• Journal of Korea Foundry Society
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• v.17 no.5
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• pp.458-464
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• 1997

Mg-Cu-Si과 Mg-Cu-Ge계 3원 합금에서 비정질 생성범위와 열적, 기계적 성질을 조사하였다. Mg-Cu-Si계에서는 $15{\sim}45%Cu$, $0{\sim}10%Si$, Mg-Cu-Ge계에서는 $15{\sim}45%Cu$, $0{\sim}5%Ge$의 조성범위에서 각각 비정질 단상이 생성되었고, $15{\sim}22.5%Cu$, 2.5%Si(or Ge)의 조성범위에서 생성되는 비정질상은 180도 밀착굽힘을 하여도 파단되지 않는 양호한 인성을 가지고 있었으며, $Mg_{82.5}Cu_{15}Ge_{2.5}$비정질합금의 최대인장강도는 800 MPa로 결정질 Mg기 합금의 최대치인 300 MPa에 비해 월등히 높은 값을 나타내었다. 그러고 비정질합금의 결정화는 다음과 같은 과정으로 일어났다. 1) Si(or Ge) ${\le}$ 2.5%: 비정질 ${\to}$ 비정질+$Mg_2Cu$+Mg ${\to}$ $Mg_2Cu$+Mg+$Mg_2Si$(or Ge), 2) Si(or Ge)=5%: 비정질 ${\to}$ $Mg_2Cu$+Mg+$Mg_2Si$(or Ge), 3) Si=10%: 비정질 ${\to}$ 비정질+$Mg_2Si$ ${\to}$ $Mg_2Si$+$Mg_2Cu$+Mg.

• The Korean Journal of Ecology
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• v.28 no.1
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• pp.7-13
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• 2005

In the present study, we investigated the tolerance of Commelina communis to growth in Cu-contaminated soil and water We examined the germination rate, root and shoot growth of seedlings, fresh biomass in soil and water, and ability to eliminate Cu. We found that C. communis eliminated 41% of Cu in soil containing 50 mg Cu/kg and removed over 50% of Cu from water containing 100 mg Cu/L Cu. In addition, the plants could accumulate 90 mg Cu/g when grown in soil containing 50 mg Cu/kg and 140 mg Cu/g when grown in soil containing 100 mg Cu/kg thus higher levels of Cu removal were observed in soils containing higher Cu concentrations. In water, the maximal accumulation rate was 4.9 mg Cu/g root and 1.2 mg Cu/g shoot in water containing 20 mg Cu/L, and 7 days after exposure, Cu absorption saturated. Further, the growth rate of C. communis was not affected by up to 100 mg Cu/kg in the soil. Therefore, the phytotoxic effect of Cu on plants increased as the concentration of Cu was raised, although to different extents depending on whether the Cu was in soil or water. Overall, Cu removal from soil by C. communis was most effective at 100 mg Cu/kg in soil and 10 mg Cu/L in water. Finally, we identified two peaks of Cu-binding ligands in C. communis. Which is a high molecular weight peak (HMWL) at 60 kDa (Fraction 17 to 25) and a Cu binding peptide peak at <1 kDa (Very low molecular weight ligand: VLMWL). Cu-binding peptide (Cu-BP) was observed to have an amino acid composition typical of phytochelations.

• Journal of the Korean Vacuum Society
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• v.9 no.2
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• pp.144-149
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• 2000

Variables affecting the passivation capability of Cu(Mg) alloy films, which were sputter deposited from a Cu (4.5 at. %) target, have been investigated. The results show that the passivation capability of a Cu(Mg) alloy film is a function of annealing temperature, $O_2$ pressure, and Mg content in the film. Increasing the annealing temperature up to $500^{\circ}C$ favors formation of a dense MgO layer on the surface which has a growth limited thickness of 150 $\AA$. Decreasing the $O_2$ pressure enhances the preferential oxidation of Mg over Cu. Furthermore, increasing the Mg content in the Cu(Mg) film promotes formation of a dense MgO layer. Vacuum pre-annealing was found to be very effective in segregating Mg to the surface, facilitating the passivation capability of the Cu(Mg) alloy film even when the Mg content is low. In the current study, self-aligned MgO layers with low resistivity and an effective passivation capability over the Cu surface, have been obtained by manipulating these factors when Cu(Mg) thin films are annealed.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.89-98
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• 2003

