• Title/Summary/Keyword: Cu(In

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Biopharmaceutical studies on copper(II) chelates of sulfanilamide derivatives (Sulfanilamide유도체의 동(II)착화합물에 대한 생물약제학적 연구)

  • 김재백
    • YAKHAK HOEJI
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    • v.15 no.2
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    • pp.41-52
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    • 1971
  • Cu(II) chelates of several sulfanilamide derivatives (Sulfa-Cu) were prepared and their effects on solubility, absorptivity in intestinal lumen, biding tendency with serum protein and erythrocytes, concentration in rabbit blood, and acetylation rate were studied in comparison with their free ligand forms. For solubility concerned, the partition coefficients of Sulfa-Cu are decreased as following order: Sulfadimethoxine Copper chelate (SDM-Cu), Sulfamethoxypyridazine Copper chelate (SD-Cu), Sulfamerazine Copper chelate (SM-Cu), Sulfaisoxazole Copper chelate (SIX-Cu). The partition coefficients of SDM-Cu and ST-Cu were much greater than those of ligands. this phenomenone acounts for the rapid absorption of SDM-Cu and ST-Cu in the rat small intestine (in situ). The Sulfa-Cu were absorbed at the intestinal lumen of a rat in the rate of first order and there was no difference between long acting sulfa drugs and their Cu0chelates in biological half lives. In binding experiments, sulfa-Cu binded with serum protein in lower ratio than their ligands except SIX-Cu. On other hand, acetylation rates of sulfa-Cu were higher than those of free sulfa drugs and the acetylation rate were higher than those of free sulfa drugs and powder. In a experiment on Sulfa-Cu concentration in rabbit blood, the half lives of SD-Cu, SIX-cu, ST-Cu, and SM-Cu were longer than those of their ligands. Above all, the half life of SD-Cu appeared to be approximately 3.5 times logner than that of corresponding ligand, SD. When absorption of sulfa drugs or sulfa-Cu at the small intestinal lumen of a rat and the concentration in rabbit blood after absorption were compared, it was found that there was not always conrrelated.

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Phytoremediation of Cu-contaminated Soil and Water by Commelina communis

  • Kim, Sung-Hyun;Lee, In-Sook
    • The Korean Journal of Ecology
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    • v.28 no.1
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    • pp.7-13
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    • 2005
  • In the present study, we investigated the tolerance of Commelina communis to growth in Cu-contaminated soil and water We examined the germination rate, root and shoot growth of seedlings, fresh biomass in soil and water, and ability to eliminate Cu. We found that C. communis eliminated 41% of Cu in soil containing 50 mg Cu/kg and removed over 50% of Cu from water containing 100 mg Cu/L Cu. In addition, the plants could accumulate 90 mg Cu/g when grown in soil containing 50 mg Cu/kg and 140 mg Cu/g when grown in soil containing 100 mg Cu/kg thus higher levels of Cu removal were observed in soils containing higher Cu concentrations. In water, the maximal accumulation rate was 4.9 mg Cu/g root and 1.2 mg Cu/g shoot in water containing 20 mg Cu/L, and 7 days after exposure, Cu absorption saturated. Further, the growth rate of C. communis was not affected by up to 100 mg Cu/kg in the soil. Therefore, the phytotoxic effect of Cu on plants increased as the concentration of Cu was raised, although to different extents depending on whether the Cu was in soil or water. Overall, Cu removal from soil by C. communis was most effective at 100 mg Cu/kg in soil and 10 mg Cu/L in water. Finally, we identified two peaks of Cu-binding ligands in C. communis. Which is a high molecular weight peak (HMWL) at 60 kDa (Fraction 17 to 25) and a Cu binding peptide peak at <1 kDa (Very low molecular weight ligand: VLMWL). Cu-binding peptide (Cu-BP) was observed to have an amino acid composition typical of phytochelations.

