• Title/Summary/Keyword: Cost of uniformity

Search Result 175, Processing Time 0.038 seconds

Development of High-Density Information Storage Media by Employing the Six Sigma Methodology (식스 시그마 기법을 활용한 고밀도 정보저장 매체 개발)

  • Lee, Myung-Bok
    • Journal of the Korea Convergence Society
    • /
    • v.9 no.9
    • /
    • pp.41-46
    • /
    • 2018
  • Six sigma methodology is the management tools not only can cause productivity enhancement through the quality control and cost reduction of products and services but also can be applied to various activities of corporates such as research and development. Development of high-density information storage media and devices is indispensible to accomplish the information convergence era. In this paper, we report the case of applying six sigma methodology and tools to the development project of high-density information storage media. The standard DMAIC process was applied to the project and pursuing goals and tools and results in each stage were explained in detail. By adopting the methodology, we could establish fabrication methods of information storage media of recording density higher than $250Gb/in^2$ with high uniformity and reproducibility. The magnetic property and performance of fabricated media were confirmed through measurement of the magnetic hysteresis curve.

Gamut Mapping Based on Color Space Division for Enhancement of Lightness Contrast and Chrominance (휘도 대비와 채도 향상을 위한 색 공간 분할 색역 사상)

  • Cho, Yang-Ho;Kim, Yun-Tae;Lee, Cheol-Hee;Ha, Yeong-Ho
    • Journal of the Institute of Electronics Engineers of Korea SP
    • /
    • v.39 no.5
    • /
    • pp.513-521
    • /
    • 2002
  • This paper proposes a gamut mapping algorithm based on color space division for cross media color reproduction. As each color device has a limited range of producible colors, reproduced colors on a destination device are different from those of the original device. In order to reduce the color difference, the proposed method divides the whole gamut into parabolic shapes based on intersecting lightness by the just noticeable difference (JND) and the original device gamut boundary. Dividing the gamut with parabolic shapes and piecewise mapping of each region not only considers gamut characteristics but also provides for mapping uniformity. Also the lightness variations are more sensitive to the human visual system and by using lightness JND it can restrict lightness mapping variations that are unperceivable to enhance lightness contrast and chrominance. As a result, the proposed algorithm is able to reproduce high quality images using low-cost color devices.

Preparation of MgO Protective layer by reactive magnetron Sputtering (반응성 스퍼트링에 의한 MgO 유전체 보호층 형성에 관한 연구)

  • Ha, H. J.;Lee, W. G.;Ryu, J. H.;Song, Y.;Cho, J. S.;Park, C. H.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 1996.05a
    • /
    • pp.59-62
    • /
    • 1996
  • Plasma displays (PDP) as a large area wall-hanging display device are rabidly developed with flat CRT, TPT LCD and etc. Especially, AC Plasma Display Panels(AC PDPs) have the inherent memory function which is effective for large area displays. The memory function in AC PDPs is caused by the accumulation of the electrical charge on the protecting layer formed on the dielectric layer. This MgO protective layer prevents the dielectric layer from sputtering by ion in discharge plasma and also has the additional important roll in lowering the firing voltage due to the large secondary electron emission coefficient). Until now, the MgO Protective layer is mainly formed by E-Beam evaporation. With increasing the panel size, this process is difficult to attain cost reduction, and are not suitable for large quantity of production. To the contrary, the methode of shuttering are easy to apply on mass production and to enlarge the size of the panel and shows the superior adhesion and uniformity of thin film. In this study, we have prepared MgO protective layer on AC PDP Cell by reactive magnetron sputtering and studied the effect of MgO layer on the surface discharge characteristics of ac PDP.

  • PDF

투명 산화물 트랜지스터

  • Park, Sang-Hui;Hwang, Chi-Seon;Jo, Du-Hui;Yu, Min-Gi;Yun, Seong-Min;Jeong, U-Seok;Byeon, Chun-Won;Yang, Sin-Hyeok;Jo, Gyeong-Ik;Gwon, O-Sang;Park, Eun-Suk
    • Proceedings of the Materials Research Society of Korea Conference
    • /
    • 2009.05a
    • /
    • pp.13.1-13.1
    • /
    • 2009
  • Transparent electronics has attracted many interests, for it can open new applications for consumer electronics, transportation, business, and military. Among them, display backplane, thin film transistor (TFT) array would be the most attractive application. Many researchers have been investigating oxide semiconductors for transparent channel material of TFT since the report for transparent amorphous oxide semiconductor (TAOS) TFT by Hosono group and ZnO TFT by Wager group. Especially, oxide TFTs have been intensively investigated during a couple of years since the first demonstration of ZnO-TFT driving AM-OLED. Many papers regarding the fabrication and performance of oxide TFTs, and active matrix display driven by oxide TFTs have been reported. Now lots of people have confidence in the competitiveness of oxide TFTs for the backplane of AM-Display. Especially, high mobility, uniformity, fairly good stability, and low cost process make oxide TFTs applied even to a large size AM-OLED. Last year, Samsung mobile display, former SID, reported 12" AM-OLED driven by IZGO-TFT and it seems that the remained issue for the mass production is the bias temperature stability. Here, we will introduce the application of oxide TFT and important issue for oxide TFT to be used for the direct printing.

