• Carbon letters
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• v.21
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• pp.68-73
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• 2017

We have demonstrated the production of thin films containing multilayer graphene-coated copper nanoparticles (MGCNs) by a commercial electrodeposition method. The MGCNs were produced by electrical wire explosion, an easily applied technique for creating hybrid metal nanoparticles. The nanoparticles had average diameters of 10-120 nm and quasi-spherical morphologies. We made a complex-electrodeposited copper thin film (CETF) with a thickness of $4.8{\mu}m$ by adding 300 ppm MGCNs to the electrolyte solution and performing electrodeposition. We measured the electric properties and performed corrosion testing of the CETF. Raman spectroscopy was used to measure the bonding characteristics and estimate the number of layers in the graphene films. The resistivity of the bare-electrodeposited copper thin film (BETF) was $2.092{\times}10^{-6}{\Omega}{\cdot}cm$, and the resistivity of the CETF after the addition of 300 ppm MGCNs was decreased by 2% to ${\sim}2.049{\times}10^{-6}{\Omega}{\cdot}cm$. The corrosion resistance of the BETF was $9.306{\Omega}$, while that of the CETF was increased to 20.04 Ω. Therefore, the CETF with MGCNs can be used in interconnection circuits for printed circuit boards or semiconductor devices on the basis of its low resistivity and high corrosion resistance.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.155.2-155.2
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• 2007

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.206.1-206.1
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• 2014

최근 전자 장비의 금속 전도성 패턴 제작에 있어서 직접적인 프린트가 가능한 프린팅 기술이 기존의 복잡한 photolithography 를 대체할 기술로 주목 받고 있다. 이와 함께 금속 전도성 패턴 제작에 사용되는 고가의 전도성 물질인 Ag ink 및 paste 를 저가의 Cu ink 및 paste 로 대체하기 위한 연구가 진행되고 있다. 하지만 일반적으로 copper 는 대기 중 에서 쉽게 산화되어 높은 저항을 야기시킨다. 따라서 Cu ink 또는 paste 를 제작할 때 copper nanoparticles 을 유기 용매에 분산하여 inert atmosphere에서 합성하거나 [1] copper ink 또는 paste 를 substrate 에 프린트하여 reduction atmosphere 에서 소성시킨다 [2]. 이번 연구에서 Cu paste 를 유리 기판에 screen printing 하여 혼합가스(질소 95%, 수소 5%)와 질소 가스 분위기에서 소성하여 Cu 전극의 소성 거동과 전기적 특성을 분석하였다. 4-point probe를 통해 소성된 Cu 전극의 저항을 측정하여 전도도를 조사하였으며 Thermal Gravimetric Analysis (TGA), Fourier Transform Infrared(FTIR)를 통해 소성된 Cu 전극의 유기물 분해가 전도도에 미치는 영향을 분석하고 Field Emission Scanning Electron Microscopy (FESEM)과 High Resolution Transmission Electron Microscopy (HRTEM)을 통해 Cu nanoparticles 의 grain growth가 전도도에 미치는 영향을 조사하였다.

• Bulletin of the Korean Chemical Society
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• v.33 no.2
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• pp.625-628
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• 2012

We investigated the interaction between polyynes (linear carbon chains) and various metal nanoparticles (Ag, Au, and Cu) to provide insight into the optical properties of metal-polyynes systems prepared by different experimental techniques. Polyynes were produced by laser ablation in deionized water, metal nanoparticles solutions, and copper chloride solution. Metal nanoparticles complexes with polyynes were analyzed by Raman, surface-enhanced Raman scattering, and UV-vis spectroscopy.

• Korean Journal of Materials Research
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• v.29 no.1
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• pp.37-42
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• 2019

This study investigates Ag coated $Cu_2O$ nanoparticles that are produced with a changing molar ratio of Ag and $Cu_2O$. The results of XRD analysis reveal that each nanoparticle has a diffraction pattern peculiar to Ag and $Cu_2O$ determination, and SEM image analysis confirms that Ag is partially coated on the surface of $Cu_2O$ nanoparticles. The conductive paste with Ag coated $Cu_2O$ nanoparticles approaches the specific resistance of $6.4{\Omega}{\cdot}cm$ for silver paste(SP) as $(Ag)/(Cu_2O)$ the molar ratio increases. The paste(containing 70 % content and average a 100 nm particle size for the silver nanoparticles) for commercial use for mounting with a fine line width of $100{\mu}m$ or less has a surface resistance of 5 to $20{\mu}{\Omega}{\cdot}cm$, while in this research an Ag coated $Cu_2O$ paste has a larger surface resistance, which is disadvantageous. Its performance deteriorates as a material required for application of a fine line width electrode for a touch panel. A touch panel module that utilizes a nano imprinting technique of $10{\mu}m$ or less is expected to be used as an electrode material for electric and electronic parts where large precision(mounting with fine line width) is not required.

