• Nuclear Engineering and Technology
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• v.41 no.5
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• pp.709-714
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• 2009

An ion implanter, which can serve as a metal-ion supply, has been constructed and performance tested. Copper ions are generated and extracted from a Bernas ion source with a heating crucible that provides feed gases to sustain the plasma. Sable arc plasmas can be sustained in the ion source for a crucible temperature in excess of $350^{\circ}C$. Stable extraction of the ions is possible for arc Currents less than 0.3 A. Arc currents increase with the induced power of a block cathode and the transverse field in the ion source. $Cu^+$ ions in the extracted beam are separated using a dipole magnet. A $20{\mu}A$ $Cu^+$ ion current can be extracted with a 0.2 A arc current. The ion current can support a dose of $10^{16}ions/cm^2$ over an area of $15\;cm^2$ within a few hours.

• Carbon letters
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• v.11 no.2
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• pp.117-121
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• 2010

The composites of alginate, carbon nanotube, and iron(III) oxide were prepared for the removal of heavy metal in aqueous pollutant. Both alginate and carbon nanotube were used as an adsorbent material and iron oxide was introduced for the easy recovery after removal of heavy metal to eliminate the secondary pollution. The morphology of composites was investigated by FE-SEM showing the carbon nanotubes coated with alginate and the iron oxide dispersed in the alginate matrix. The ferromagnetic properties of composites were shown by including iron(III) oxide additive. The copper ion removal was investigated with ICP AES. The copper ion removal efficiency increased greatly over 60% by using alginate-carbon nanotube composites.

• Archives of Pharmacal Research
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• v.18 no.1
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• pp.56-59
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• 1995

The effect of ceruloplasmin or copper ion on hepatic xanthine oxidase activity and type conversion was investigated using rat liver in vitro. It was observed that ceruloplasmin increased xanthine oxidase type conversion depending on duration of its storage. Xanthine oxidase (type O) activity and type conversion in incubation mixture was increased by the addition of heated celuroplasmin in a temperature dependent manner. The type conversioin of xanthine oxidase induced by heated ceruloplasmin was retumed to normal by the tratment with DTT or penicillamine. The effect of copper ion on type conversion of xanthine oxidase was similar to that of heated ceruloplasmin.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.410-415
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• 1999

The adhesion strength of sputtered copper films to Inconel substrates has been studied using the scratch test. The effects of substrate treatments before deposition such as chemical or ion bombardment etching were investigated by means of a mean critical load derived from a Weibull-like statistical analysis. It was found that the mean critical load was very weak unless the amorphous layer produced by mechanical polishing on the substrate surface was eliminated. Chemical etching in a nitric-hydrochloric acid bath was shown to have practically no effect on the enhancement of the adhesion. In contrast, the addition in this bath of nickel and copper sulphates allowed removal of the amorphous layer and an increase in the values of the mean critical load. However, it was observed that excessive chemical etching could cancel out the mean critical load enhancement. The results obtained in the case of ion bombardment etching pretreatments could be far higher than those obtained with chemical etching. Moreover, for a sufficiently long period of ion bombardment etching, the adhesion strength was so high that it was impossible to observe evidence of an adhesion failure.

• Korean Journal of Materials Research
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• v.20 no.2
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• pp.82-89
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• 2010

Benzotriazole (B.T.A) which has been mainly used for the stabilization processing method of excavated copper and bronze artifacts is vaporized within 2~3 years after the usage because it is unstable at the acid conditions and cannot protect the surface of artifacts. In this study, NaOH method which has been used for the steel artifacts was applied as a stabilization process for the method of copper and bronze artifacts to gush chlorine ion out. For the reproduction of excavated samples, copper and bronze plates were dipped in 0.1M HCl for 26 hrs to form CuCl, rusted at $70^{\circ}C$ with RH 75% for the formation of corrosion products, and desalted in 0.1 M NaOH solution. The concentration of chlorine ion was measured by using ionchromatography. During the desalting process, a large quantity of chlorine ions was gushed out in early period and corrosion products were not additionally generated through the re-corrosion experiment. This NaOH desalting process was found to be a method of stabilization process for copper and bronze artifacts from the formation of Tenorite (CuO) during desalting as a protection layer for corrosion.

• Resources Recycling
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• v.6 no.3
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• pp.9-14
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• 1997

A study has been made of the rccovery of copper (11) by solvent extraction with Alamine336 (Tri-n-oclylamine) as a extractant from hydrochloric etching solutions. The effect of extractant concentrations, hydrochloric acid, chloride Ion concentrations and phase ratio (organiclaqueaus) on copper extraction were studied. Experimental results showed that the concenl~atiano f extractant and the phase ratio strongly influenced the copper extraction, and the extraction percent of capper Increased at higher hydrochloric acid and chloride ion mncmhation. We proposed that the optimum extrachon stages of copper for continuous extraction process by analysidng thc McCabe-Thielc diagram. Stripping of copper from the loaded organic phases wn be accomplished by pure water (H, O) as a dripping reagent effectively. As the tcmpcrature is increased, thc stripping of copper is enhanced.

