• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.864-867
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• 2003

Since the development of semiconductors, various related research has been conducted. During research, silicon diodes have been commonly used because of their simplicity and low cost in the manufacturing process. This research deals with p-n junction threshold voltages from silicon diodes due to transport current at a cryogenic temperature. At a cryogenic temperature(77K) we could get minimum current which junction threshold voltage becomes constant. This is experimented on GPIB communication and it consist of programmable current source, multimeter which gauge the threshold voltage in a very low temperature caused by transport current from 5nA to 1mA and $LN_2$(77K) for coolant. This experiment is programmed all process using Measurement studio(Lab window) tool.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.119-119
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• 2010

Among the various factors influencing the service life of the electric equipment, the performance of dielectric insulation materials has an important role to determine their whole service life. In order to determine the degradation of insulating materials immersed in extremely low temperature media such as liquid nitrogen, the abrupt temperature change from cryogenic to normal room temperature should be considered. But the assessments of low-temperature aging test method for the dielectric materials immersed in liquid nitrogen considering these conditions were not fully reported. Therefore, for the fundamental step to establish the suitable degradation test methods for cryogenic dielectric materials, we focused on the evaluation of ageing test methods for dielectric materials exposed to low temperature environments considering thermal shock by cool-down and warm up test.

• 한국전기전자재료학회논문지
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• 제20권2호
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• pp.135-141
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• 2007

The conduction-cooled HTS SMES is operated in cryogenic and high vacuum condition. Thus, Insulation design at cryogenic temperature and high vacuum is a key and an important element that should be established to accomplish miniaturization that is a big advantage of HTS SMES. However, the behaviors of insulators for cryogenic conditions in vacuum are virtually unknown. Therefore, we need active research and development of insulation concerning application of the conduction-cooled HTS SMES. Therefore, in this study, we experimented about insulation characteristic high vacuum and cryogenic similar to driving condition of SMES system. Also, investigated about insulation characteristic of suitable some materials to insulator for conduction-cooled HTS SMES. As this results, we possessed basis data for insulation materials selection and insulation design for development of 600 kJ class conduction-cooled HTS SMES.

• 한국초전도ㆍ저온공학회논문지
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• 제24권1호
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• pp.8-12
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• 2022

Recently, research on applying composite materials to various industrial fields is being actively conducted. In particular, composite materials fabricated by Fused Deposition Modeling 3D printers have more advantages than existing materials as they have fewer restrictions on manufacturing shape, reduce the time required, weight. With these advantages, it is possible to consider utilizing composite materials in cryogenic environments such as the application of liquid oxygen and liquid hydrogen, which are mainly used in an aerospace and mobility. However, FDM composite materials are not verified in cryogenic environments less than 150K. This study evaluates the characteristics of composite materials such as tensile strength and strain using a UTM (Universal Testing Machine). The specimen is immersed in liquid nitrogen (77 K) to cool down during the test. The specimen is fabricated using 3D print, and can be manufactured by stacking reinforced fibers such as carbon fiber, fiber glass, and aramid fiber (Kevlar) with base material (Onyx). For the experimental method and specimen shape, international standards ASTM D638 and ASTM D3039 for tensile testing of composite materials were referenced.

• 한국해양생명과학회지
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• 제6권1호
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• pp.1-8
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• 2021

In marine ecosystems, the biosynthesis and catabolism of dimethylsulfoniopropionate (DMSP) by marine bacteria is critical to microbial survival and the ocean food chain. Furthermore, these processes also influence sulfur recycling and climate change. Recent studies using emerging genome sequencing data and extensive bioinformatics analysis have enabled us to identify new DMSP-related genes. Currently, seven bacterial DMSP lyases (DddD, DddP, DddY, DddK, DddL, DddQ and DddW), two acrylate degrading enzymes (DddA and DddC), and four demethylases (DmdA, DmdB, DmdC, and DmdD) have been identified and characterized in diverse marine bacteria. In this review, we focus on the biochemical properties of DMSP cleavage enzymes with special attention to DddD, DddA, and DddC pathways. These three enzymes function in the production of acetyl coenzyme A (CoA) and CO₂ from DMSP. DddD is a DMSP lyase that converts DMSP to 3-hydroxypropionate with the release of dimethylsulfide. 3-Hydroxypropionate is then converted to malonate semialdehyde by DddA, an alcohol dehydrogenase. Then, DddC transforms malonate semialdehyde to acetyl-CoA and CO₂ gas. DddC is a putative methylmalonate semialdehyde dehydrogenase that requires nicotinamide adenine dinucleotide and CoA cofactors. Here we review recent insights into the structural characteristics of these enzymes and the molecular events of DMSP degradation.

