• Proceedings of the Korean Society for Emotion and Sensibility Conference
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• 1998.04a
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• pp.255-263
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• 1998

Dust-free garment prevents contamination which otherwise is caused by skin and clothes to protect from dust or dirt. Therefore, it requires high performance and should function as a working clothes. Clothes are a medium between human and thermal environmental system, and it is required to study human enviroment to ensure comfortableness of clothes and to satisfactorily go along with enviroment .This study investigates the physical and physiological features of dust-free garment used in the clean room at a semiconductor factory in oredr to scientifically clarify what the dust-free garmint is as well as to contribute to the design and development of high performance material and clothes. Three kinds of dust-free fabrics (DFG-I, DFG-II, DFG-III) which are being developed by a local company are used to manufacture dust-free garment. These dust-free garments are dressed and tested in such an enviroment as similar to semiconmemts with temperature at 23${\pm}$1$^{\circ}C$ and humidity at 50${\pm}$5%RH in order to investigate the thermo physiological and psychological features of human body. The results of this study are as follows. The results of this study are as follows. 1.The mean skin temperature was significantly different among the clothes, subjects and experimental time. Temperature tends to rise from the time of exercising load. Continuous motion coupled sealed clothes prevents heat transmittance, and temperature rises in the order of DFG-l, DFG-ll and DFG-lll as time course. 2.As for the skin temperature by local timperature is minimun on the head and torso and increares remarkably at the terminal part of human body. 3. As for the body mass loss was significantly higher in DFG-lll than DFG-l and DFG-ll. 4. Though there is no significant difference in the temperature within clothes among the kind of clothes temperature is 1$^{\circ}C$ higher in the back. Temperature within all the dust-free garments 29.7$^{\circ}C$ in the back and 31.3$^{\circ}C$ in the chest which belong to the comfort zone(31-33$^{\circ}C$). The relative humidity is 39.7%RH in the chest and 33.8%RH in the back which is slightly below the comfort zone(40-60%RH) 5. The thermal sensation belong to the comfort zone regardless of the kinds of clothes. The subjects feels a slight fatigue as times goes. As for the subjective sense of subjects the mean skin temperature as well as temperature and humidity within clothes show similar tendency. This means that they relate with each other.

• Journal of the Optical Society of Korea
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• v.15 no.2
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• pp.174-181
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• 2011

An airborne sensor is developed for remote sensing on an aerial vehicle (UV). The sensor is an optical payload for an eletro-optical/infrared (EO/IR) dual band camera that combines visible and IR imaging capabilities in a compact and lightweight package. It adopts a Ritchey-Chr$\'{e}$tien telescope for the common front end optics with several relay optics that divide and deliver EO and IR bands to a charge-coupled-device (CCD) and an IR detector, respectively. The EO/IR camera for dual bands is mounted on a two-axis gimbal that provides stabilized imaging and precision pointing in both the along and cross-track directions. We first investigate the mechanical deformations, displacements and stress of the EO/IR camera through finite element analysis (FEA) for five cases: three gravitational effects and two thermal conditions. For investigating gravitational effects, one gravitational acceleration (1 g) is given along each of the +x, +y and +z directions. The two thermal conditions are the overall temperature change to $30^{\circ}C$ from $20^{\circ}C$ and the temperature gradient across the primary mirror pupil from $-5^{\circ}C$ to $+5^{\circ}C$. Optical performance, represented by the modulation transfer function (MTF), is then predicted by integrating the FEA results into optics design/analysis software. This analysis shows the IR channel can sustain imaging performance as good as designed, i.e., MTF 38% at 13 line-pairs-per-mm (lpm), with refocus capability. Similarly, the EO channel can keep the designed performance (MTF 73% at 27.3 lpm) except in the case of the overall temperature change, in which the EO channel experiences slight performance degradation (MTF 16% drop) for $20^{\circ}C$ overall temperate change.

