• Journal of information and communication convergence engineering
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• 제8권1호
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• pp.99-102
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• 2010

Large-scaled area and aligned copper oxide nanowires have been synthesized by a vapor-phase approach to the facial synthesis of copper oxide nanowires supported on the surface of a copper gasket. The effects of annealing temperature and time were investigated. Long and aligned nanowires can only formed within a narrow temperature range from 400 to $500^{\circ}C$ for 4 hrs. Annealing copper gasket in static air produces large-area, uniform, but not well vertically aligned nanowires along the copper gasket surface. The surface of copper gasket is converted into bicrystal CuO nanowires was observed after the copper gasket is annealed under static air condition.

• KSTLE International Journal
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• 제2권1호
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• pp.22-28
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• 2001

A resin bonded copper-graphite brush was investigated to evaluate the characteristics electrical signal transmission through a sliding contact as a function of the relative amount of graphite and copper in the brush. Particular attention was given to the correlation between electrical signal fluctuation and tribological properties in an electrical sliding contact system. A ring-on-block type tribotester was used for this experiment and the ring was made from pure copper. Results showed that a copper-graphite brush at a particular composition range exhibited the most stable frictional behavior with a minimum voltage drop. The amount of voltage drop at the friction interface was affected by the surface roughness, transfer film formation at the friction interface, and the real area of contact. Microscopic observations and the surface analysis showed a good agreement with the results from this experiment. The results also indicated that the electrical signal flunctuation was directly associated with the oscillation of the coefficient of friction during sliding by nanoscale variation of contacts at the friction interface.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.151.1-151.1
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• 2017

This work studied the corrosion behavior of AZ31 Mg alloy galvanically coupled with Cu during immersion in 0.1 and 0.5 M NaCl solutions by in-situ observation and galvanic corrosion current measurement using a zero resistance ammeter. The corrosion behavior of AZ31 Mg alloy was also studied by salt spray test. The average galvanic corrosion density during 2 h immersion in 0.1 NaCl solution was found to decrease as an exponential function with increasing the surface area ratios between AZ31:Cu or with increasing the distance between AZ31 and Cu. The corrosion of electrodeposited Cu on AZ31 Mg alloy was concentrated at the area next to Cu (about 5 mm for immersion test and 2 mm for salt spray test) and pitting corrosion was accelerated at the area beyond the severely corroded area by the galvanic coupling effect.

• Korean Chemical Engineering Research
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• 제46권5호
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• pp.863-867
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• 2008

피치계 활성탄소섬유가 납사분해 잔사유를 개질하여 용융 방사하고, 산화, 탄화 및 스팀으로 활성화하여 제조되었다. 활성탄소섬유의 표면은 주석-팔라듐을 사용하여 단일 스텝에 의해 예민화 과정을 거쳤다. 예민화된 활성탄소섬유 표면에 무전해도금법을 사용하여 구리를 골고루 담지하였다. 도금시간을 증가시켜서 구리의 담지량을 변화시키고, BET, SEM, XRD 및 ICP를 이용하여 촉매 특성 변화에 미치는 영향을 관찰하였다. 도금시간에 따라 부가된 구리의 양은 증가하나, 기공부피와 비표면적은 감소하였다. 또한 반응 온도가 증가함에 따라 NO 제거 성능이 증가하였다. $300^{\circ}C$ 이상의 반응 온도에서 부가된 구리의 양이 증가하면 표면적의 감소와 구리 분산도의 감소 때문에 NO 제거 성능은 감소하는 결과를 얻었다.

• 한국안전학회지
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• 제14권1호
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• pp.86-92
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• 1999

This study was carried out to investigate the effect of chemical cleaning of corrosion product on cooling system made of copper as a basic material and using cooling water as pure water. We studied chemical cleaning condition that minimizes the influence on basic material by means of EDTA solution so as to eliminate the slurry in cooling system. In addition, the proper amount of NALCO-39L (Nitrite-Borate-BZT mixture) as a inhibitor was determined in order to protect the copper in cooling system against corrosion after chemical cleaning and the effect of corrosion resistance on the copper surface treated was excelent in comparison with surface untreated. As a result, we found that the main components of sludge in cooling system produced by corrosion of copper were $Cu_2O$, CuO, Cu, and Fe. The optimum condition of chemical cleaning was 400ppm EDTA solution at $60^{\circ}C$. Inhibitor concentration needed to treat the surface of pure copper was 15～20ppm per unit area and corrosion rate of copper treated with 500ppm inhibitor solution for 72 hrs at $60^{\circ}C$ was remarkably decreased as compared with that of pure copper.