Effects of Supplementary Copper Chelates in the Form of Methionine, Chitosan and Yeast on the Performance of Broilers

  • Lim, H.S.;Paik, I.K.;Sohn, T.I.;Kim, W.Y.
    • Asian-Australasian Journal of Animal Sciences
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    • v.19 no.9
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    • pp.1322-1327
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    • 2006
  • An experiment was conducted to investigate the effects of supplemental copper (Cu) chelates (methionine, chitosan and yeast) on the performance, nutrient digestibility, serum IgG level, gizzard erosion, Cu content in the liver and excreta and the level of total cholesterol in breast muscle and serum of broiler chickens. Two hundred and forty hatched broiler chickens (Ross$^{(R)}$ 208) were assigned to 4 treatments: control, 100 ppm Cu in methionine chelate (Met-Cu), 100 ppm Cu in chitosan chelate (Chitosan-Cu) and 100 ppm Cu in yeast chelate (Yeast-Cu). Each treatment had six replicates of 10 (5 males+5 females) birds each. Weight gain and feed intake tended to be higher in Cu chelate treatments than the control; weight gain was significantly higher in the Met-Cu chelate treatment and feed intake was significantly higher in the Yeast-Cu chelate treatment than the control (p<0.05). Feed/gain was significantly different between treatments in which Met-Cu was lowest followed by the control, Chitosan-Cu and Yeast-Cu. DM availability was increased by Cu chelates among which chitosan-Cu showed the highest DM availability. Cu chelates supplementation tended to increase gizzard erosion index, and Cu content in the liver was highest in the Met-Cu treatment. Supplementation of Cu chelates tended to decrease total cholesterol level in breast muscle and serum but tended to increase the level of HDL in serum. It was concluded that dietary supplementation of 100 ppm Cu in chelates increased weight gain, feed intake and DM availability. Met-Cu was more effective than Chitosan-Cu or Yeast-Cu in improving productivity of broiler chickens.

Microstructure and Compositional Distribution of Selenized Cu(In,Ga)Se2 Thin Film Utilizing Cu2In3, CuGa and Cu2Se (Cu2In3, CuGa, Cu2Se를 이용한 전구체박막을 셀렌화하여 제조한 Cu(In,Ga)Se2 박막의 미세구조 및 농도분포 변화)

  • Lee, Jong-Chul;Jung, Gwang-Sun;Ahn, Byung-Tae
    • Korean Journal of Materials Research
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    • v.21 no.10
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    • pp.550-555
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    • 2011
  • A high-quality CIGS film with a selenization process needs to be developed for low-cost and large-scale production. In this study, we used $Cu_2In_3$, CuGa and $Cu_2Se$ sputter targets for the deposition of a precursor. The precursor deposited by sputtering was selenized in Se vapor. The precursor layer deposited by the co-sputtering of $Cu_2In_3$, CuGa and $Cu_2Se$ showed a uniform distribution of Cu, In, Ga, and Se throughout the layer with Cu, In, CuIn, CuGa and $Cu_2Se$ phases. After selenization at $550^{\circ}C$ for 30 min, the CIGS film showed a double-layer microstructure with a large-grained top layer and a small-grained bottom layer. In the AES depth profile, In was found to have accumulated near the surface while Cu had accumulated in the middle of the CIGS film. By adding a Cu-In-Ga interlayer between the co-sputtered precursor layer and the Mo film and adding a thin $Cu_2Se$ layer onto the co-sputtered precursor layer, large CIGS grains throughout the film were produced. However, the Cu accumulated in the middle of CIGS film in this case as well. By supplying In, Ga and Se to the CIGS film, a uniform distribution of Cu, In, Ga and Se was achieved in the middle of the CIGS film.