• Korean Journal of Optics and Photonics
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• v.17 no.3
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• pp.278-284
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• 2006

We have fabricated and measured electrooptic modulator using coupled stack InAs/InGaAs quantum dots. The height of the quantum dot is 16 nm and quantum dots are stacked including an InGaAs capping layer. The peak wavelength of photoluminescence is 1260 nm at room temperature and 1158 nm at 12 K. The operation characteristics of the quantum dots show high modulation efficiency of electrooptic modulator at 1550 nm compared to that of existing III-V bulk and MQW type semiconductor. The measured switching voltage ($V\pi$) is 540 and 600 mV, for TE mode and TM mode, respectively. From the results, the modulation efficiency can be determined as 333.3 and $300^{\circ}/V{\cdot}mm$ for TE and TM modes. The results reported here may lead to the design and fabrication of a novel electrooptic modulator with low switching voltage and high efficiency.

• Journal of the Korea Society for Simulation
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• v.24 no.4
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• pp.107-118
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• 2015

Many approaches to agent collaboration have been introduced in military war-games, and those approaches address methods for simulation entity (actor) collaboration within a team to achieve given goals. To meet fast-changing battlefield situations, an actor must be loosely coupled with their tasks and be able to take over the role of other actors if necessary to reflect role handovers occurring in real combat. Achieving these requirements allows the transfer of tasks assigned one actor to another actor in circumstances when that actor cannot execute its assigned role, such as when destroyed in action. Tight coupling between an actor and its tasks can prevent role handover in fast-changing situations. Unfortunately, existing approaches and war-game strictly assign tasks to actors during design, therefore they prevent the loose coupling. To overcome these shortcomings, our Role-based Command Hierarchy (ROCH) model dynamically assigns roles to actors based on their situation at runtime. In the model, "Role" separates actors from their tasks. In this paper, we implement the ROCH model as a component that uses a publish-subscribe pattern to handle the link between an actor and the roles of its subordinates (other actors).

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.8 no.1
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• pp.13-21
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• 1997

In this paper, the oscillator type active antenna used as an element of active phased array antenna is designed and fabricated using slot coupling. The radiating element and active circuit are fabricated on each layer respectively and coupled electromagnetically through slot on the ground plane. This structure can solve the problems such as narrow bandwidth of microstrip antenna, spurious radiation by active circuits, and spaces for integration of the feeding circuits which are caused by integrating antennas with oscillator circuits in the same layer. The active antenna in this paper, the oscillation frequency can be tuned linearly by controlling the drain bias voltage of FET. The frequency tuning range is between 12.37 GHz to 12.65 GHz when bias voltage is varied from 3V to 9V, thus frequency tuning bandwidth is 280 MHz (2.24%). The output power of antenna is uniform within 5dB over frequency tuning range. Therefore this active antenna can be used as an element of linear or planar active phased array antennas.

• The Journal of the Acoustical Society of Korea
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• v.39 no.4
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• pp.351-363
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• 2020

Launch vehicles are subject to airborne acoustic loads during atmospheric flight and these effects become pronounced especially in transonic region. As the vibration due to the acoustic loads can cause malfunction of payloads, it is essential to predict and reduce the acoustic loads. In this study, a complete process has been developed for predicting airborne vibro-acoustic environment inside the payload pairing and subsequent noise reduction procedure employing acoustic blankets and Helmholtz resonators. Acoustic loads were predicted by Reynolds-Averaged Navier-Stokes (RANS) analysis and a semi-empirical model for pressure fluctuation inside turbulent boundary layer. Coupled vibro-acoustic analysis was performed using VA One SEA's Finite Element Statistical Energy Analysis (FE-SEA) hybrid module and ANSYS APDL. The process has been applied to a hammerhead launch vehicle to evaluate the effect of acoustic load reduction and accordingly to verify the effectiveness of the process. The presently developed process enables to obtain quick analysis result with reasonable accuracy and thus is expected to be useful in the initial design phase of a launch vehicle.

