alloys by this process. the Al-16Pb alloy was found to have the most favorable microstructure with discretre with discrete Pb particles of abount 0.5 ${\mu}$m in size. With the addition of Cu and Cu-Mg to Al-16Pb, cellular structures were newly formed; not seen in the binary Al-Pb alloy. Wear properties of the Al-Pb binary alloys measured as a function of the sliding speen, sliding distance, and applied load showed that the Al-16Pb alloy has the best wear resistance, as expected from the fine microstructural features in this alloy. The were resistance of the alloy containing Cu-and Cu-Mg was higher than that of the Al-16Pvb alloy, due to matrix strengthening by precipitation hardeing. The wear mechanism was identified by examining the traces and wear debris.

• 한국분말재료학회지
• /
• 제30권6호
• /
• pp.470-477
• /
• 2023

The effects of annealing on the microstructure and mechanical properties of Al-Zn-Mg-Cu-Si alloys fabricated by high-energy ball milling (HEBM) and spark plasma sintering (SPS) were investigated. The HEBM-free sintered alloy primarily contained Mg₂Si, Q-AlCuMgSi, and Si phases. Meanwhile, the HEBM-sintered alloy contains Mg-free Si and θ-Al₂Cu phases due to the formation of MgO, which causes Mg depletion in the Al matrix. Annealing without and with HEBM at 500℃ causes partial dissolution and coarsening of the Q-AlCuMgSi and Mg₂Si phases in the alloy and dissolution of the θ-Al₂Cu phase in the alloy, respectively. In both alloys, a thermally stable α-AlFeSi phase was formed after long-term heat treatment. The grain size of the sintered alloys with and without HEBM increased from 0.5 to 1.0 ㎛ and from 2.9 to 6.3 ㎛, respectively. The hardness of the sintered alloy increases after annealing for 1 h but decreases significantly after 24 h of annealing. Extending the annealing time to 168 h improved the hardness of the alloy without HEBM but had little effect on the alloy with HEBM. The relationship between the microstructural factors and the hardness of the sintered and annealed alloys is discussed.