• Proceedings of the Korean Society of Soil and Groundwater Environment Conference
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• 2005.04a
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• pp.6-8
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• 2005

The forest soils of 92 sites in Korea were analyzed to survey heavy metal background levels using aqua regia digestion method and 0.1N HCl extraction method. From these results, the average natural contents of heavy metals were Cd 0.287, Cu 15.26, Pb 18.43, Cr 25.36, Zn 54.27, Ni 17.68mg/kg for aqua regia method, and Cd 0.040, Cu 0.48, Pb 3.06, Cr 0.09, Zn 1.54, Ni 0.27mg/kg for 0.1N HCl extraction method. The range of correlation coefficients between heavy metal contents obtained from two methods(aqua regia and 0.1N HCl) was significant as $0.24{\sim}0.88$, and the correlation coefficients were decreased in order of Cd, Pb, Cu, Ni, Cr, Zn.

• Korean Journal of Weed Science
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• v.5 no.2
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• pp.149-154
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• 1985

Removal of water pollutants by water hyacinth was examined with two nutrients, $NO_3$-N, $PO_4$-P and four heavy metals, Cu, Pb, Cd, Cr under laboratory conditions. $NO_3$-N was reduced to 0.7, 0.9 and 1.2 ppm, and 0.1, 0.2 and 0.5 ppm in $NO_4$-P from 10, 25 and 50 ppm 3 days after treatment, respectively. Among heavy metals Cu and Pb were removed faster and higher than Cd and Cr and also amount of heavy metals absorbed by water hyacinth was higher in the order of Cu > Pb > Cr > Cd. Distribution of heavy metals in this plant was higher in roots than in leaves and amount absorbed in roots was related to the treated concentrations. The harmful effect on growth of water hyacinth was observed in Cu and Cd.

• Economic and Environmental Geology
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• v.34 no.3
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• pp.283-299
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• 2001

The middle cover soils and clay liners collected from the Kumheung landfill in Gongiu City were analysed for As, Ba, Cd, Co, Cr, Cu, Fe, Mn, Ni, Pb, Sr, Ti and Zn concentrations using 0.] N HCl digestion and total/sequential extraction experiments followed by ICP-AES determination. The uncontaminated soil and sediment samples were also analyzed for the comparison. The results of sequential extraction showed that Cu was dominant in the oxidizable fraction, and As, Ni, Sr, Ba, and Mn were in the exchangeable fraction. Zinc and Mn occurred mostly in association with reducible, residual and carbonate fractions. Most of Cd and Pb were bound to the reducible and oxidizable fractions. The main carrier of Co, Cr, Fe and 11 was the residual fraction and another important carrier was the reducible fraction. The percentage of the metals of organically-bound form in the middle cover soils and clay liner was in the order of Cu(48%) > Ti(42%) > Pb(27%) > As(25%) > Cd(20%). As deduced from sequential extraction analysis, potential order of metal mobility in the middle cover soils and clay liner from the landfill was proposed: Cd > Sr > As > Ni > Mn > Ba > Cu > Pb > Zn » Co > 11 > Fe > Cr. Based on the 'geoaccumulation index' and the 'enrichment factor' normalized to A], the level of contamination of Cu, Ni and C1' was significant in the samples from Kumheung landfill and surrounding farmland. Their enrichments were attributed partly to anthropogenic pollutions.

• Economic and Environmental Geology
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• v.40 no.4
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• pp.347-360
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• 2007