  • PDF

A study on Resin Filling Analysis and Experiment by VAP and VaRTM Processes (VaRTM과 VAP 공정의 수지 충진실험 및 해석에 관한 연구)

  • Dong-Hwan Yoon;Kyeong-Ho Seo;Yu-Jung Kwon;Jin-Ho Choi
    • Composites Research
    • /
    • v.36 no.5
    • /
    • pp.310-314
    • /
    • 2023
  • VaRTM(Vacuum assisted resin transfer molding) and VAP(Vacuum assisted process) processes are a type of RTM(Resin transfer molding) process, and are typical out-of-autoclave (OOA) processes that can manufacture large structures at low cost. In this paper, a resin filling test was conducted to compare the VaRTM and VAP processes, and the filling process and dimensional stability were compared. In addition, an analysis method to simulate the filling process was developed, and a dielectric sensor was used to detect the flow front of the resin, which was compared with the analysis results. From the resin filling test, the total filling time of the composite plate was measured to be 48 minutes for the VAP process and 145 minutes for the VaRTM process, and the filling time by the VAP process was reduced by about 67%. In addition, it was confirmed that the VAP process was superior to the VaRTM process in the thickness control ability and uniformity of the composite plate.

Mathematical Model of the Edge Sealing Parameters for Vacuum Glazing Panel Using Multiple Regression Method (다중회귀분석법을 이용한 진공유리패널 모서리 접합부와 공정변수간의 수학적 모델 개발)

  • Kim, Young-Shin;Jeon, Euy-Sik
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.13 no.3
    • /
    • pp.961-966
    • /
    • 2012
  • The concern about vacuum glass is enhanced as society gets greener and becomes more concerned about energy savings due to the rising cost of oil. The glass edge sealing process needs the high reliability among the main process for the vacuum glass development in order to maintain between the two glass by the vacuum. In this paper, the process of the edge sealing was performed by using the hydrogen mixture gas which is the high density heat source unlike the traditional method glass edge sealing by using the frit as the soldering process. The ambient temperature in the electric furnace was set in the edge sealing to prevents the thermal impact and transformation of the glasses and the temperature distribution uniformity was measured. The parameter of the edge sealing was set through the basic test and the mathematical relation with the area of the glass edge parts according to the parameter was drawn using the multiple regression analysis method.

Strategies to Enhance the Linkage between Retailers and Agricultural Product Wholesale Markets (소매업체와 농산물 도매시장의 연계성 강화 방안 - 청과물을 중심으로 -)

  • Kim, Dong-Hwan
    • Journal of Distribution Research
    • /
    • v.15 no.5
    • /
    • pp.273-285
    • /
    • 2010
  • This paper analyzes retailers' purchasing patterns of fruits and vegetables and the problems with purchasing from agricultural product wholesale markets. While large-scale retailers purchase fruits and vegetables from various sources, medium and small-scale retailers and food service companies buy them mostly from agricultural product wholesale markets. The retailers point out the problems with purchasing from agricultural product wholesale markets as a lack of quality uniformity, not sufficient cooling storage facilities, not sufficient space for shipping area, high distribution cost, unnecessary price fluctuation, and etc. In order to enhance the linkage with retailers, agricultural product wholesale markets, first of all, have to adopt more flexible trading methods such as private treaty besides auctions which are exclusively legitimate trading methods in the market. Necessary are enlargement of jobbers' operating scale, securing shipping space for retailers, adoption of inspection service, introduction of methods to stabilize auction prices, saving of loading and unloading costs, implementation of marketing strategies.

  • PDF

A Study on the Development of a Welding Carriage System for Vertical Weld (수직 용접을 위한 용접 캐리지 시스템 개발에 관한 연구)

  • Byun, Hong-Seok
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.17 no.6
    • /
    • pp.246-254
    • /
    • 2016
  • Thick-shell welding for super-sized oil storage tanks is currently done manually, which causes deterioration in quality and a lack of uniformity due to frequent rewelding. The limitations of the external environment must also be considered for manual welding. This paper describes the development of a carriage system for automatic vertical welding to increase reliability, reduce cost, and enhance productivity. The system consists of a welding platform, carriage device, and control unit, which were conceptually designed according to design specifications and manufactured with modular parts. In addition, the structure was analyzed for safety and to predict design problems in advance, and the results are reflected in reviewing the design. To evaluate the performance of the system, a tensile test, bending test, and weld time test were carried out, and the results were satisfactory. The time required for automatic weld was greatly improved by more than 87%, compared to the manual welding time.

Chemical Mechanical Polishing: A Selective Review of R&D Trends in Abrasive Particle Behaviors and Wafer Materials (화학기계적 연마기술 연구개발 동향: 입자 거동과 기판소재를 중심으로)

  • Lee, Hyunseop;Sung, In-Ha
    • Tribology and Lubricants
    • /
    • v.35 no.5
    • /
    • pp.274-285
    • /
    • 2019
  • Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

Formation of Silica Nanowires by Using Silicon Oxide Films: Oxygen Effect (산화 실리콘 막을 이용한 실리카 나노 와이어의 형성 : 산소 효과)

  • Yoon, Jong-Hwan
    • New Physics: Sae Mulli
    • /
    • v.68 no.11
    • /
    • pp.1203-1207
    • /
    • 2018
  • In this study, silica nanowires were formed using silicon oxide films with different oxygen contents, and their microstructure and physical properties were compared with those of silica nanowires formed using Si wafers. The silicon oxide films were fabricated by using a plasma-enhanced chemical vapor deposition method. Silica nanowires were formed by thermally annealing silicon oxide films coated with nickel films as a catalyst. In the case of silicon oxide films having an oxygen content of approximately 50 at.% or less, the formation mechanism, microstructure, and physical properties of the nanowires were not substantially different from those of the silicon wafer. In particular, the uniformity of the thickness showed better behavior in the silicon oxide films. These results imply that silicon oxide films can be used as an alternative for fabricating high-quality silica nanowires at low cost.