A Study on Solderability of Sn-Ag-Cu Solder with Plated Layers in ʼn-BGA (ʼn-BGA에서 Sn-Ag-Cu 솔더의 도금층에 따른 솔더링성 연구)

  • 신규식;정석원;정재필
    • Journal of Welding and Joining
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    • v.20 no.6
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    • pp.59-59
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    • 2002
  • Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

A Study on Solderability of Sn-Ag-Cu Solder with Plated Layers in $\mu-BGA$ ($\mu-BGA$에서 Sn-Ag-Cu 솔더의 도금층에 따른 솔더링성 연구)

  • 신규식;정석원;정재필
    • Journal of Welding and Joining
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    • v.20 no.6
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    • pp.783-788
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    • 2002
  • Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp.:$250^{\circ}C$and conveyer speed:0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was $250^{\circ}C$. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn ($5\mu\textrm{m}$), Cu/Ni ($5\mu\textrm{m}$), and Cu/Ni/Au ($5\mu\textrm{m}/500{\AA}$) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

Heat Liberation in the Reaction of $YBa_2Cu_3O_{7-}\delta$, $Y_2BaCuO_5$, and Binary Compounds in the Ba-Cu-O System with Water ($YBa_2Cu_3O_{7-}\delta$, $Y_2BaCuO_5$ 및 Ba-Cu-O계 화합물의 수분과의 반응에 의한 열방출에 관한 연구)

  • 김배연
    • Journal of the Korean Ceramic Society
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    • v.32 no.1
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    • pp.83-89
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    • 1995
  • YBa2Cu3O7-$\delta$, Y2BaCuO5, and binary compounds in the Ba-Cu-O system with the nominal composition of Ba2CuO3, BaCuO2, Ba3Cu4O7, Ba3Cu5O8 were synthesized to investigate the heat evolutions and crystalline phases in the hydration reaction of orthorhombic YBa2Cu3O7-$\delta$ phase. The observed crystalline phases were YBa2Cu3O7-$\delta$, Y2BaCuO5, and BaCuO2, or Ba2Cu3O5+x, and some amount of noncrystalline phase in the Ba-Cu system comounds. In contact with distilled water, YBa2Cu3O7-$\delta$ and Y2BaCuO5 did not have considerable heat liberation, but in the binary compounds of the Ba-Cu-O system, the amount of total heat liberation was increased with respect to the Cu content. It might be that the reaction of high temperature superconductor YBa2Cu3O7-$\delta$ with water and/or moisture originated from the unusual oxidation state of Cu ion and the presence of amorphous Ba-Cu oxide compound. The degradation of high Tc superconductor by moisture and water could be controlled by restricting the heterogeneous distribution of Tc comlposition and the formation of second phase, such as stable Y2BaCuO5, and the resulting unstable Ba-Cu oxide compound.

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Fabrication of Porous Cu by Freeze-drying Process of Camphene Slurry with CuO-coated Cu Powders (CuO가 코팅된 Cu 분말을 혼합한 Camphene 슬러리의 동결건조에 의한 Cu 다공체 제조)

  • Bang, Su-Ryong;Oh, Sung-Tag
    • Journal of Powder Materials
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    • v.21 no.3
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    • pp.191-195
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    • 2014
  • This study reports a simple way of fabricating the porous Cu with unidirectional pore channels by freeze drying camphene slurry with Cu oxide coated Cu powders. The coated powders were prepared by calcination of ball-milled powder mixture of Cu and Cu-nitrate. Improved dispersion stability of camphene slurry could be achieved using the Cu oxide coated Cu powders instead of pure Cu powders. Pores in the frozen specimen at $-25^{\circ}C$ were generated by sublimation of the camphene during drying in air, and the green bodies were sintered at $750^{\circ}C$ for 1 h in $H_2$ atmosphere. XRD analysis revealed that the coated layer of Cu oxide was completely converted to Cu phase without any reaction phases by hydrogen heat treatment. The porous Cu specimen prepared from pure Cu powders showed partly large pores with unidirectional pore channels, but most of pores were randomly distributed. In contrast, large and aligned parallel pores to the camphene growth direction were clearly observed in the sample using Cu oxide coated Cu powders. Pore formation behavior depending on the initial powders was discussed based on the degree of powder rearrangement and dispersion stability in slurry.

