• 제목/요약/키워드: Crystalline Diamond

검색결과 68건 처리시간 0.029초

Diamond Synthesis by W Filament CVD (W Filament CVD에 의한 Diamond의 합성)

  • 서문규;강동균;이지화
    • Journal of the Korean Ceramic Society
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    • 제26권4호
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    • pp.550-558
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    • 1989
  • Polycrystalline diamond films have been deposited on Si wafer Ly hot W filament CVD method using CH4H2 mixtures. The effects of surface pretreatment, W filament temperature, CH4 volume fraction, and addition of water vapor on the growth rate and morphology of the films were investigated. Surface pretretment was essential for depositing a continuous diamond film. Raising the filament temperature resulted in an increased growth rate and a better crystal quality of the film. As the methane content is varied from 0.5% to 5%, well-faceted crystals gradually transformed into spherical particles of non-diamond phase with a simultaneous increase in the growth rate. Addition of water vapor markedly improved the crystallinity to produce crystalline particles even with 5% methane mixture.

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Quality evaluation of diamond wire-sawn gallium-doped silicon wafers

  • Lee, Kyoung Hee
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • 제23권3호
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    • pp.119-123
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    • 2013
  • Most of the world's solar cells in photovoltaic industry are currently fabricated using crystalline silicon. Czochralski-grown silicon crystals are more expensive than multicrystalline silicon crystals. The future of solar-grade Czochralski-grown silicon crystals crucially depends on whether it is usable for the mass-production of high-efficiency solar cells or not. It is generally believed that the main obstacle for making solar-grade Czochralski-grown silicon crystals a perfect high-efficiency solar cell material is presently light-induced degradation problem. In this work, the substitution of boron with gallium in p-type silicon single crystal is studied as an alternative to reduce the extent of lifetime degradation. The diamond-wire sawing technology is employed to slice the silicon ingot. In this paper, the quality of the diamond wire-sawn gallium-doped silicon wafers is studied from the chemical, electrical and structural points of view. It is found that the characteristic of gallium-doped silicon wafers including texturing behavior and surface metallic impurities are same as that of conventional boron-doped Czochralski crystals.

Formation of the Diamond Thin Film as the SOD Sturcture (SOD 구조 형성에 따른 다이아몬드 박막 형성)

  • Ko, Jeong-Dae;Lee, You-Seong;Kang, Min-Sung;Lee, Kwang-Man;Lee, Kae-Myoung;Kim, Duk-Soo;Choi, Chi-Kyu
    • Korean Journal of Materials Research
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    • 제8권11호
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    • pp.1067-1073
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    • 1998
  • High quality diamond films of the silicon on diamond (SOD) structure are deposited using CO and $H_2$ gas mixture in microwave plasma chemical vapor deposition (CVD), a SOD structure is fabricated using low pressure CVD polysilicon on diamond/ Si(100) substrate. The crystalline structure of the diamond films which composed of { 111} and {100} planes. were changed from octahedral one to cubo-octahedron one as the CO/$H_2$ ratios are increased. The high quality diamond films without amorphous carbon and non-diamond elements were deposited at the CO/$H_2$ flow rate of 0.18. and the main phase of the diamond films shows (111) plane. The diamond/Si(lOO) structure shows that the interface is flat without voids. The measured dielectric constant. leakage current and breakdown field were $5.31\times10^{-9}A/cm^2$ and $9\times{10^7}{\Omega}cm$ respectively.

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Effect of Surfactant in Electroless Ni-B Plating for Coating on the Diamond Powder (다이아몬드 분말상에 무전해 Ni-B 도금을 위한 계면활성제의 영향)

  • Yang, Changyol;Yu, Si-Young;Moon, Hwan-Gyun;Lee, Jung-Ho;Yoo, Bongyoung
    • Journal of the Korean institute of surface engineering
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    • 제50권3호
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    • pp.177-182
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    • 2017
  • The properties of electroless Ni-B thin film on diamond powder with different parameters (temperature, pH, surfactant etc.) were studied. The surface morphology, structure and composition distribution of the Ni-B film were observed by field effect scanning electron microscope (FE-SEM), energy-dispersive spectrometer (EDS), X-ray diffraction (XRD) and Auger electron spectroscopy (AES). The growth rate of Ni-B film was increased with increase of bath temperature. The B content in Ni-B film was reduced with increase of bath pH. As a result the structure of Ni-B film was changed from amorphous to crystalline structure. The PVP in solution plays multi-functional roles as a dispersant and a stabilizer. The Ni-B film deposited with adding 0.1 mM-PVP was strongly introduced an amorphous structure with higher B content (25 at.%). Also the crystallite size of Ni-B film was reduced from 12.7 nm to 5.4 nm.

Synthesis of Diamond-Like Carbon Films on a TiO₂ Substrate by DC-Discharge Plasma Enhanced Chemical Vapor Deposition

  • 구수진;김창민;지종기
    • Bulletin of the Korean Chemical Society
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    • 제16권9호
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    • pp.813-818
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    • 1995
  • A diamond-like carbon (DLC) film was produced on a TiO2 substrate using a plasma enhance chemical vapor deposition (PECVD) method. The CH4-H2 plasma was produced by applying 400 V DC. The DLC film with the best crystalline structure was obtained when the concentration of CH4 in H2 was 0.75 percent by volume and total pressure was 40 torr. The presence of the diamond structure was confirmed by Raman spectroscopy, X-ray diffraction, and scanning electron microscopy methods. It was found that the diluting gas H2 played an important role in producing a DLC film using a PECVD method.

Kinematic Modeling and Analysis of Silicon Wafer Grinding Process (실리콘 웨이퍼 연삭 가공의 기구학적 모델링과 해석)

  • 김상철;이상직;정해도
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 한국정밀공학회 2002년도 춘계학술대회 논문집
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    • pp.42-45
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    • 2002
  • General wheel mark in mono-crystalline silicon wafer finding is able to be expected because it depends on radius ratio and angular velocity ratio of wafer and wheel. The pattern is predominantly determined by the contour of abrasive grits resulting from a relative motion. Although such a wheel mark is made uniform pattern if the process parameters are fixed, sub-surface defect is expected to be distributed non-uniformly because of characteristic of mono-crystalline silicon wafer that has diamond cubic crystal. Consequently it is considered that this phenomenon affects the following process. This paper focused on kinematic analysis of wafer grinding process and simulation program was developed to verify the effect of process variables on wheel mark. And finally, we were able to predict sub-surface defect distribution that considered characteristic of mono-crystalline silicon wafer

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