• Archives of Pharmacal Research
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• v.21 no.4
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• pp.465-469
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• 1998

The search for platinum (II)-based compounds with improved therapeutic properties was prompted to design and synthesize a new family of water-soluble, third generation cis-diaminedichloroplatinum (II) complexes linked to uracil and uridine. Six heretofore unreported uracil and uridine-platinum (II) complexes are; [N-(uracil-5-yl-methyl)ethane-1,2-di-amine]dichloroplatinum (II) (3a), [N-(uracil-6-yl-methyl)ethane-1,2-diaminel dichloroplatinum (II) (3b), t[N-($2^1$, $3^1$,$5^1$-tri-O-acetyl)uridine-5-yl-methyl] ethane-1,2-diamineldichloroplatinum (II) (6a), {[N-($2^1$,$3^1$, $5^1$-tri-O-acetyl) uridine-6-yl-methyl]ethane-1,2-diamine)dichloroplatinum (II) (6b),[N-(uridine- 5-yl-methyl)ethane-1,2-diamine]dichloroplatinum (II) (7a), [N-(uridine-6-yl- methyl)ethane-1,2-diamine]dichloroplatinum (II) (7b). These analogues were prepared from the key starting materials, 5-chloromethyluracil (1a) and 6-chloromethyluracil (1b) which were reacted with ethylenediamine to afford the respective 5-[(2-aminoethyl)aminol methyluracil (2a) and 6-[(2-aminoethyl)amino]methyluracil (2b). The cis-platin complexes 3a and 3b were obtained through the reaction of the respective 2a and 2b with potassium tetrachloroplatinate (II). The heterocyclic nucleic acid bases 1a and 1b were efficiently introduced on the .betha.-D-ribose ring via a Vorbruggen-type nucleoside coupling procedure with hexamethyldisilazane, trimethylchlorosilane and stannic chloride under anhydrous acetonitrile to yield the stereospecific .betha.-anomeric 5-chloromethyl- $2^1$,$3^1$,$5^1$-tri-O-acetyluridine (4a) and 6-chloromethyl-$2^1$,$3^1$,$5^1$-tri-O-acetyluridine (4b), respectively. The nucleosides 4a and 4b were coupled with ethylenediamine to provide the respective 5-[(amino-ethyl)aminolmethyl-$2^1$,$3^1$,$5^1$-tri-O-acetyluridine (5a) and 6-[(aminoethyl)amino] methyl-$2^1$,$3^1$,$5^1$-tri-O-acetyluridine (5b). The diamino-uridines 5a and 5b were reacted with potassium tetrachloroplatinate (II) to give the novel nucleoside complexes, 6a and 6b, respectively which were deacetylated into the free nucleosides, 7a and 7b by the treatment with CH$_{3}$ONa. The cytotoxic activities were evaluated against three cell lines (FM-3A, P-388 and J-82) and none of the synthesized compounds showed any significant activity.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.43-50
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• 2009

Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.22 no.6
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• pp.79-88
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• 2008

In this study electromagnetic fields near electric power lines were derived by dipole antenna theory and electromagnetic fields near 3 phase power lines with vertical configurations were formulated and could be computed easily using these formula. It seems that those formula could be applicable to the consideration of electromagnetic fields during the design of transmission and distribution lines. Those formulated equations on elements of electromagnetic fields were applied to the model of a transmission-line system and were calculated by Matlab programs. The calculation results are follows. For variation of horizontal distance profiles of $E_y$ and $B_z$ are same each other, and also those of $B_y$ and $E_z$ are same each other. This means that coupled elements of E and B are perpendicular each other and have the propagation direction of the right-hand system such as $x{\rightarrow}E_y{\rightarrow}B_z$. Resultant electric field E is dominated by the element $E_y$ and resultant magnetic field B is dominated by the element $B_z$.

• The KIPS Transactions:PartD
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• v.11D no.2
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• pp.435-442
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• 2004

It is important to integrate an enterprise application for automating of the business process, which is responded by a flow of market environment. There are two categories of method that integrate enterprise applications. One is Synchronous Integration, and the other is Asynchronous Integration. EAI(Enterprise Application Integration) and Web service which of the asynchronous integration is focused in the automating method of the business process. After we construct the application integration for automating of the business process, we have to concern about managing of the business transaction. Many Organizations have proposed the process method of business transaction based on 2-phase commit protocol. But this method can't supply the phase that classify the transaction by transaction weight. In this paper, we propose an efficient method of transaction process for business transactions, which is composed by "Classify Phase" that classify transactions. We called this model "3-Phase Commit Method Applied by Classify Phase, " we design this model to manage an resource of enterprise efficiently. The proposed method is compared by the method based on 2-Phase commit that could be a problem of management the resource of enterprise, and the advantage of this method is certified to propose the solution of that problem.ion of that problem.