In order to evaluate the degree and extent of heavy metal pollution and the environmental impacts of abandoned Cu mines in Goseong-gun, soils and paddies were collected from the mine area and have been analysed for heavy metal contents. The heavy metal contents were much higher in mountain soils than in paddy soils. Total content of heavy metals decreased in order of Cu>Zn>Pb>As>Cr>Cd in mountain soils whereas Zn>Pb>Cu>Cr>As>Cd in paddy soils. The extractable amount of heavy metals by 0.1/1N HCl decreased in order of Cu>Pb>Zn>As>Cd>Cr in mountain soils whereas Pb>Cu>Zn>As>Cd>Cr in paddy soils. Although the extraction ratios were highly various depending on the sampling site, their average values were in order of Cd(16%)>Pb(10%)>Cu(9%)>As(4.5%)>Zn-Cr(${\le}2.5%$). The soils investigated were enriched in heavy metals relative to the averages of earth crust as In order of $As{\ge}Cd$>Pb>Zn>Cu>Cr. Pollution index calculated from total or extractable heavy metals of soils indicated that the heavy metal pollution was restricted to mountain soils around abandoned Cu mines, especially the Samsan I mine. The metal contents of brown rice showed no significantly contaminated level as follows; As $nd{\sim}0.87mg/kg,\;Cd\;0.02{\sim}0.34mg/kg,\;Cu\;1.01{\sim}6.25mg/kg,\;Mn\;13.4{\sim}43.2mg/kg,\;Pb\;0.09{\sim}2.83mg/kg,\;and\;Zn\;16.5{\sim}79.1mg/kg$. From the extraction and dispersion properties of heavy metal with the soil pH ($4.5{\sim}7.8$), it can be deduced the conclusion that the heavy metal pollution is spreading in the study area mainly by the detrital migration of waste ore and gangue minerals rather than the dissolution and circulation of heavy metal.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.256-256
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• 2010

투명전극부터 디스플레이 산업에 이르기까지 광범위하게 응용되어지고 있고 개발되어지고 있는 투명전도산화물(TCO)은 ZnO, In2O3, SnO2 등을 기본으로 하는 n-type 재료가 대부분이다. 그러나 투명전도 산화물을 이용한 light emitting diode(LED), 투명한 태양전지, p-형 TFT와 같은 투명전자소자의 개발을 위해서는 p-type 소재가 필수적이다. p-type TCO 소재는 비교적 연구 개발 실적이 매우 부진한 실정이었다. 1997년 넓은 밴드갭을 가지는 ABO2(delafossite) 산화물이 p-type으로서 안정적이라는 것을 보고함에 따라 이에 대한 연구가 활발히 진행되고 있다. 현재 ABO2 형태를 가진 Delafossite구조 산화물이 가장 유망한 p-type 투명전도체 소재로 거론되고 있다. Delafossite 구조가 p-type 투명전도체에 적합한 결정구조인 이유는 밴드갭이 넓고 공유결합에 유리하기 때문이다. Delafossite구조는 상온에서 2종류의 polytype(상온에서 Rhombohedaral구조와 hexagonal 구조)이 존재하며 이들은 각각 3R 및 2H의 결정 구조를 가지고 있다. ABO2의 delafossite구조에서 Cu+의 배열은 c-축을 따라 Cu-O-Cr-O-Cu의 연속적인 층 구조로서 2차원연결로 보여 진다. 보고된 Cu- base delafossite구조를 가지는 재료들은 CuAlO2, CuGaO2, CuInO2 등 여러가지가 있다. 본 연구에서는 PLD를 이용하여 c-plane 사파이어 기판위에 성장된 delafossite구조인 CuCrO2박막의 특성을 알아보았다. p-type 특성을 위하여 CuCrO2에 Zn를 첨가하였으며 그에 따른 구조적 전기적 특성을 조사하였다. 성장온도와 산소분압을 $500{\sim}700^{\circ}C$, 0~10mTorr로 변화시켜 특성을 연구하였다. 성장온도 $700^{\circ}C$, 산소분압 10mTorr에서 c-plane 사파이어 기판위에 c-축 배향의 에피성장된 CuCrO2:Zn 박막을 얻을 수 있었다. Mg를 도핑함에 따른 p-type 특성보다 현저히 떨어지는 것을 확인하였다. 또한 동일한 조건임에도 특정한 이차상의 존재를 통해 도핑된 Zn의 위치를 추측할 수 있었다. 온도와 분압에 따른 결정성과 표면상태를 SEM을 통해서 확인하였다.