• Korean Journal of Materials Research
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• v.17 no.10
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• pp.509-515
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• 2007

In order to fabricate adhesiveless 2-layer flexible copper clad laminate (FCCL) used for COF (chip on film) with high peel strength, polyimide (PI; Kapton-EN, $38\;{\mu}m$) surface was modified by reactive $O_2^+$ and $N_2O^+$ ion beam irradiation. 300 mm-long linear electron-Hall drift ion source was used for ion irradiation with ion current density (J) higher than $0.5\;mA/cm^2$ and energy lower than 200 eV. By vacuum web coating process, PI surface was modified by linear ion source and then 10-20 nm thick Ni-Cr and 200 nm thick Cu film were in-situ sputtered as a tie layer and seed layer, respectively. Above this sputtered layer, another $8-9{\mu}m$ thick Cu layer was grown by electroplating and subsequently acid and base resistance and thermal stability were tested for examining the change of peel strength. Peel strength for the FCCLs treated by both $O_2^+$ and $N_2O^+$ ion irradiation showed similar magnitudes and increased as the thickness of tie layer increased. FCCL with Cu (200 nm)/Ni-Cr (20 nm)/PI structure irradiated with $N_2O^+$ at $1{\times}10^{16}/cm^2$ ion fluence was proved to have a strong peel strength of 0.73 kgf/cm for as-received and 0.34 kgf/cm after thermal test.

• Journal of the Korean Electrochemical Society
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• v.7 no.4
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• pp.173-178
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• 2004

Silicon thin film were synthesized from silane and argon gas mixture directly on copper foil by rf PECVD and then lithium ion batteries were prepared from them employed as the negative electrodes without any further treatment. In the present study, two different kinds of silicon thin films, amorphous silicon and copper silicide were prepared by changing deposition temperature. Amorphous silicon film was prepared below $200^{\circ}C$, but copper silicide film with granular shape was formed by the reaction between silicon radical and diffused copper ions under elevating temperature above $400^{\circ}C$. The amorphous silicon film gives higher capacity than copper silicide, but the capacity decreases sharply with charge-discharge cycling. This is possibly due to severe volume changes. The cyclability is improved, however, by employing the copper silicide as a negative electrode. The copper silicide plays an important role as an active material of the electrode, which mitigates volume change cause by the existence of silicon and copper chemical bonding and provides low electrical resistance as well.

• Corrosion Science and Technology
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• v.20 no.5
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• pp.249-255
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• 2021

In this work, we proposed a facile method to fabricate the three-dimensional porous copper current collector (3D Cu CC) for a Si-dominant anode in a Li-ion battery (LiB). The 3D Cu CC was prepared by combining chemical etching and thermal reduction from a planar copper foil. It had a porous layer employing micro-sized Cu balls with a large surface area. In particular, it had strengthened attachment of Si-dominant active material on the CC compared to a planar 2D copper foil. Moreover, the increased contact area between a Si-dominant active material and the 3D Cu could minimize contact loss of active materials from a CC. As a result of a battery test, Si-dominant active materials on 3D Cu showed higher cyclic performance and rate-capability than those on a conventional planar copper foil. Specifically, the Si electrode employing 3D Cu exhibited an areal capacity of 0.9 mAh cm^-2 at the 300^th cycles (@ 1.0 mA cm^-2), which was 5.6 times higher than that on the 2D copper foil (0.16 mAh cm^-2).

• Journal of the Korean institute of surface engineering
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• v.29 no.2
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• pp.140-145
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• 1996

Silver deposits formed on copper substrates by replacement reactions show poor adhesion, and a silver film plated on such a deposit does not adhere. Silver ion makes a highly stable complex with cyanide ion, so that in a silver cyanide solution, the activity of silver ion is very small. This is one of the reasons for the universal use of cyanide baths in the industrial silver plating. However, the consideration of the difference between the values of the stability constants for bath the silver-iodide complex and the copper-iodide complex suggest that the rate of replacement deposition of silver on the copper substrate in si]ver-potassium iodide solution, could be comparatively low. To confirm this, the rate of replacement deposition of silver in both a silver-potassium iodide solution ($AgNO_3$0.10 mol/L, KI 2.00 mol/L ) and a strike silver plating bath (AgCN 0.028 mol/L, KCN 1.15 mol/L ) was estimated from the current density corresponding to the point of intersection of the anodic and the cathodic polarization curves. These estimated values were almost the same, and it is suggested that the silver-potassium iodide solution is not only a cyanide free silver plating bath capable of employing a copper substrate but a silver plating bath which requires no strike plating.