• Journal of Welding and Joining
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• v.18 no.3
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• pp.89-96
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• 2000

As solder becomes small and fine, the reliability and solderability of solder joint are the critical issue in present electronic packaging industry. Besides the use of lead(Pb) containing solders for the interconnections of microelectronic subsystem assembly and packaging has enviromental problem. In this study, using Sn/Pb and Sn/Ag eutectic solder paste, in order to obtain decrease of solder joint strength with increasing aging time, initial solder joint strength and aging strength after 1000 hour aging at $100^{\circ}C$ were measured by peel test. And in order to obtain the growth of intermetallic compound(IMC) layer thickness, IMC layer thickness was measured by scanning electron microscope(SEM). As a result, solder joint strength was decreased with increasing aging time. The mean IMC layer thickness was increased linearly with the square root of aging time. The diffusion coefficient(D) of IMC layer was found to $1.29{\times}10^{-13}{\;}cm^2/s$ at using Sn/Pb solder paste, 7.56{\times}10^{-14}{\textrm}{cm}^2/s$ at using Sn/Ag solder paste.

• Applied Science and Convergence Technology
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• v.26 no.3
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• pp.52-54
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• 2017

An InGaN/GaN multiple quantum well (MQW) structure is grown on a GaN/sapphire template using a plasma-assisted molecular beam epitaxy (PA-MBE). The fluctuation of the quantum well thickness formed from roughly-grown InGaN layer results in a disordered photoluminescence (PL) spectrum. The surface morphologies of the InGaN layers with various In compositions are investigated by reflection high energy electron diffraction (RHEED) and atomic force microscopy (AFM). A blurred InGaN/GaN hetero-interface and the non-uniform QW size is confirmed by high resolution transmission electron microscopy (HR-TEM). Inhomogeneity of the quantum confinement results in a degradation of the quantum efficiency even though the InGaN layer has a uniform In composition.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• Journal of the Korean Vacuum Society
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• v.6 no.3
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• pp.263-266
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• 1997

We studied an interfacial characteristics of $In_{0.1}Ga_{0.9}As$/ GaAs by photoreflectance (PR) measurement at room temperature. With increasing thickness of epitaxial layer, Franz-Keldysh oscillation (FKO) periods of PR signals were decreased, and interfacial electric field was decreased. This can be explained by the increases of defects due to lattice mismatch near the heterointerface between InGaAs and GaAs. For the thickness of epitaxial layer thinner than the 300$\AA$, InGaAs epitazial layer closed to critical thickness and increased strain, and then the bandgap energy shifted high greatly.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.4
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• pp.199-203
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• 2006

This paper presents an ASER (Accelerated Soft Error Rate) integral model. The model is based on the facts that the generated EHP/s(electron hole pairs) are diminished after some residual range of the incident alpha particle, where residual range is a function of the incident angle and the capping layer thickness over the semiconductor junction. The ASER is influenced by the flux of the alpha particles, the junction area ratio, the alpha particle incident angle when the critical charge is same as the collected charge, and the sizes of the alpha source and the chip. The model was examined with 8M static RAM samples. The measured ASER data showed good agreement with the calculated values using the model. The ASER decreased exponentially with respect to the operational voltage. As the capping layer thickness increases up to $16{\mu}m$, the ASER increases, and after that thickness, the ASER decreases. The ASER increased as the depth of BNW increased from $0{\mu}m\;to\;4{\mu}m$. and then saturated. The ASER decreased as the node capacitance increased from 2fF to 5fF.

• Composites Research
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• v.24 no.3
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• pp.17-24
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• 2011

The EAM simulation of nanoindentation was performed to investigate misfit dislocation slip in the Ag/Cu. The film layer, whose thickness in the range of 2-5nm, was indented by a spherical indenter with the N$\'{o}$se-Hoover thermostat condition. The simulation shows that the indentation position relative to misfit dislocation (MFD) has the effect on the dislocation, glide up or cross slip, for Ag film layer thickness less than 4 nm. Elastic energy variation during MFDs slip was revealed to be a key factor for the softening of Ag/Cu. The critical film layer thickness was evaluated for each case of Ag/Cu according to the spline extrapolation technique.