• 마이크로전자및패키징학회지
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• 제26권3호
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• pp.51-57
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• 2019

구리 표면을 대기 중의 산화로부터 보호하기 위해서 아르곤(Ar)과 질소($N_2$) 가스를 이용하는 two-step플라즈마 공정으로 산화 방지층인 구리 질화물 패시베이션 형성을 연구하였다. Ar 플라즈마는 구리 표면에 존재하는 이물질을 제거하는 동시에 표면을 활성화시켜 다음 단계에서 진행되는 $N_2$ 플라즈마 공정 시 질소 원자와 구리의 반응을 촉진시키는 역할을 수행한다. 본 연구에서는 two-step 플라즈마 공정 중 Ar 플라즈마 공정 조건이 구리 질화물 패시베이션 형성에 미치는 영향을 실험계획법의 완전요인설계를 통하여 분석하였다. XPS 분석에 의하면 Ar 플라즈마 공정 시 낮은 RF 파워와 압력을 사용할 경우 구리 산화물 피크(peak) 면적은 감소하고, 반대로 구리 질화물(Cu4N, Cu3N) 피크 면적은 증가하였다. Ar 플라즈마 공정 시 구리 질화물 형성의 주 효과는 RF 파워로 나타났으며 플라즈마 공정 변수간 교호작용은 거의 없었다.

• 한국표면공학회지
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• 제49권5호
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• pp.416-422
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• 2016

We have investigated the effects of applied potential, deposition time and electrolyte types on shapes and physical properties of Cu dendrites by potentiostatic electrodeposition. Finer shape of dendrites was observed at less cathodic potential by 100mV than at the limiting current, due to 'effective overpotential'. The shape of copper dendrite is related to the deposition time, too. The dendrite depositing for 10 min showed the finest shape. The finer dendrite has the less apparent density and the larger specific surface area. Dendrite from chloride solution has the lowest density and the largest surface area among three plating solutions, sulfate, chloride and pyrophosphate.

• 한국생산제조학회지
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• 제19권5호
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• pp.616-621
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• 2010

New type of the base material of the light-emitting diode requires copper wafer in view of heat and electrical conductance. Therefore, polishing process of the substrate level is needed to get a nanometer level of surface roughness as compared with pattern structure of nano-size in the semiconductor industry. In this paper, a series of lapping and polishing technique is shown for the rough and deflected copper substrate of thickness 3mm. Lapping by sand papers tried air cooling method. And two steps of polishing used the diamond abrasives and the $Al_2O_3$ slurry of size 100mm considering the residual scratch. White-light interferometer proved successfully a mirror-like surface roughness of Ra 6nm on the area of $0.56mm{\times}0.42mm$.

• 대한전기학회논문지:전력기술부문A
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• 제55권8호
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• pp.334-340
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• 2006

Copper is widely used in electric wire, cable, conductor in electric devices. As the demand for electric power is increasing rapidly, electric power devices are getting amazingly bigger and complicated. The using of light-weight conductor can reduce the size and making cost of the electric devices. In high-frequency application, Electric current in a conductor tends to shift to the surface of the conductor, resulting in an uneven current distribution in the inner conductor. In the extreme case the current may essentially concentrate in the 'skin' of the inner conductor as a surface current. In high frequency application, therefore, inner area of copper conductor may replace with aluminum conductor, which reduces the weight of conductor. This paper describes the manufacture and evaluation of composite conductors made of copper and aluminum. The optimum extruding ratio was 16 at $300^{\circ}C$. The electrical resistance of manufactured composite bus bar was $57{\mu}{\Omega}$ at DC and $49.5{\mu}\{Omega}$ at 300Hz.

• 한국전기전자재료학회논문지
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• 제25권7호
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• pp.496-499
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• 2012

Modified structure of copper pillar bump which has trapezoidal cross section on the top region is suggested with simulation results and concept of fabrication process. Due to the large surface area of joint region between bump and solder in suggested structure, electro-migration effect can be reduced. Reduction of electro-migration is related with current density and joule heating in bump and investigated with finite element methods with variation of dimensional parameters. Mechanical characteristics are also investigated with comparing modified copper pillar bump and conventional copper pillar bump.