The electrical and mechanical properties of sputtered Cu(Mg) films are investigated for highly reliable interconnects. The roughness, adhesion, hardness and resistance to thermal stress of Cu(Mg) film annealed in vacuum at $400^{\circ}C$ for 30min were improved than those of pure Cu film. Moreover, the flat band voltage(V$_{F}$ ) shift in the Capacitance-Voltage(C-V) curve upon bias temperature stressing(BTS) was not observed and leakage currents of Cu(Mg) into $SiO_2$ were three times less than those of pure Cu. Because Mg was easy to react with oxide than Cu and Si after annealing, the Mg Oxide which formed at surface and interface served as a passivation layer as well.

• Korean Journal of Materials Research
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• v.14 no.1
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• pp.46-51
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• 2004

The annealing of a Cu(4.5at.% Mg)/$SiO_2$/Si structure in ambient $O_2$, at 10 mTorr, and $300-500^{\circ}C$, allows for the outdiffusion of the Mg to the Cu surface, forming a thin MgO (15 nm) layer on the surface. The surface MgO layer was patterned, and successfully served as a hard mask, for the subsequent dry etching of the underlying Mg-depleted Cu films using an $O_2$ plasma and hexafluoroacetylacetone [H(hfac)] chemistry. The resultant MgO/Cu structure, with a taper slope of about $30^{\circ}C$ shows the feasibility of the dry etching of Cu(Mg) alloy films using a surface MgO mask scheme. A dry-etched Cu(4.5at.% Mg) gate a-Si:H TFT has a field effect mobility of 0.86 $\textrm{cm}^2$/Vs, a subthreshold swing of 1.08 V/dec, and a threshold voltage of 5.7 V. A novel process for the dry etching of Cu(Mg) alloy films, which eliminates the use of a hard mask, such as Ti, and results in a reduction in the process steps is reported for the first time in this work.

• Korean Journal of Materials Research
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• v.10 no.2
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• pp.160-165
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• 2000

We have investigated the electrical and diffusion barrier properties of MgO produced on the surface of Cu (Mg) alloy. Also the diffusion barrier property of the interfacial MgO between Cu alloy and $SiO_2$ has been examined. The results show that the $150\;{\AA}$-MgO layer on the surface remains stable up to $700^{\circ}C$, preventing the interdiffusion of C Cu and Si in Si/MgO/Cu(Mg) structure. It also has the breakdown voltage of 4.5V and leakage current density of $10^{-7}A/\textrm{cm}^2/$. In addition, the combined structure of $Si_3N4(100{\AA})/MgO(100{\AA})$ increases the breakdown voltage up to lOV and reduces the leakage current density to $8{\tiems}10^{-7}A/\textrm{cm}^2$. Furthermore, the interfacial MgO formed by the chemical reac­t tion of Mg and $SiO_2$ reduces the diffusion of copper into $SiO_2$ substrate. Consequently, Cu(Mg) alloy can be applied as a g gate electrode in TFT /LCDs, reducing the process steps.

• Asian-Australasian Journal of Animal Sciences
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• v.16 no.8
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• pp.1131-1136
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• 2003