• Journal of the Korean Ceramic Society
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• v.36 no.8
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• pp.835-842
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• 1999

Si3N4 -Si3N4 joints were made using Ag-Cu-Ti and Ag-Cu-In-Ti via brazing method and the change in joint strength was investigated after heat treatment at $400^{\circ}C$ or $650^{\circ}C$ for up to 2000h. The initial strength of as-brazed joints with Ag-Cu-In-Ti was lower but the reduction of the strength was less dramatic than that with Ag-Cu-Ti. The joints made of a new brazing alloy Au-Ni-Cr-Mo-Fe which is developed for high temperature applications were heat-treated at $650^{\circ}C$ for 1000h. As the heat treatment time increased the bond strength increased. The results of the joining system with Mo or Cu interlayer showed that the strength of the joint with Mo interlayer was higher but the system incurred problems in joint production Also it was found from oxidation experiment that Ti and In affected the oxidation resistance of brazing alloy.

• Korean Journal of Environmental Biology
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• v.22 no.1
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• pp.120-126
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• 2004

Kenaf plants were hydroponically grown in reactor containing toxic metals as Cd, Cu, Cr, Ni and Zn to examine the ability to take up heavy metal. The plants were fertilized using a nutrient solution, which was appropriately adjusted to optimum pH, DO and conductivity. For n hydraulic retention time of 8 days, Cr, Cd, Cu, Ni and Zn were removed up to 90.5, 80.5, 66.1%, 71.1% and 79.4%, and reduced from 2.34 to 0.54 mg $L^{-1}$, 3.37 to 1.07 mg $L^{-1}$, 4.92 to 3.19 mg $L^{-1}$, 6.31 to 4.41 mg $L^{-1}$ and 6.27 to 2.09 mg $L^{-1}$. Especially, accumulation rate of Cr, Cd, Cu, Ni and Zn in the plant were measured up to 347.32, 275.39, 157.52, 50.48 and 211.01 mg DW kg $L^{-1}d^{-1}$, respectively. We considered that Kenaf plants removed Cr, Cd and Zn more effectively than other toxic metals applied.

• Transactions of Materials Processing
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• v.8 no.3
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• pp.327-327
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• 1999

The oxidation behavior of 60%Cu-40%Zn brass haying small amounts of Zr, Cr, Mg, Al, and Si was studied between 873 and 1043 K in air. The alloying element of Mg was harmful, while other alloying elements were beneficial to oxidation resistance. Particularly, the simultaneous addition of Al and Si decreased the oxidation rate drastically. During oxidation, Zr formed ZrO₂, Cr formed CuCr₂O₄, Mg formed MgO, Al formed A1₂CuO₄, and Si formed amorphous SiO₂. These oxides were incorporated in the oxide scale composed predominantly of ZnO. The oxide scales formed on all the tested alloyswere prone to cracking, wrinkling, and spallation.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.54-58
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• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.1-7
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• 1999

We developed Fabrication process of embedded passive components in MCM-D substrate. The proposed MCM-D substrate is based on Cu/photosensitive BCB multilayer. The substrate used is Si wafer and Ti/cu metallization is used to form the interconnect layer. Interconnect layers are formed with 1000$\AA$ Ti/3000$\AA$ Cu by sputtering method and 3$\mu\textrm{m}$ Cu by electrical plating method. In order to form the vias in photosensitive BCB layer, the process of BCB and plasma etch using $C_2F_6$ gas were evaluated. The MCM-D substrate is composed of 5 dielectric layers and 4 interconnect layers. Embedded resistors are made with NiCr and implemented on the $2^{nd}$ dielectric layer. The sheet resistance of NiCr is controlled to be about 21 $\Omega$/sq at the thickness of 600$\AA$. The multi-turn sprial inductors are designed in coplanar fashion on the $4^{th}$ interconnect layer with an underpass from the center to outside using the lower $3^{rd}$ interconnect layer. Capacitors are designed and realized between $1^{st}$ interconnect layer and $2^{nd}$ interconnect layer. An important issue in capacitor is the accurate determination of the dielectric thickness. We use the 900$\AA$ thickness of PECVD silicon nitride film as dielectric. Capacitance per unit area is about 88nF/$\textrm {cm}^2$at the thickness of 900$\AA$. The advantage of this integration process is the compatibility with the conventional semiconductor process due to low temperature PECVD silicon nitride process and thermal evaporation NiCr process.