• Transactions of Materials Processing
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• v.8 no.3
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• pp.269-275
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• 1999

A variable blank holding force method is proposed to improve deep drawing characteristics of sheet materials. In this method, the blank holding force (BHF) is controlled throughout a drawing process so that the punch load does not exceed a critical value, which is slightly less than the conventional process with the conforming process with the variable BHF is more flexible than the conventional process with the constant BHF and it could be used for improving the product's quality and drawability. In this paper we suggest a method controlling the BHF as a function of punch travel during the forming process. The optimization BHF curves are determined theoretically and experimentally. It is concluded that for the case of optimum BHF control methods the drawn cup height and the drawing formability achieved by this method are increased than those for constant BHF method. Also, as comparing the wall thickness distribution of the cup drawn by the constant BHF and the optimum BHF control, the BHF control reduce the wall thickness variation of the drawn cup at the cup wall and make the cup thickness distribution more uniformly than the constant BHF.

• Corrosion Science and Technology
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• v.16 no.4
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• pp.201-208
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• 2017

A finite element analysis is proposed to study the effect of specimen dimensions on lateral diffusion of hydrogen during hydrogen permeation flux measurements. The error of measurement on thick specimens because of 1D diffusion approximation may be as much as 70%. A critical condition for accurate measurements is to designate the area of hydrogen monitoring/exit surface smaller than the area of hydrogen charging/entry surface. For thin to medium thickness specimens (ratio of thickness to specimen radius of 5:10 and below), the charging surface should be maximized and the monitoring surface should be minimized. In case of relatively thick specimens (ratio of thickness to specimen radius above of 5:10), use of a hydrogen-diffusion barrier on the specimen boundaries is recommended. It would completely eliminate lateral losses of hydrogen, but cannot eliminate the deviation towards 2D diffusion near the side edges. In such a case, the charging surface should be maximized and the monitoring surface should be as closer in dimension as the charging surface. A regression analysis was carried out and an analytical relationship between the maximum measurement error and the specimen dimensions is proposed.

• Journal of Welding and Joining
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• v.15 no.5
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• pp.74-83
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• 1997

Effect of welding parameters such as current, speed and electrode pressure on the weld quality of tin coated steels for small containers was discussed in this paper. Welding was performed with low frequency wire seam welding system which was loaded with 1.5mm in diameter copper wire electrode. The welding parameters were monitored at the position close to the welding spot so as to minimize the instrumentation error, and the signals were stored into a digital data acquisition system before analysis. Results showed that critical current for sufficient nugget size increased as the base material thickness increased, while the width of the optimum welding range was reduced. The acceptable welding condition derived from this study was found to be effective within the thickness range of $\pm$10% of the nominal (0.25mm) thickness. Tin coating layer was proved not to affect seriously on the weld quality, i.e. strength and formability, since consumable wire electrode was used in this process. Test results also demonstrated that the welding current was thought to be the most effective parameter to form an acceptable weld, while welding speed or electrode pressure exerted less effect on the nugget formation. However, these two parameters played an important role because the former was related to the nugget overlap interval, and the latter, to the formation of expulsion during welding.

• Smart Structures and Systems
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• v.18 no.2
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• pp.267-291
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• 2016

In this research work, an exact analytical solution for thermal buckling analysis of functionally graded material (FGM) sandwich plates with clamped boundary condition subjected to uniform, linear, and non-linear temperature rises across the thickness direction is developed. Unlike any other theory, the number of unknown functions involved is only four, as against five in case of other shear deformation theories. The theory accounts for parabolic distribution of the transverse shear strains, and satisfies the zero traction boundary conditions on the surfaces of the plate without using shear correction factor. A power law distribution is used to describe the variation of volume fraction of material compositions. Equilibrium and stability equations are derived based on the present refined theory. The non-linear governing equations are solved for plates subjected to simply supported and clamped boundary conditions. The thermal loads are assumed to be uniform, linear and non-linear distribution through-the-thickness. The effects of aspect and thickness ratios, gradient index, on the critical buckling are all discussed.