• Proceedings of the IEEK Conference
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• 2004.08c
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• pp.780-783
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• 2004

The two-dimensional modeling of the non-stationary thermal state and voltage responsivity of the sensitive elements usually used in solid-state pyroelectric focal plane arrays are presented. Temperature distributions under periodical thermal excitation and the response of the thermal imaging device, which is composed of the pyroelectric sensitive elements mounted on a single silicon substrate, are numerically calculated. The sensitive element consists of a covering metal layer, infrared polymer absorber, front metal contact, sensitive pyroelectric element, the interconnecting column and the bulk silicon readout. The results of the numerical modeling show that the thermal crosstalk between sensitive elements to be critical especially at low frequency (f < 10Hz) of periodically modulated light. It is also shown that the use of our models gives the possibility to improve the design, operating regimes and sensitivity of the device.

• Transactions on Electrical and Electronic Materials
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• v.15 no.4
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• pp.217-220
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• 2014

We studied the plating properties of Sn-Pb solder according to the shape of the Cu wire's cross-section for photovoltaic ribbon. The thickness of the Sn-Pb layer largely decreased to 29% on a curved Cu surface, compared to a flat Cu surface. This phenomenon is caused by the geometrical decrease in the contact angle of the liquid Sn-Pb solder and an increase in the surface energy of the solid/vapor on the curved Cu surface. We suggest a new ribbon's design where the Cu wire's cross-section is a semi-ellipse. These semi-ellipse ribbons can decrease the use of Sn-Pb solder to 64% and increase the photovoltaic efficiency, by reducing the contact area between the ribbon and cell, to 84%. We also see an improvement of reflectivity in the curved surface.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.34-36
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• 2005

Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with $25{\mu}m$ copper wire on Au/Ni/Cu metallization of a PCB substrate was performed at ambient temperature. The central composite design of experiment (DOE) approach was applied to optimize the copper wire wedge bonding process parameters. After that, pull test of the wedge bond was performed to study the bond strength and to find the optimum bonding parameters. SEM was used to observe the cross section of the wedge bond. The pull test results show good performance of the wedge bond. Additionally, DOE results gave the optimized parameter for both the first bond and the second bond. Cross section analysis shows a continuous interconnection between the copper wire and Au/Ni/Cu metallization. The diffusion of Cu into the Au layer was also observed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.11-14
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• 2001

In all Rapid Prototyping(RP) processes, computer-aided design(CAD) solid model is sliced into thin layers of uniform, but not necessarily constant, thickness in the building direction. Each cross-sectional layer is successively deposited and, at the same time, bonded onto the previous layer, the stacked layers form a physical part of the model. The objective of this study is to develop a method for obtaining necessary coordinates$(x,\;y,\;\theta_x,\;\theta_y)$ to position linear hotwire of the cutting system in three-dimensional space for the Variable Lamination Manufacturing process (VLM-S), which utilizes expandable polystyrene foam sheet as part material. In order to examine the applicability of the developed method to VLM-S, various three-dimensional shapes, such as a spanner, a patterned columm, and a pyramid were made using data obtained from the method.

• Composites Research
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• v.23 no.2
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• pp.17-23
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• 2010

The stealth technology can increase the survivability of aircrafts or warships and enhance the capability of mission completion in hostile territory. The purpose of this paper is to present the low observable structure with curved surfaces made by fiber-reinforced composites and to show the possibility of developing omnidirectional stealth platforms for military applications. In this study, we developed a radar absorbing structures(RAS) based on a circuit analog absorber to reduce the radar cross section(RCS) of an object with curved surfaces. Firstly, the RAS with a periodic square patterned conducting polymer layer was designed and simulated using a commercial 3-D electromagnetic field analysis program. Secondly, the designed semi-cylindrical structure with low RCS was fabricated using fiber-reinforced composites and conducting polymer. To make the periodic pattern layer, acts as resistive sheet, the intrinsic conducting polymer paste containing PEDOT with a polyurethane binder was used. Finally, the radar cross section was measured to evaluate the radar absorbing performances of the fabricated RAS by the compact range facility in POSTECH.