• 설비공학논문집
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• 제26권1호
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• pp.32-37
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• 2014

The thermal contact resistance (TCR) is one of the important resistance components in cryogenic systems. Cryogenic measurement devices using a cryocooler can be affected by TCR because the device has to consist of several metal components that are in contact with each other for heat transfer to the specimen without a cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement devices using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as the roughness of the metal surface, the contact area and the contact pressure. In this study, we designed a TCR measurement system at variable temperature using a cryocooler as a heat sink. Copper was selected as a specimen in the experiment because it is widely used as a heat transfer medium in cryogenic measurement devices. We measured the TCR between Cu and Cu for various temperatures and contact pressures. The effect of the interfacial materials on the TCR was also investigated.

• 한국재료학회지
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• 제19권12호
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• pp.692-698
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• 2009

Inconel 718 alloy has excellent mechanical properties at room temperature, high temperature and cryogenic conditions. UTS of base metal is about 900MPa at room temperature; this is increased up to 1300MPa after heat treatment & aging-hardening. Mechanical properties of Inconel 718 Alloy were similar to those shown in the the results for tensile test; mechanical properties of Inconel 718 alloy's GTAW were similar to those of base metal's properties at room temperature. Mechanical properties at cryogenic conditions were better than those at room temperature. Heat-treated Inconel 718, non- filler metal GTAW on Inconel 718 and GTAW used filler metal on Inconel 718's UTS was 1400MPa at cryogenic condition. As a result, the excellent mechanical properties of Inconel 718 alloy under cryogenic conditions was proved through tensile tests under cryogenic conditions. In addition, weldability of Inconel 718 alloy under cryogenic conditions was superior to that of its base-metal. In this case, UTS of hybrid joint (IS-G) at -100$^{\circ}C$ was 900MPa. Consequently, UTS of Inconel 718 alloy is estimated to increase from -100$^{\circ}C$ to a specific temperature below -100$^{\circ}C$. Therefore, Inconel 718 alloy is considered a pertinent material for the production of Lox Pipe under cryogenic conditions.

• 한국수소및신에너지학회논문집
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• 제27권4호
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• pp.349-356
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• 2016

Volumetric capacity metrics at cryogenic condition are critical for technological and commercial development. It must be calculated and reported in a uniform and consistent manner to allow comparisons among different materials. In this paper, we propose a simple and universal protocol for the determination of volumetric capacity of sorbent materials at cryogenic condition. Usually, the sample container volume containing porous sample at RT can be directly determined by a helium expansion test. At cryogenic temperatures, however, this direct helium expansion test results in inaccurate values of the sample container volume for microporous materials due to a significant helium adsorption, resulting significant errors in hydrogen uptake. For reducing this container volume error, therefore, we introduced and applied the indirect method such as 'volume correction using a non-porous material', showing a reliable cold volume correction.

• 한국초전도ㆍ저온공학회논문지
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• 제17권4호
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• pp.1-7
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• 2015

This paper addresses technical problems of thermal contact conductance or resistance which inevitably occurs in most cryogenic engineering systems. The main focus of this paper is to examine what kind of physical factors primarily influences the thermal contact resistance and to suggest how it can be minimized. It is a good practical rule that the contact surface must have sub-micron roughness level with no oxide layer and be thinly covered by indium, gold, or Apiezon-N grease for securing sufficient direct contact area. The higher contact pressure, the lower the thermal contact resistance. The general description of this technique has been widely perceived and reasonable engineering results have been achieved in most applications. However, the detailed view of employing these techniques and their relative efficacies to reduce thermal contact resistances need to be thoroughly reviewed. We should consider specific thermal contact conditions, examine the engineering requirements, and execute each method with precautions to fulfil their maximum potentials.

• 한국초전도ㆍ저온공학회논문지
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• 제15권2호
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• pp.48-51
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• 2013

The thermal contact resistance (TCR) is one of the important components in the cryogenic systems. Especially, cryogenic measurement devices using a cryocooler can be affected by TCR because the systems have to consist of several metal components in contact with each other for heat transferring to the specimen without cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement device using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as roughness of metal surface, contact area and contact pressure. In this study, we designed TCR measurement system at various temperatures using a cryocooler as a heat sink and used steady state method to measure the TCR between metals. The copper is selected as a specimen in the experiment because it is widely used as a heat transfer medium in the cryogenic measurement devices. The TCR between Cu and Cu is measured for various temperatures and contact pressures. The effect of the interfacial materials on the TCR is also investigated.