Forty-eight individually fed Angus steers (body weight $220kg{\pm}9.1$) were utilized to investigate the effects of copper (Cu) source and concentration on lipid metabolism and carcass quality. Steers were stratified by body weight and initial liver Cu concentration and randomly assigned to one of five groups. Groups were then randomly assigned to treatments. Treatments consisted of: 1) control (no supplemental Cu); 2) 10 mg Cu/kg DM from $CuSO_4$; 3) 10 mg Cu/kg DM from a Cu amino acid complex (Availa Cu) 4) 20 mg Cu/kg DM from $CuSO_4$; and 5) 20 mg Cu/kg DM from Availa Cu. Steers were fed a corn-alfalfa-based growing diet for 56 d. Steers were then switched to a high concentrate finishing diet for 145 d. On day 74 of the finishing phase subcutaneous adipose tissue biopsies were obtained from three steers/treatment to determine basal and stimulated lipolytic rates in vitro. Steers were then slaughtered after receiving the finishing diet for 145 d. Control steers tended (p<0.12) to have lower ceruloplasmin (Cp) activity than Cu supplemented steers. Steers receiving 20 mg Cu/kg DM from Availa Cu had higher (p<0.03) Cp activity than steers receiving 20 mg Cu/kg DM from $CuSO_4$. Plasma non-esterified fatty acids were similar across treatments. Steers receiving 10 mg Cu/kg DM from Availa Cu had higher (p<0.02) total plasma cholesterol concentrations relative to steers receiving 10 mg Cu/kg DM from $CuSO_4$. Steers receiving 20 mg Cu/kg DM from Availa Cu had lower (p<0.03) plasma triglyceride concentrations than steers supplemented with 20 mg Cu/kg DM from $CuSO_4$. Fatty acid profile of longissimus muscle was similar across treatments. Backfat depth tended (p<0.18) to be lower in Cu supplemented steers relative to controls. Steers supplemented with 20 mg Cu/kg DM from Availa Cu had heavier (p<0.03) hot carcass weights and a greater (p<0.02) dressing percentage than steers supplemented with 20 mg Cu/kg DM from $CuSO_4$. Furthermore, in vitro basal (p<0.06) and epinephrine stimulated (p<0.04) lipolytic rates of subcutaneous adipose tissue were higher in Cu supplemented steers relative to controls. The results of this study suggest that Cu supplementation has minimal effects on blood and lean tissue lipid profile. However, it appears that Cu may play a role in lipid metabolism in subcutaneous adipose tissue.

• Journal of Korea Foundry Society
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• v.41 no.6
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• pp.528-534
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• 2021

To confirm effects of natural and artificial aging of precipitate on thermal diffusivity and hardness, the studied Al-Mg-Si alloy were manufactured by gravity casting method with 0.6 wt% and 1.0 wt% additional Cu element. The samples were used for measuring thermal diffusivity and hardness. The addition of Cu, promoted by intermediates such as Q'' and θ'' phases, contributing to the improvement of hardness and high-temperature thermal diffusivity. The natural aging decreased the hardness of the Al-Mg-Si-Cu alloys with increasing time, but did not affect the thermal diffusivity.

• Analytical Science and Technology
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• v.14 no.2
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• pp.173-179
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• 2001

The study was carried out to analyze the pollutant Fe, Cu, Cr, Zn, Cd for sediments collected from lake in K river basin. Three analytical methods currently used in Korea, Japan, U.S.A, were compared. Pretreatment using microwave digestion showed higher analytical results for Fe, Cu, Cr, Zn, Cd than Korean Official Method(KOM) and American Toxicity Characteristic Leaching Procedure(TCLP) Method. Also, analytical results using microwave digestion, TCLP and KOM were as follows: 38.1-48.0 mgFe/kg, 10.2-15.9 mgFe/kg AND 3.5-12.6 mgFe/kg, 37.0-50.1 mgCu/kg, 0.06-0.24 mgCu/kg and 0.01-0.03 mgCu/kg, 137.0-152.0 mgZn/kg, 0.67-0.82 mgZn/kg and 0.3-0.5 mgZn/kg, respectively. From this result, a new analytical method for the determination of heavy metal in sediment should be developed for the accurate estimation of pollution degree in sediment.

• Applied Microscopy
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• v.26 no.2
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• pp.235-241
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• 1996

Amophization and decomposition behaviour in $Mg_{62}Cu_{26}Y_{12}$ alloy prepared by melt spinning method and wedge type metal mold casting method have been investigated by a detailed transmission electron microscopy. Amorphous phase has formed in melt-spun ribbon. In the case of the wedge type specimen, however, the amorphous phase has formed only around the tip area within about 2 mm thickness. The remaining part of the wedge type specimen consists of crystalline phases, $Mg_{2}Cu\;and\;Cu_{2}Y$. The supercooling for crystallization behaviour of the amorphous $Mg_{62}Cu_{26}Y_{12}$ alloy, ${\Delta}T_x$ has been measured to be about 60 K. Such a large undercooling of the crystallization bahaviour enables formation of the amorphous phase in the $Mg_{62}Cu_{26}Y_{12}$ alloy under the cooling rate of $10^{2}K/s$. The amorphous $Mg_{62}Cu_{26}Y_{12}$ has decomposed into crystalline phases, $Mg_{2}Cu\;and\;Cu_{2}Y$ after heat treatment at $170^{\circ}C\;and\;250^{\circ}C$.