• Journal of the Korean Association of Geographic Information Studies
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• v.10 no.4
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• pp.142-152
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• 2007

Geotechnical information database, foundation of underground geographic information system in 2nd NGIS plan, had been developing by Ministry of Construction and Transportation since 2000. This database contains not only soil condition, such as depth, type and color of layer, and ground water level, but also engineering properties used for foundation design and construction, for instance, standard penetration test, compression test. But, it is difficult to apply this database for analyzing and designing geotechnical works, because report document is only offered. In this paper, we have developed web-based geospatial information system for the effective uses. First, underground cross-section model is generated by location, layer, and engineering properties of geotechnical information database at the realtime process. Second, earth volume, bearing capacity, and settlement is calculated and potentials of soft ground, liquefaction are evaluated through pre-defined empirical formula. This process is operated by web-based client. We wish to strengthen the application capacity through this system in construction planning and design works.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.26 no.3
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• pp.311-316
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• 2015

This paper presents a design method for thin but wideband absorbers using resistive sheets. Its equivalent circuit consists of a series RLC resonant circuit and a short-terminated transmission line. Based on this equivalent circuit, we presented the three conditions for an electromagnetic absorber which has a thickness less than a quarter wavelength and wide absorption bandwidth at center frequency. By using an root-finding algorithm, the equivalent resistance, capacitance, and inductance of the absorbers are obtained. These equivalent circuit values for the absorber surface can be realized by a 2D periodic cross-shaped structure which has required surface resistance. Using the design method, we have designed the absorber which has 18.75 mm($67.5^{\circ}$ electrical length) thickness and 90 % absorption bandwidth of 116 % bandwidth at 3 GHz.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.8
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• pp.50-58
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• 2009

Fourth generation mobile communication network have the technology of extensive form include basic service technology and it has been developed from the radio access technology and network topology. Not only fourth generation mobile communication network have basically done new highspeed radio access technology which is suitable to high and low speed environment of transfer, but also it is possible that they have been made for freely vertical handover. ETRI also has made fourth generation mobile communication network which is WiNGS(Wireless Initiative for Next Generation Service) satisfied that demand. This paper is made by lossless handover method through the local retransmission ARQ agent that is one of the main technology of fourth generation mobile communication network. Lossless handover method through local retransmission ARQ agent has been basically made by WiNGS and it was better than original local retransmission of layer by simulation.

• The KIPS Transactions:PartC
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• v.11C no.7 s.96
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• pp.905-916
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• 2004

Self-organizing hierarchical ad hoc network (SOHAN) is a new ad-hoc network architecture designed to improve the scalability properties of conventional 'flat' ad hoc networks. This network architecture consists of three tiers of ad-hoc nodes, i.e.. access points, forwarding nodes and mobile nodes. This paper presents a topology discovery and routing protocol for the self-organization of SOHAN. We propose a cross-layer path metric based on link quality and MAC delay which plays a key role in producing an optimal cluster-based hierarchical topology with high throughput capacity. The topology discovery protocol provides the basis for routing which takes place in layer 2.5 using MAC addresses. The routing protocol is based on AODV with appropriate modifications to take advantage of the hierarchical topology and interact with the discovery protocol. Simulation results are presented which show the improved performance as well as scalability properties of SOHAN in terms of through-put capacity, end-to-end delay, packet delivery ratio and control overhead.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1367-1370
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• 2009

We have developed a 2D-3D convertible 7" autostereoscopic mini-monitor with high 3D quality, in which the parallax barrier LCD is attached on the TFTLCD. The excellent optical performance was achieved by design of the ghost free barrier and precise assembly between the barrier layer and the TFT-LCD panel. Our design principle and fabrication technology suppressed 3D cross-talk and improved viewing angle. In this paper, the design and fabrication process of the 3D mini-monitor are described. The evaluation for the 3D performance is also discussed.