• 한국전기화학회:학술대회논문집
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• 한국전기화학회 2005년도 수소연료전지공동심포지움 2005논문집
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• pp.383-390
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• 2005

Effect of applying a DC voltage on the interfacial reaction at the metal to zirconia interface was investigated utilizing an oxygen ionic conductivity of partially stabilized zirconia. The joining of copper rod and zirconia tube was carried out in Ar gas atmosphere at $1000^{\circ}C$. There are two type of the joining. The one is the reaction bond consisting of copper and zirconia was dominated by surface reaction with a undetectable very thin layer. It was found that copper elements were diffused to zirconia side, but that Zr ions were not diffused to copper side. These results mean application of a DC voltage to migrate oxygen to the copper-zirconia interface can oxidize metal at the copper-zirconia interface and the bonding reaction between zirconia and copper oxide may occur. The other is the reaction bonding was dominated by interdiffusion with a very thick interface layer. This result mean application of a DC voltage can reduce zirconia at the interface. The bonding reaction is to be an alloying between Zr and Cu.

• 한국분말재료학회지
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• 제12권6호
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• pp.413-421
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• 2005

Copper is able to work as a current collector under wide range of hydrocarbon fuels without coking in Solid oxide fuel cells (SOFCs). The application of copper in SOFC is limited due to its low melting point, which result in coarsening the copper particle. This work focuses on the sintering of copper powder with ceria coating layer. Ceria-coated powder was prepared by thermal decomposition of urea in $Ce(NO_3)_3\cdot6H_2O$ solution, which containing CuO core particles. The ceria-coated powder was characterized by XRD, ICP, and SEM. The thermal stability of the ceria-coated copper in fuel atmosphere $(H_2)$ was observed by SEM. It was found that the ceria coating layer could effectively hinder the grain growth of the copper particles.

• 방사성폐기물학회지
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• 제22권2호
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• pp.105-115
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• 2024

In this study, we employed a small-scale experiment to demonstrate the introduction of a thin copper heat dissipation plate into a bentonite buffer layer of an engineered barrier system. This experiment designed for spent nuclear fuel disposal can effectively reduce the maximum temperature of the bentonite buffer layer, and ultimately, make it possible to reduce the area of the disposal site. For the experiment, a small-scale engineered barrier system with a copper heat dissipation plate was designed and manufactured. the thickness of the cylindrical buffer was about 2 cm, which was about 1/20 of KAERI Repository System (KRS). At a power supply of 250 W, the maximum buffer temperature reduced to a mere 1.8℃ when the thin copper plate was introduced. However, the maximum surface temperature reduced to a remarkable 9.1℃, when a U-collar copper plate was introduced, which had a good contact with the other barrier layers. Consequently, we conclude that the introduction of the thin copper plate into the engineered barrier system for spent nuclear fuel disposal can effectively reduce the maximum buffer temperature in high-level radioactive waste disposal repositories.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.927-930
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• 2001

We studied the electrical properties of Copper(II)-phthalocyanine (Cu-Pc) as a hole transport layer in organic light emitting devices (OLEDs). OLEDs were constructed with ITO/CU-Pc/triphenyl-diamine (TPD)/tris-(8-hydroxyquinoline) aluminum ( Alq$_3$) + 4- (Dicyanomethylene)-2-methyl-6-(4-dimethylaminostyryl)-4H-pyran (DCM)/Al. It was consisted of a thin DCM in Alq$_3$emission layer. We observed that the change of recombination zone was moved toward the cathode as the hole mobility increased due to the heat-treatment temperature of Cu-Pc layer increased.

• 한국생산제조학회지
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• 제24권1호
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• pp.75-80
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• 2015

This paper proposes a selective electrodeposition process that uses laser masking and a DC voltage. Selective electrodeposition using laser masking and a DC voltage is more efficient than that using laser masking and a pulse voltage. In other words, electrodeposition with a DC voltage allows for precise selective deposition without the limitation of the deposition region. Also, a selective electrodeposition method that uses laser masking and DC voltage can reduce the electrodeposition time. The characteristics of a copper layer deposited by laser masking and DC voltage were examined under various conditions. A selective copper layer with various micro patterns of $2{\mu}m$ thickness was successfully fabricated.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.396-397
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• 2006

The novel urine-activated microbatteries have been successfully demonstrated. In this microbattery, a magnesium (Mg) layer and copper chloride (CuCl) in the filter paper are used as the anode and the cathode, respectively. A stack consisting of a Mg layer, CuCl-doped filter paper and a copper (Cu) layer sandwiched between two plastic layers is hot-pressed into the microbatteries at $100^{\circ}C$. The microbatteries can be activated by adding a droplet of human urine. The experimental results show that the microbattery can deliver a maximum voltage of 1.4 V and maximum power of 1.96 mW for the $1\;k{\Omega}$ load resistor.

