• Title/Summary/Keyword: Cost of uniformity

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A curtain traveling pluviator to reconstitute large scale sand specimens

  • Kazemi, Majid;Bolouri, Jafar B.
    • Geomechanics and Engineering
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    • v.14 no.2
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    • pp.131-139
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    • 2018
  • The preparation of repeatable and uniformly reconstituted soil specimens up to the specified conditions is an essential requirement for the laboratory tests. In this study for large samples replication, the simultaneous usage of the traveling pluviation and curtain raining technique is used to develop a new method, called the curtain travelling pluviator (CTP). This simple and cost effective system is based on the air pluviation approach, whilst reducing the sample production time, can reproduce uniform samples with relative densities ranging from 25% to 96%. In order to investigate the resulting suitability and uniformity from the proposed method, a series of tests is performed. The effect of curtain traveling velocity, curtain width, drop height, and flow rate on the parameters of the sample is thoroughly investigated. Increase in the curtain velocity and drop height leads to the increase in relative density for the sand specimen. Increase in curtain width typically resulted in the reduction of relative density. Test results reveal that the terminal drop height for the sand specimen in this study is more than 500 mm. Relative density contour lines are presented that can be utilized in optimizing the drop height and curtain width parameters. Sample uniformity in the vertical and horizontal orientation is investigated through the sampling containers. Increasing relative density tends to result in the higher sample repeatability and uniformity.

Uniformity Prediction of Mist-CVD Ga2O3 Thin Film using Particle Tracking Methodology (입자추적 유동해석을 이용한 초음파분무화학기상증착 균일도 예측 연구)

  • Ha, Joohwan;Park, Sodam;Lee, Hakji;Shin, Seokyoon;Byun, Changwoo
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.3
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    • pp.101-104
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    • 2022
  • Mist-CVD is known to have advantages of low cost and high productivity compared to ALD and PECVD methods. It is capable of reacting to the substrate by misting an aqueous solution using ultrasonic waves under vacuum-free conditions of atmospheric pressure. In particular, Ga2O3 is regarded as advanced power semiconductor material because of its high quality of transmittance, and excellent electrical conductivity through N-type doping. In this study, Computational Fluid Dynamics were used to predict the uniformity of the thin film on a large-area substrate. And also the deposition pattern and uniformity were analyzed using the flow velocity and particle tracking method. The uniformity was confirmed by quantifying the deposition cross section with an FIB-SEM, and the consistency of the uniformity prediction was secured through the analysis of the CFD distribution. With the analysis and experimental results, the match rate of deposition area was 80.14% and the match rate of deposition thickness was 55.32%. As the experimental and analysis results were consistent, it was confirmed that it is possible to predict the deposition thickness uniformity of Mist-CVD.

Annealing effects of CMP slurry abrasives (CMP 슬러리 연마제의 어닐링 효과)

  • Park, Chang-Jun;Jeong, So-Young;Kim, Chul-Bok;Choi, Woon-Shik;Seo, Yong-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05d
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    • pp.105-108
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    • 2003
  • CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, We have studied the CMP (chemical mechanical polishing) characteristics of slurry by adding of raw alumina abrasive and annealed alumina abrasive. As a experimental results, we obtained the comparable slurry characteristics compared with original silica slurry in the view point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

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Chemical Mechanical Polishing Characteristics of Mixed Abrasive Slurry by Adding of Alumina Abrasive in Diluted Silica Slurry (탈이온수로 희석된 실리카 슬러리에 알루미나 연마제가 첨가된 혼합 연마제 슬러리의 CMP 특성)

  • 서용진;박창준;최운식;김상용;박진성;이우선
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.6
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    • pp.465-470
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    • 2003
  • The chemical mechanical polishing (CMP) process has been widely used for the global planarization of multi-layer structures in semiconductor manufacturing. The CMP process can be optimized by several parameters such as equipment, consumables (pad, backing film and slurry), process variables and post-CMP cleaning. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, the slurry dominates more than 40 %. In this paper, we have studied the CMP characteristics of diluted silica slurry by adding of raw alumina abrasives and annealed alumina abrasives. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

SLURRY UTILIZATION SYSTEM IN THE PADDY FIELD

  • I. H. Oh;Kim, K.D.
    • Proceedings of the Korean Society for Agricultural Machinery Conference
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    • 2000.11c
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    • pp.784-791
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    • 2000
  • To improve the uniformity of slurry spreading and to reduce the odor problem, a hose slurry spreader was developed, which spread the slurry near to the surface of the soil. First, the uniformity of slurry spreading was investigated. The best result of 8.1 % CV was obtained at the rotor speed of 250 rpm than any other speeds for the swine slurry, which contains 13.6% of dry matter. In case of dairy cattle slurry, which contains 8.2% of dry matter, the uniformity has the best result of CV 7.2% by high rotor speed of 330 rpm. A high speed of rotor has built a sufficient pressure in the distributor and discharged a uniform quantity of slurry through the hoses. Therefore, in practical use one should work with rotor speed over 300 rpm to maximize the uniformity of slurry spreading. Second, odor test was done with the swine slurry. While the conventional spreader shows ∑ value 440, the hose slurry spreader and its combination of disk harrow show ∑ value 258 and 184 respectively. With the air dilution sensual test and a 3-point odor bag, the conventional spreader shows 66.9 or 35.4 point and by the hose slurry spreader is 9.7 or 11.1 point. So, the developed spreader was found to have a greater effect on the reduction of odor problem. Finally, it is recommended to spread certain amount of the slurry for paddy field equivalent to the chemical fertilizer based on the N-content. It means 22 tons of swine slurry per ha. Since most of the livestock farms possess less arable land, a system of linking farms is necessary to utilize the slurry crossover the farms. The cost of slurry utilization including filling, transport spreading and brokerage is 3200-6800 Won/㎥ in accordance with the transport distance.

