• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.95-95
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• 2002

• Journal of the Korean Ceramic Society
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• v.56 no.6
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• pp.526-533
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• 2019

Indialite/cordierite glass-ceramics demonstrate excellent microwave dielectric properties such as a low dielectric constant of 4.7 and an extremely high quality factor Qf of more than 200 × 10³ GHz when crystallized at 1300℃/20 h, which are essential criteria for application to 5G/6G mobile communication systems. The glass-ceramics applied to dielectric resonators, low-temperature co-fired ceramic (LTCC) substrates, and direct casting glass substrates are reviewed in this paper. The glass-ceramics are fabricated by the crystallization of glass with cordierite composition melted at 1550℃. The dielectric resonators are composed of crystallized glass pellets made from glass rods cast in a graphite mold. The LTCC substrates are made from indialite glass-ceramic powder crystallized at a low temperature of 1000℃/1 h, and the direct casting glass-ceramic substrates are composed of crystallized glass plates cast on a graphite plate. All these materials exhibit excellent microwave dielectric properties.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.12 no.6
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• pp.292-298
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• 2002

Densified cordierite matrixes added alumina platelets were studied as a ceramic substrate material having a low thermal expansion coefficient, low dielectric constant and proper strength. Amorphous-type cordierite powders were filled with four kinds of alumina platelet powders in various compositions. All samples were sintered at $1300^{\circ}C$ for 2 h in an air atmosphere. Improved flexural strength of about 80 MPa, low dielectric constant of 5.0 at 1 MHz and low thermal expansion coefficient of $3.5 \times 10^{-6}/^{\circ}C$ were obtained by the control of the microstructure. Isolated micropores were formed in the matrix and the porosity was dependent on the platelet content and size. In the 10 vol% of alumina platelet content, the isolated micropores were 3~8 $\mu \textrm{m}$ in size, and an increase in dielectric constant by adding alumina platelet filler was inhibited by the micropores.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.10
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• pp.101-105
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• 1990

The use of a sol-gel processed cordierite precursor sinterable about$900^{\circ}C$ allows cosintering of the copper and the ceramic. A strong bonding between the copper film and the cordierite substrate can be achieved through an eutectic bonding technique. These interfaces were investigated using STEM. copper diffusion as well as strong chemical and structural modifications was observed in the interface region. Although these interfaces have good adhesion properties, there was no evidence of the formation of the copper compound at the interface.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.709-716
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• 1999

Ceramic is select for an alternative substrate material for high-speed circuits due to its low-thermal expansion. As, in this study, ceramic was prepared by ISG (interlayer sol-gel) process using metal salts and a metal alkoxide as the starting materials. Generally ceramic substrate is used electroless copper plating for the metallization. But it has been indicate weakely the adhesion strength between the substrate and copper layer. Therefore, this research, using the ISG process on the preparation of homogeneous and possible preparation at law temperature fabricated sol solution. Using of the dip coating method was coated for the purpose of giving the anchoring effect on the coating layer and enhancing the adhesion strength between the $Al_2$O$_3$ substrate and copper layer. This study examined primary the characteristic of the sol making condition and differential thermal analysis (DTA) X-ray diffraction (XRD) were mearsured to identify the crystal phase of heat treatment specimens. The morphology of the coated films were studied by scanning electron microscopy(SEM). As a resurt, XRD analysis was obtained patterns of $\alpha$-cordierite after heat-treatment about 2 hours at $1000^{\circ}C$. SEM analysis could have seen a large number of voids on coated film. The more contants of$ Al_2$$O_3$ Wt% was increased the more voids was advanced. Peel adhesion strength has a maximum in the contants of the TEOS:ANE of 1:0.7 mole%. In this case, adhesion strength has been measured 1150gf, peel adhesion strength were about 10 times more than uncoated of the ceramics film.

