• Journal of information and communication convergence engineering
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• v.5 no.3
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• pp.215-218
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• 2007

In this paper, amorphous semiconductor and insulator thin film are etched using reactive ion etcher. At that time, we experiment in various RIE conditions (chamber pressure, gas flow rate, rf power, temperature) that have effects on quality of thin film. The using gases are $CF_4,\;CF_4+O_2,\;CCl_2F_2,\;CHF_3$ gases. The etching of a-Si:H thin film use $CF_4,\;CF_4+O_2$ gases and the etching of $a-SiO_2,\;a-SiN_x$ thin film use $CCl_2F_2,\;CHF_3$ gases. The $CCl_2F_2$ gas is particularly excellent because the selectivity of between a-Si:H thin film and $a-SiN_x$ thin film is 6:1. We made precise condition on dry etching with uniformity of 5%. If this dry etching condition is used, that process can acquire high yield and can cut down process cost.

• Transactions on Electrical and Electronic Materials
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• v.5 no.1
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• pp.1-6
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• 2004

Zinc sulfide is a semiconductor with wide band gap and high refractive index and hence promising material to be used as ARC on commercial silicon solar cells. Uniform deposition of zinc sulfide (ZnS) by using chemical bath deposition (CBD) method over a large area of silicon surface is an emerging field of research because ZnS film can be used as a low cost antireflection coating (ARC). The main problem of the CBD bath process is the huge amount of precipitation that occurs during heterogeneous reaction leading to hamper the rate of deposition as well as uniformity and chemical stoichiometry of deposited film. Molar concentration of thiorea plays an important role in varying the percentage of reflectance and refractive index of as-deposited CBD ZnS film. Desirable rate of film deposition (19.6 ${\AA}$ / min), film uniformity (Std. dev. < 1.8), high value of refractive index (2.35), low reflectance (0.655) have been achieved with proper optimization of ZnS bath. Decrease in refractive index of CBD ZnS film due to high temperature treatment in air ambiance has been pointed out in this paper. Solar cells of conversion efficiency 13.8 ％ have been successfully achieved with a large area (103 mm ${\times}$ 103 mm) mono-crystalline silicon wafers by using CBD ZnS antireflection coating in this modified approach.

• Imaging Science in Dentistry
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• v.47 no.2
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• pp.75-86
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• 2017

Purpose: The purpose of this study was to apply a newly developed free software program, at low cost and with minimal time, to evaluate the quality of dental and maxillofacial cone-beam computed tomography (CBCT) images. Materials and Methods: A polymethyl methacrylate (PMMA) phantom, CQP-IFBA, was scanned in 3 CBCT units with 7 protocols. A macro program was developed, using the free software ImageJ, to automatically evaluate the image quality parameters. The image quality evaluation was based on 8 parameters: uniformity, the signal-to-noise ratio (SNR), noise, the contrast-to-noise ratio (CNR), spatial resolution, the artifact index, geometric accuracy, and low-contrast resolution. Results: The image uniformity and noise depended on the protocol that was applied. Regarding the CNR, high-density structures were more sensitive to the effect of scanning parameters. There were no significant differences between SNR and CNR in centered and peripheral objects. The geometric accuracy assessment showed that all the distance measurements were lower than the real values. Low-contrast resolution was influenced by the scanning parameters, and the 1-mm rod present in the phantom was not depicted in any of the 3 CBCT units. Smaller voxel sizes presented higher spatial resolution. There were no significant differences among the protocols regarding artifact presence. Conclusion: This software package provided a fast, low-cost, and feasible method for the evaluation of image quality parameters in CBCT.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.10 no.6
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• pp.55-62
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• 2010

Monitoring systems are able to report certain events at region of interest(ROI) and to take an appropriate action. From industrial product line full of robots to fire detection, intrusion detection, smart grid application, environmental pollution alarm system, monitoring system has widely used in diverse industry sector. Recently, due to advance of wireless communication technology and availability of low cost sensors, intelligent and/or smart monitoring systems such as sensor networks has been developed. Several deployment methods are introduced to meet various monitoring needs and deployment performance criteria are also summarized to be used to identify weak point and be useful at designing monitoring systems. Both efficiency during deployment and usefulness after the deployment should be assessed. Efficiency factors during deployment are elapsed time, energy required, deployment cost, safety, sensor node failure rate, scalability. Usefulness factors after deployment are ROI coverage, connectivity, uniformity, target density similarity, energy consumption rate per unit time and so on.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.81-85
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• 2022

Mist-CVD is known to have advantages of low cost and high productivity method since the precursor solution is misting with an ultrasonic generator and reacted on the substrate under vacuum-free conditions of atmospheric pressure. However, since the deposition distribution is not uniform, various efforts have been made to derive optimal conditions by changing the angle of the substrate and the position of the outlet to improve the result of the preceding study. Therefore, in this study, a deposition distribution uniformity model was derived through the shape and position of the substrate support and the conditions of inlet flow rate using the particle tracking method of computational fluid dynamics (CFD). The results of analysis were compared with the previous studies through experiment. It was confirmed that the rate of deposition area was improved from 38.7% to 100%, and the rate of deposition uniformity was 79.07% which was higher than the predicted result of simulation. Particle tracking method can reduce trial and error in experiments and can be considered as a reliable prediction method.