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Characteristics of 2-Step CMP (Chemical Mechanical Polishing) Process using Reused Slurry by Adding of Silica Abrasives (실리카 연마제가 첨가된 재활용 슬러리를 사용한 2단계 CMP 특성)

  • 서용진;이경진;최운식;김상용;박진성;이우선
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.9
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    • pp.759-764
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    • 2003
  • Recently, CMP (chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of roused silica slurry in order to reduce the costs of CMP slurry. The post-CMP thickness and within-wafer non-uniformity (WIWNU) wore measured as a function of different slurry composition. As an experimental result, the performance of reused slurry with annealed silica abrasive of 2 wt% contents was showed high removal rate and low non-uniformity. Therefore, we propose two-step CMP process as follows , In tile first-step CMP, we can polish the thick and rough film surface using remaked slurry, and then, in the second-step CMP, we can polish the thin film and fine pattern using original slurry. In summary, we can expect the saying of high costs of slurry.

Characteristics of 2-Step CMP (Chemical Mechanical Polishing) Process using Reused Slurry (재활용 슬러리를 사용한 2단계 CMP 특성)

  • Lee, Kyoung-Jin;Seo, Yong-Jin;Choi, Woon-Shik;Kim, Ki-Wook;Kim, Sang-Yong;Lee, Woo-Sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.11a
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    • pp.39-42
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    • 2002
  • Recently, CMP (chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of reused silica slurry in order to reduce the costs of CMP slurry. The post-CMP thickness and within-wafer non-uniformity(WIWNU) were measured as a function of different slurry composition. As a experimental result, the performance of reused slurry with annealed silica abrasive of 2 wt% contents was showed high removal rate and low non-uniformity. Therefore, we propose two-step CMP process as follows In the first-step CMP, we can polish the thick and rough film surface using remaked slurry, and then, in the second-step CMP, we can polish the thin film and fine pattern using original slurry. In summary, we can expect the saving of high costs of slurry.

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Fabrication of a stamper and injection molding for micro pattern product (미세 패턴 제품 마스터 제작 및 성형 공정 기술 개발)

  • Yoo Y.E;Seo Y.H;Je T.J.;Choi D.S
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.216-219
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    • 2005
  • In recent, LCD becomes one of the main display devices and expected to have quite good market share during the next couple of years. The demand for low cost and high performance, however, is becoming severe as the competition among other display devices like PDP, OLED increases. To satisfy this demand from market, we need to optimize the parts or modules of the LCD, reduce the number of the assemble and enhance the process for the high brightness and uniformity of the LCD. The LCD consists mainly of LCD panel and Backlight unit(BLU). BLU, which takes big portion of the cost for LCD, consists of light source, light guide panel and many kinds of functional film. Recently light guide panel or film for BLU has micro patterns on its surface and consequently to reduce the number of parts and enhace the brightness and its uniformity. In this study, some methodologies for the fabrication of the master/stamper and molding the light quide panel are introduced for 50um pitch of prizm patterned substrate. Mechanical machining process is adapted and optimized to fabricate micro patterned stamper using the micro cutting tool. Injection molding technology is also developed to obtain uniformly replicated micro patterned products.

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Study of Design & CFD Analysis for Partial DPF Utilizing Metal Foam (금속폼을 이용한 Partial DPF의 설계 및 전산유체해석 연구)

  • Yoon, Cheon-Seog;Cho, Gyu-Baek
    • Transactions of the Korean Society of Automotive Engineers
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    • v.17 no.1
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    • pp.24-34
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    • 2009
  • DPF(Diesel Particulate Filter)s have been used to reduce the most of PM(particulate matters) from the exhaust emissions of diesel engine vehicles. Metal foam is one of promising materials for the DPFs due to its cost effectiveness, good thermal conductivity and high mechanical strength. It can be fabricated with various pore sizes and struct thickness and coated with catalytic wash-coats with low cost. In order to design metal foam filter and analyze the flow phenomena, pressure drop and filtration experiment are carried out. Partial DPF which has PM reduction efficiency of more than 50 % is designed in this paper. Also, CFD analysis are performed for different configurations of clean filters in terms of pressure drop, uniformity index, and velocity magnitude at face of filter. Filter thickness and the gap between front and rear filters are optimized and recommended for manufacturing purpose.

Optimization Methods of Adaptive Multi-Stage Distance Joins (적응적 다단계 거리 조인의 최적화 기법)

  • Shin, Hyo-Seop;Moon, Bong-Ki;Lee, Suk-Ho
    • Journal of KIISE:Databases
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    • v.28 no.3
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    • pp.373-383
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    • 2001
  • The distance join is a spatial join which finds data pairs in the order of distance when associating two spatial data sets. This paper proposes several methods to optimize the adaptive multi-stage distance join, presented in [1]. First, we optimize the sweeping index formula which is used for selecting sweeping axis during plane sweeping. Second, to improve the performance of a priority queue used for maintaining node pairs, we propose to use the maximum distance of a node pair as the second priority of the queue. Moreover, we compare trade-offs in estimating the cut-off distance between under uniformity assumption of data distribution and non-uniformity assumption. The experiments show that the proposed methods greatly improve the performance of the algorithm in CPU cost as well as in I/O cost.

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