• Journal of the Korean Ceramic Society
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• v.31 no.4
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• pp.427-435
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• 1994

Cu-metallized low firing temperature substrates were synthesized by cofiring green sheet of cordierite-based glass with Cu. By Sol-Gel method, Cu powder was coated with borosilicate gel which should act as a glass frit in Cu paste during cofiring. Theoretical weight ratios of Glass/Cu were controlled to be 2.5, 5, 10 and 15% by varying alkoxide concentrations. Average particle size of coated Cu was 0.629~0.674 ${\mu}{\textrm}{m}$ in comparison to that of as-received Cu(0.596 ${\mu}{\textrm}{m}$), which increased with alkoxide concentration but did not increase above certain concentration. The weight ratios of coated layer were 2.11~5.37%. The properties of Cu-metallized low firing temperature substrate, cofired at 90$0^{\circ}C$ for 1h under H2/N2 atmosphere, were as follows; sheet resistance was 13~43 m{{{{ OMEGA }}/$\square$, adhesion strength was 1.0~2.1 kgf/$\textrm{mm}^2$. From the observations of SEM photographs, the gel coated on Cu performed excellently as a glass frit.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.3
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• pp.223-233
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• 2011

A ceramic monolithic catalyst is a honeycomb structure that consists of two layers. The honeycomb structure is regarded as a continuum in structure and heat-flow analysis. The equivalent mechanical properties of the honeycomb structure were determined by performing finite element analysis (FEA) for a test specimen. Bending strength experiments and FEA of the test specimen used in ASTM C1674-08 standard test were performed individually. The bonding coefficient between the cordierite ceramic layer and the washcoat layer was almost zero. The FEA test specimen was modeled on the basis of the bonding coefficient. The elastic modulus, Poisson's ratio, and the thermal properties of the ceramic monolithic substrate were determined by performing the FEA of the test specimen.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• v.1
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• pp.379-384
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• 2006

Since the monolithic ceramic substrate was introduced for automotive catalytic converters, the durability of the substrate has been a continuing requirement to reduce the emission gas of vehicle. The substrate can occupy a volume as small as 82 $cm^3$ and as large as 8200 $cm^3$ to provide the required substrate for catalytic activity. The long-term durability varies with the size of the substrate from manufacture's point of view. Therefore This study presents that the response surface model using central composite design can explain size effect on the modulus of rupture in a cordierite ceramic monolithic substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1992.11a
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• pp.97-101
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• 1992

Cordierite glass ceramic has become an electronic substrate material for electronic circuits and the use of whiskers for improving strength and toughness is evident. Green sheets of mixtures containing 15% silicon nitride were sintered to greater than 99 % density. The microstructure was analysed using optical microscopy, scanning electron microscopy (SEM), and X-ray diffraction (XRD). The toughness and hardness were improved with increasing the whisker vol. % and sintering temperature. Especially, it is assumed that toughening increasing at the more high sintering temperature relevants to the glass phase increasing, as showned in the roughness of the fracture surfaces. It was directionally dependent of whisker direction during processing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.185-186
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• 2005

저온소결 Glass/Ceramic계 기판재료 조성으로 $Al_2O_3$, $SiO_2$, Cordierite, $Al_2O_3{\cdot}3SiO_2$의 4가지 filler에 zinc-borosilicate(ZBS) glass를 첨가하여 기판재료로의 사용가능성을 조사하였다. 4가지 filer에 ZBS glass를 30$\sim$50vol%첨가하여 $700\sim950^{\circ}C$에서 2시간 소결한 결과 40, 50vol%첨가 했을 때 900$^{\circ}C$에서 치밀한 소결체를 얻을 수 있었다. LSI칩 신호라인의 빠른 신호전달에 직접적인 영향을 주는 유전율은 기존의 $Al_2O_3$기관($\fallingdotseq$9.7)보다 저유전율 ($900^{\circ}C$에서 $Al_2O_3$-50vol%ZBS 5.7, $SiO_2$-50vol%ZBS 5.9, Cordierite-40vo1%ZBS 5.9, $Al_2O_3${\cdot}3SiO_2$-50vol%ZBS 4.9)을 나타내어 저온소결 기판재료로 사용이 가능함을 확인하였다.