• Bulletin of the Korean Chemical Society
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• v.33 no.8
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• pp.2679-2682
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• 2012

A simple one-pot synthesis of two derivatives of 1,4-dihydropyridines has been described under reflux conditions using copper iodide nanoparticles (CuI NPs) as a catalyst in high yields. This method demonstrated four-component coupling reactions of aldehydes and ammonium acetate via two pathways. In one route, the reaction was performed using 2 eq ethyl acetoacetate while in the other one 1 eq ethyl acetoacetate and 1 eq malononitrile were used. The CuI NPs was reused and recycled without any loss of activity and product yield. It is noteworthy to state that wide range of the 1,4-dihydropyridines have attracted large interest due to pharmacological and biological activities.

• Journal of Powder Materials
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• v.17 no.4
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• pp.270-275
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• 2010

Ethylene glycol-based Cu nanofluids were prepared by pulsed wire evaporation (PWE) method. The structural properties of Cu nanoparticles were studied by X-ray diffraction (XRD) and high resolution transmission electron microscopy (HRTEM). The average diameter and Brunauer Emmett Teller (BET) surface area of Cu nanoparticles were about 100 nm and $7.46\;m^2/g$, respectively. The thermal conductivity and viscosity of copper nanofluid were measured as functions of Cu concentration and temperature. As the volume fraction of Cu nanoparticles increased, both the enhanced ratios of thermal conductivity and viscosity of Cu nanofluids increased. As the temperature increased, the enhanced ratio of thermal conductivity increased, but that ratio of viscosity decreased.

• Journal of Powder Materials
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• v.27 no.6
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• pp.449-457
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• 2020

Iron and copper are practically immiscible in the equilibrium state, even though their atomic radii are similar. As non-equilibrium solid solutions, the metastable Fe-Cu alloys can be synthesized using special methods, such as rapid quenching, vapor deposition, sputtering, ion-beam mixing, and mechanical alloying. The complexity of these methods (multiple steps, low productivity, high cost, and non-eco-friendliness) is a hinderance for their industrial applications. Electrical explosion of wire (EEW) is a well-known and effective method for the synthesis of metallic and alloy nanoparticles, and fabrication using the EEW is a simple and economic process. Therefore, it can be potentially employed to circumvent this problem. In this work, we propose the synthesis of Fe-Cu nanoparticles using EEW in a suitable solution. The powder shape, size distribution, and alloying state are analyzed and discussed according to the conditions of the EEW.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.58.1-58.1
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• 2012

Direct write technologies provide flexible and economic means to manufacture low-cost large-area electronics. In this regard inkjet printing has frequently been used for the fabrication of electronic devices. Full advantage of this method, which is capable of reliable direct patterning with line and space dimensions in the 10 to 100 um regime, is only made with all-solution based processing. Among these printable electronic materials, silver and copper nanoparticles have been used as interconnecting materials. Specially, solutions of organic-encapsulated silver and copper nanoparticles may be printed and subsequently annealed to form low-resistance conductor patterns. In this talk, we describe novel processes for forming silver nanoplates and copper ion complex which have unique properties, and discuss the optimization of the printing/annealing processes to demonstrate plastic-compatible low-resistance conductors. By optimizing both the interconnecting materials and the surface treatments of substrate, it is possible to produce particles that anneal at low-temperatures (< $200^{\circ}C$) to form continuous films having low resistivity and appropriate work function for formation of rectifying contacts.

• Structural Engineering and Mechanics
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• v.85 no.6
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• pp.743-753
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• 2023

Piezoelectricity is defined as the ability of certain materials to produce electric signals when mechanically stressed or to deform when an electrical potential is applied. Piezo technology is becoming increasingly crucial as intelligent devices use vibration sensors to detect vibrations in consumer electronics, the automotive industry, architectural design, and other applications. A wide range of applications is now possible with piezoelectric sensors, such as skin-attachable devices that monitor health and detect diseases. In this article, copper nanoparticles are used in the piezoelectric sensor as the driving agent of the magnetic field. Magnetic nanocatalysts containing copper nanoparticles are used due to their cheapness and availability. Considering that the increase of the electric field acting on the piezoelectric increases the damping (As a result, damping materials reduce radiation noise and increase material transfer losses by altering the natural vibration frequency of the vibrating surface). Among the advantages of this method are depreciating a significant amount of input energy using high energy absorption capacity and controlling slight vibrations in the sensors.