• Journal of Sensor Science and Technology
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• v.33 no.1
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• pp.24-29
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• 2024

Inkjet printing technology is used to mass-produce displays and electrochemical sensors by dropping tens of pico-liters or less of specific-purpose ink through nozzles, just as ink is sprayed and printed on paper. Unlike the deposition method for vaporizing material in a vacuum, inkjet printing technology can be used for processing even under general atmospheric pressure and has a cost advantage because the material is dissolved in a solvent and used in the form of ink. In addition, because it can only be printed on the desired part, masks are not required. However, a technical shortcoming is the difficulty for commercialization, such as uniformity for forming the thickness and coffee ring effect. As sizes of devices decrease, the need to print electrodes with precision, thinness, and uniformity increases. In this study, we improved the printing and processing conditions to form a homogeneous electrode using Ag ink (DGP-45LT-15C) and applied this for patterning to fabricate a heat sensor. Upon the application of voltage to the heat sensor, the model with an extended width exhibited superior heat performance. However, in terms of sheet resistance, the model yielded an equivalent value of 21.6 Ω/□ compared to the ITO.

• Journal of Industrial and Engineering Chemistry
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• v.68
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• pp.387-392
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• 2018

Various technical approaches and concepts have been proposed to develop conductive super-hydrophobic (SH) surfaces. However, most of these approaches are not usable in practical applications because of insufficient adhesion and cost issues. Additionally, durability and uniformity issues are still in need of improvement. The goal of this research is to produce a large-area conductive SH surface with improved adhesion performance and uniformity. To this end, carbon nanotubes (CNT) with a high aspect ratio and elastomeric polymer were utilized as a conductive filler and matrix, respectively, to form a coating layer. Additionally, nanoscale silica particles were utilized for stable implementation of the conductive SH surface. To improve the adhesion properties between the SH coating layer and substrate, pretreatment of the substrate was conducted by utilizing both wet and dry etching processes to create specific organic functional groups on the substrate. Following pretreatment of the surface, a zirco-aluminate coupling agent was utilized to enhance adhesion properties between the substrate and the SH coating layer. Raman spectroscopy revealed that adhesion was greatly improved by the formation of a chemical bond between the substrate and the SH coating layer at an optimal coupling agent concentration. The developed conductive SH coating attained a high electromagnetic interference (EMI) shielding effectiveness, which is advantageous in self-cleaning EMI shielding applications.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.91-94
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• 2005

With increasing demands for large-scale micro-optical components in the field of digital display, the establishment of large-scale fabrication technology fur polymeric patterns has become a priority. The starting point of any polymer replication process is the mold, and the mold often has flat surface. However, It is very hard to replicate large-scale micro patterns using the flat mold, because the cost of large-scale flat mold was very high, and some uniformity and releasing problems were often occurred in large scale flat molding process. In this study, a UV roll imprinting system to overcome the financial and fabrication issues of large-scale pattern replication process was designed and constructed. As a practical example of the system, a lenticular lens with radius of curvature of $223{\mu}m$ and pitch of $280{\mu}m$, which was used to provide wide viewing angle in projection TV, was designed and fabricated. The roll stamper was fabricated using direct machining process of aluminum roll base. Finally, the shape accuracy and uniformity of roll imprinted lenticular lens sheet were measured and analyzed.

• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.53-59
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• 2011

Recently there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper we focused on the deformation of the $2^{nd}$ generation TFT-LCD sized ($370{\times}470mm^2$) large-area soft mold in the UV imprinting process. A mold was fabricated with PDMS(Poly-dimethyl Siloxane) layered glass back plate(t0.5). Besides, the mold includes large surrounding wall type protrusions of 1.9 mm width and the via-hole(7 ${\mu}m$ diameter) patterend area. The large surrounding wall type protrusions cause the proximity effect which severely degrades the uniformity of residual layer in the via-hole patterend area. Therefore the deformation of the mold was calculated by finite element analysis to assess the effect of large surrounding wall type protrusions and the flexiblity of the mold. The deformation of soft mold was verified by the measurements qualitatively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.138-143
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• 2004

CMP (Chemical Mechanical Polishing) technology for global planarization of multilevel interconnection structure has been widely studied for the next generation devices. Among the consumables for CMP process, especially, slurry and their chemical compositions play a very important role in the removal rates and within-wafer non-uniformity (WIWNU) for global planarization ability of CMP process. However, CMP slurries contain abrasive particles exceeding 1 ${\mu}{\textrm}{m}$ size, which can cause micro-scratch on the wafer surface after CMP process. Such a large size particle in these slurries may be caused by particle agglomeration in slurry supply-line. In this work, to investigate the effects of agglomeration on the performance of oxide CMP slurry, we have studied an aging effect of silica slurry as a function of particle size distribution and aging time during one month. We Prepared and compared the self-developed silica slurry by adding of alumina powders. Also, we have investigated the oxide CMP characteristics. As an experimental result, we could be obtained the relatively stable slurry characteristics comparable to aging effect of original silica slurry. Consequently, we can expect the saving of high-cost slurry.