A Study on the Influence of Substituting Cu Eine Particle for CuO on NiCuZn Ferrite (CuO 대신 Cu 미분말 치환이 NiCuZn Ferrite에 미치는 영향에 관한 연구)

  • Kim, Jae-Sik;Koh, Jae-Gui
    • Journal of the Korean Magnetics Society
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    • v.13 no.1
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    • pp.15-20
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    • 2003
  • Diffusion speed of Cu metal fine particle is fast better than CuO, so it will promote grain growth in sintering. In this paper, the influence on substituting Cu fine particle for CuO of NiCuZn ferrite with basic composition (N $i_{0.204}$C $u_{0.204}$Z $n_{0.612}$ $O_{1.02}$)F $e_{1.98}$ $O_{2.98}$ has been investigated with varying Cu/CuO ratio. The perfect spinel structure of sintered specimen at 90$0^{\circ}C$ was confirmed by the analysis of XRD patterns. The best condition was obtained when the ratio of Cu/CuO was 60%, and the permeability was 1100 and Ms was 87 emu/g in this condition. Cu has influenced on grain growth in sintering, substituting Cu fine particle for CuO could lower sintering temperature over the 3$0^{\circ}C$. After sintering, substituting Cu performed as good as CuO.s CuO.s CuO.

Effect of Dietary Supplementation of Cu-methionine Chelate and Cu-soy Proteinate on the Performance, Small Intestinal Microflora and Immune Response in Laying Hens (사료내 Cu-methionine Chelate와 Cu-soy Proteinate가 산란계의 생산성, 소장내 미생물 균총 및 면역체계에 미치는 영향)

  • Paik, I.K.;Kim, C.H.;Park, K.W.
    • Korean Journal of Poultry Science
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    • v.35 no.3
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    • pp.303-311
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    • 2008
  • This study was conducted to investigate the effect of dietary supplementation of Cu-methionine chelate(Cu-Met) and Cu-soy proteinate(Cu-SP) on the performance, small intestinal microflora and immune response in laying hens. A total of 960 Hy-line $Brown^{(R)}$ laying hens of 39 wks old were assigned to one of the following 6 dietary treatment: control(C), antibiotic(Avilamycine 6 ppm), Cu-Met 50 and Cu-Met 100(50 and 100 ppm Cu as Cu-methionine chelate), Cu-SP 50 and Cu-SP 100(50 and 100ppm Cu as Cu-soy proteinate). Each treatment was replicated 4 times with forty birds per replication, housed in 2 birds per cages. Forty birds units were arranged according to randomized block design. Feeding trial lasted 6 wks under 16 hours lighting regimen. Hen-day and hen-house egg production of groups treated with Antibiotic and Cu supplements tended to be higher than the control with significant difference (P<0.05) shown between Cu-Me 100 and control. Egg weight was significantly (P<0.05) heavier in antibiotic and Cu-SP treatments than Cu-Met treatments but they were not significantly different from the control. Eggshell strength, egg shell thickness, egg yolk color and Haugh unit were not significantly different among treatments. There were no significant differences in leukocytes and erythrocytes in the chicken blood. But mean corpuscular hemoglobin value(MCH) was significantly (P<0.05) higher in Cu-SP 100 than antibiotic treatment. The concentrations of serum IgG and IgA were not significantly different among treatments. Copper concentration in the liver tended to increase as the level of copper supplementation increased, that of Cu-SP 100 being significantly (P<0.05) higher than those of the control and antibiotic treatment. Concentrations of iron and zinc of the liver were not significantly influenced by treatments. Populations of Cl. perfringens and Lactobacilli in the small intestinal content were significantly (P<0.05) influenced by treatments. Population of Cl. perfringens decreased and that of Lactobacilli increased in the copper supplemented groups. The result of this experiment showed that Cu-Met and Cu-SP are comparable to antibiotic in improving egg production in laying hens. Birds fed diets supplemented with Cu-SP produced heavier eggs than those fed diets with Cu-Met. There were no significant differences in the performances between 50 ppm and 100 ppm copper supplementation as organic forms.