• 마이크로전자및패키징학회지
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• 제11권4호
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• pp.75-80
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• 2004

In copper metallization, resistivity of copper seed layer is very important. Conventionally MOCVD has been used for this purpose however electroless copper plating is simple process and the resistivity of copper deposit is less than that of copper prepared by MOCVD. In this study electroless copper plating was conducted on different substrate to find optimum conditions of electroless copper plating for electronic applications. To find optimum conditions, the effects and selectivity of activation method on several substrates were investigated. The effects of copper bath composition on morphology were investigated. The effects of pH and stabilizer on deposition rate were also investigated. The optimum pH of the bath was 12 with addition of stabilizer. The resistivity of copper was decreased with addition of stabilizer and alter heat treatment.

• Journal of Microbiology and Biotechnology
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• 제21권2호
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• pp.147-153
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• 2011

Bacillus species have been involved in metal association as biosorbents, but there is not a clear understanding of this chelating property. In order to evaluate this metal chelating capacity, cultures and spores from Grampositive bacteria of species either able or unable to produce surface layer proteins (S-layers) were analyzed for their capacity of copper biosorption. Only those endowed of S-layers, like Bacillus sphaericus and B. thuringiensis, showed a significant biosorption capacity. This capacity (nearly 50%) was retained after heating of cultures, thus supporting that structural elements of the envelopes are responsible for such activity. Purified S-layers from two Bacillus sphaericus strains had the ability to biosorb copper. Copper biosorption parameters were determined for strain B. sphaericus 2362, and after analyses by means of the Langmuir model, the affinity and capacity were shown to be comparable to other bacterial biosorbents. A competitive effect of $Ca^{2+}$ and $Zn^{2+}$, but not of $Cd^{2+}$, was also observed, thus indicating that other cations may be biosorbed by this protein. Spores that have been shown to be proficient for copper biosorption were further analyzed for the presence of S-layer content. The retention of S-layers by these spores was clearly observed, and after extensive treatment to eliminate the S-layers, the biosorption capacity of these spores was significantly reduced. For the first time, a direct correlation between S-layer protein content and metal biosorption capacity is shown. This capacity is linked to the retention of S-layer proteins attached to Bacillus spores and cells.

• 폴리머
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• 제35권4호
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• pp.302-307
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• 2011

실란 커플링제의 가수분해를 통한 실란올의 형성과 올리고머 구조형성을 하는 중합반응은 2-FCCL의 표면처리 과정에서 계면 사이의 접착력에 영향을 준다. 본 연구에서는 설란 커플링제의 가수분해반응 속도를 비교하고 표면처리 후 동박의 표면 에너지로 인한 접착특정의 변화를 확인하였다. 특히 이성분계 살란 커플링제는 가수분해 반응속도 조절이 기능하며, 동박과 폴리이미드 사이에서 접착 프로모터로서 확실한 접착력 향상을 보였다. 압연동박 표면에 처리한 이성분계 실란 커플링제의 함량 변화에 띠라 접착력의 향상 정도가 다르게 나타났으며 반응속도 조절과 표면 에너지 평가를 통한 접착 특성을 분석해 접착력을 최대화시켰다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.275.1-275.1
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• 2014

The effects of the interfacial buffer layer and temperature on the organic bulk heterojunction (BHJ) nanostructures of copper phthalocyanine (CuPc) and fullerene (C60) systems were investigated using real time in-situ x-ray scattering. In the CuPc:C60 BHJ structures, standing-on configured ${\gamma}$-CuPc phase was formed by co-deposition of CuPc and C60. Once formed ${\gamma}$-phase was thermally stable during the annealing upon $180^{\circ}C$. Meanwhile, the insertion of CuI buffer layer prior to deposition of the CuPc:C60 BHJ layer induced lying-down configured CuPc crystals in the BHJ layer. The lying CuPc peak intensity and the lattice parameter were increased by the thermal annealing. This increment of the intensity seemed to be related to the strain at the interface between CuPc:C60 and CuI, which was proportional to the enhancement of the power conversion efficiency of the device.