• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.901-904
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• 2002

The cutting thickness of ultra-precision machining is generally very small, only a few micrometer or even down to the order of a flew manometer. In such case, a basic understanding of the mechanism on the micro-machining process is necessary to produce a high quality surface. When machining at very small depths of cut, metal flow near a rounded tool edge become important. In this paper a finite element analysis is presented to calculate the stagnation point on the tool edge or critical depth of cut below which no cutting occurs. From the simulation, the effects of the cutting speed on the critical depths of cut were calculated and discussed. Also the transition of the stagnation point according to the increase of the depths of cut was observed.

• Structural Engineering and Mechanics
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• 제84권6호
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• pp.723-731
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• 2022

Functionally graded materials (FGMs) have been spotlighted as an advanced composite material, accordingly the intensive studies have focused on FGMs to examine their mechanical behaviors. Among them is thermal buckling which has been a challenging subject, because its behavior is connected directly to the safety of structural system. In this context, this paper presents the numerical analysis of thermal buckling of metal-ceramic functionally graded (FG) plates. For an accurate and effective buckling analysis, a new numerical method is developed by making use of (1,1,0) hierarchical model and 2-D natural element method (NEM). Based on 3-D elasticity theory, the displacement field is expressed by a product of 1-D assumed thickness monomials and 2-D in-plane functions which are approximated by NEM. The numerical method is compared with the reference solutions through the benchmark test, from which its numerical accuracy has been verified. Using the developed numerical method, the critical buckling temperatures of metal-ceramic FG plates are parametrically investigated with respect to the major design parameters.

• Steel and Composite Structures
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• 제47권4호
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• pp.503-511
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• 2023

Stability of laminated plate under thermal load varied linearly along thickness, is developed using a higher order displacement field which depend on a parameter "m", whose value is optimized to get results closest to three-dimension elasticity results. Hamilton, s principle is used to derive equations of motion for laminated plates. These equations are solved using Navier-type for simply supported boundary conditions to obtain non uniform critical thermal buckling and fundamental frequency under a ratio of this load. Many design parameters of cross ply and angle ply laminates such as, number of layers, aspect ratios and E1/E2 ratios for thick and thin plates are investigated. It is observed that linear and uniform distribution of temperature reduces plate frequency.

• 한국추진공학회지
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• 제16권5호
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• pp.89-96
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• 2012

기존의 펄스에코법은 스틸 연소관 내부에서 고무면으로 초음파를 입사시키므로 검사 도중에 고무면이 오염될 수 있으며, 이로 인해 치명적인 미접착 결함을 유발시킬 수 있다. 상기 방법을 보완할 수 있는 시험 기법을 개발하기 위해 스틸/고무 접착 시험편을 제작하여 스틸면으로 초음파를 입사시켰다. 스틸/고무 접착 시험편으로부터 측정한 고무 공진 주파수는 이론적으로 예측한 공진 주파수와 일치하였다. 본 논문은 고무 공진 주파수를 이용하여 고무 두께를 측정할 수 있는 초음파 공진법에 대해 기술하였다.

• 대한기계학회논문집
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• 제11권1호
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• pp.63-73
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• 1987

본 논문에서는 차륜을 등방성, 균질 재료라고 가정하였으며 웨브와 림의 두께 가 서로 다른 환형원판으로써 내원주는 고정되고 외원주는 자유라고 가정하였다. 외 원주상의 한 점에서 철로와의 구름조건에 따라 변하는 반경방향의 반력에 의한 내평면 압축응력과 원판의 회전에 의한 내평면 압축응력을 고려하고, 두께가 변하는 웨브와 림의 경계면에서의 연속조건을 이용하여 차륜의 횡진동방정식을 세워서 Rayleigh-Ritz 방법으로 수치해석을 하여 고유진동수와 임계좌굴하중을 계산하고, 실제 차륜의 1/6크 기로 형상화하여 제작한 연성진동장치로 실험하여 이론치와 비교, 검토하였다.

• 한국정밀공학회지
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• 제21권2호
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• pp.27-34
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• 2004

In the injection molding of plastic optical lenses, the molding conditions have critical effects on the quality of the molded lenses. Since there are many molding parameters involved in injection molding process, determination of the molding conditions for lens molding is very important in order to precisely control the surface contours of an optical lens. Therefore this paper presents the application of neural network in suggesting the optimized molding conditions for improving the quality of molded parts based on data of FE Analysis carried out through CAE software, Timon-3D. Suggested model in this paper, which serves to learn from the data of FE Analysis and induce the values for optimized molding conditions. has been implemented for searching the molding conditions without void and with minimized thickness shrinkage at lens center of injection molding optical lens. As the result of this study. we have confirmed that void creation at the inside of lens is primarily determined by mold temperature and thickness shrinkage at center of lens is primarily determined by the parameters such as holding pressure and mold temperature.

• 한국자동차공학회논문집
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• 제22권1호
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• pp.126-134
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• 2014

This study investigates the structural strength analysis due to rib thickness of lower arm. At structural analysis, model 1 has the most deformation by comparing three models. As most equivalent stress is shown at the part connected with wheel knuckle, the strength becomes weaker in cases of three models. At fatigue analysis, model 1 becomes most unstabilized among three models. Model 3 has most fatigue life and the next model is model 2. The range of maximum harmonic response frequencies becomes 140 to 175Hz in cases of three models. Because the critical frequency at model 3 becomes highest among three models but the stress exceeds yield stress, model 3 becomes most unstabilized at vibration durability. As models 1 and 2 has less than yield stress, these models become stabilized. Model 2 becomes most favorable by comparing three models at structural, fatigue and vibration analyses. This study result can be effectively utilized with the design of lower arm by investigating prevention against damage and its strength durability.

• Journal of Welding and Joining
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• 제18권3호
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• pp.89-96
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• 2000

As solder becomes small and fine, the reliability and solderability of solder joint are the critical issue in present electronic packaging industry. Besides the use of lead(Pb) containing solders for the interconnections of microelectronic subsystem assembly and packaging has enviromental problem. In this study, using Sn/Pb and Sn/Ag eutectic solder paste, in order to obtain decrease of solder joint strength with increasing aging time, initial solder joint strength and aging strength after 1000 hour aging at $100^{\circ}C$ were measured by peel test. And in order to obtain the growth of intermetallic compound(IMC) layer thickness, IMC layer thickness was measured by scanning electron microscope(SEM). As a result, solder joint strength was decreased with increasing aging time. The mean IMC layer thickness was increased linearly with the square root of aging time. The diffusion coefficient(D) of IMC layer was found to $1.29{\times}10^{-13}{\;}cm^2/s$ at using Sn/Pb solder paste, 7.56{\times}10^{-14}{\textrm}{cm}^2/s$ at using Sn/Ag solder paste.

• Applied Science and Convergence Technology
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• 제26권3호
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• pp.52-54
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• 2017

An InGaN/GaN multiple quantum well (MQW) structure is grown on a GaN/sapphire template using a plasma-assisted molecular beam epitaxy (PA-MBE). The fluctuation of the quantum well thickness formed from roughly-grown InGaN layer results in a disordered photoluminescence (PL) spectrum. The surface morphologies of the InGaN layers with various In compositions are investigated by reflection high energy electron diffraction (RHEED) and atomic force microscopy (AFM). A blurred InGaN/GaN hetero-interface and the non-uniform QW size is confirmed by high resolution transmission electron microscopy (HR-TEM). Inhomogeneity of the quantum confinement results in a degradation of the quantum efficiency even though the InGaN layer has a uniform In composition.

• 한국생산제조학회지
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• 제20권5호
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.