• Nuclear Engineering and Technology
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• 제41권5호
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• pp.709-714
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• 2009

An ion implanter, which can serve as a metal-ion supply, has been constructed and performance tested. Copper ions are generated and extracted from a Bernas ion source with a heating crucible that provides feed gases to sustain the plasma. Sable arc plasmas can be sustained in the ion source for a crucible temperature in excess of $350^{\circ}C$. Stable extraction of the ions is possible for arc Currents less than 0.3 A. Arc currents increase with the induced power of a block cathode and the transverse field in the ion source. $Cu^+$ ions in the extracted beam are separated using a dipole magnet. A $20{\mu}A$ $Cu^+$ ion current can be extracted with a 0.2 A arc current. The ion current can support a dose of $10^{16}ions/cm^2$ over an area of $15\;cm^2$ within a few hours.

• Carbon letters
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• 제11권2호
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• pp.117-121
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• 2010

The composites of alginate, carbon nanotube, and iron(III) oxide were prepared for the removal of heavy metal in aqueous pollutant. Both alginate and carbon nanotube were used as an adsorbent material and iron oxide was introduced for the easy recovery after removal of heavy metal to eliminate the secondary pollution. The morphology of composites was investigated by FE-SEM showing the carbon nanotubes coated with alginate and the iron oxide dispersed in the alginate matrix. The ferromagnetic properties of composites were shown by including iron(III) oxide additive. The copper ion removal was investigated with ICP AES. The copper ion removal efficiency increased greatly over 60% by using alginate-carbon nanotube composites.

• Archives of Pharmacal Research
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• 제18권1호
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• pp.56-59
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• 1995

The effect of ceruloplasmin or copper ion on hepatic xanthine oxidase activity and type conversion was investigated using rat liver in vitro. It was observed that ceruloplasmin increased xanthine oxidase type conversion depending on duration of its storage. Xanthine oxidase (type O) activity and type conversion in incubation mixture was increased by the addition of heated celuroplasmin in a temperature dependent manner. The type conversioin of xanthine oxidase induced by heated ceruloplasmin was retumed to normal by the tratment with DTT or penicillamine. The effect of copper ion on type conversion of xanthine oxidase was similar to that of heated ceruloplasmin.

• 한국표면공학회지
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• 제32권3호
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• pp.410-415
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• 1999

The adhesion strength of sputtered copper films to Inconel substrates has been studied using the scratch test. The effects of substrate treatments before deposition such as chemical or ion bombardment etching were investigated by means of a mean critical load derived from a Weibull-like statistical analysis. It was found that the mean critical load was very weak unless the amorphous layer produced by mechanical polishing on the substrate surface was eliminated. Chemical etching in a nitric-hydrochloric acid bath was shown to have practically no effect on the enhancement of the adhesion. In contrast, the addition in this bath of nickel and copper sulphates allowed removal of the amorphous layer and an increase in the values of the mean critical load. However, it was observed that excessive chemical etching could cancel out the mean critical load enhancement. The results obtained in the case of ion bombardment etching pretreatments could be far higher than those obtained with chemical etching. Moreover, for a sufficiently long period of ion bombardment etching, the adhesion strength was so high that it was impossible to observe evidence of an adhesion failure.

• 한국재료학회지
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• 제20권2호
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• pp.82-89
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• 2010

Benzotriazole (B.T.A) which has been mainly used for the stabilization processing method of excavated copper and bronze artifacts is vaporized within 2~3 years after the usage because it is unstable at the acid conditions and cannot protect the surface of artifacts. In this study, NaOH method which has been used for the steel artifacts was applied as a stabilization process for the method of copper and bronze artifacts to gush chlorine ion out. For the reproduction of excavated samples, copper and bronze plates were dipped in 0.1M HCl for 26 hrs to form CuCl, rusted at $70^{\circ}C$ with RH 75% for the formation of corrosion products, and desalted in 0.1 M NaOH solution. The concentration of chlorine ion was measured by using ionchromatography. During the desalting process, a large quantity of chlorine ions was gushed out in early period and corrosion products were not additionally generated through the re-corrosion experiment. This NaOH desalting process was found to be a method of stabilization process for copper and bronze artifacts from the formation of Tenorite (CuO) during desalting as a protection layer for corrosion.

• 자원리싸이클링
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• 제6권3호
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• pp.9-14
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• 1997

염산계 에칭폐액으로부터 추출제로 Alamine336(Tri-n-octylamine)을 이용하여 용매추출법에 의해 구리를 회수하기 위한 연구를 행하였다. 주요 실험변수로는 염산농도 및 염소이온농도, 추출제의 농도, 유기상과 수용액상(폐액상)의 상비 등 구리이온의 추출에 영향을 미칠 수 있는 인자들에 대하여 실험을 하엿는데, 이 실험결과 추출제의 농도 및 상비가 구리의 추출에 큰영향을 미침을 알 수 있었고 또한 수용액상의 염산 및 염소이온의 농도가 증가할수록 구리의 추출률이 증가하였다. 한편 McCabe-Thiele diagram으로부터 구리성분의 연속추출공정에 필요한 이론적인 추출단수를 결정하였다. 유기상으로 추출된 구리성분은 탈거제로 물($H_2$O)을 사용함으로써 효율적으로 탈거가 가능하였고 탈거제의 온도가 증가할수록 구리성분의 탈거율은 증가하였다.

• 한국재료학회지
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• 제17권10호
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• pp.509-515
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• 2007

In order to fabricate adhesiveless 2-layer flexible copper clad laminate (FCCL) used for COF (chip on film) with high peel strength, polyimide (PI; Kapton-EN, $38\;{\mu}m$) surface was modified by reactive $O_2^+$ and $N_2O^+$ ion beam irradiation. 300 mm-long linear electron-Hall drift ion source was used for ion irradiation with ion current density (J) higher than $0.5\;mA/cm^2$ and energy lower than 200 eV. By vacuum web coating process, PI surface was modified by linear ion source and then 10-20 nm thick Ni-Cr and 200 nm thick Cu film were in-situ sputtered as a tie layer and seed layer, respectively. Above this sputtered layer, another $8-9{\mu}m$ thick Cu layer was grown by electroplating and subsequently acid and base resistance and thermal stability were tested for examining the change of peel strength. Peel strength for the FCCLs treated by both $O_2^+$ and $N_2O^+$ ion irradiation showed similar magnitudes and increased as the thickness of tie layer increased. FCCL with Cu (200 nm)/Ni-Cr (20 nm)/PI structure irradiated with $N_2O^+$ at $1{\times}10^{16}/cm^2$ ion fluence was proved to have a strong peel strength of 0.73 kgf/cm for as-received and 0.34 kgf/cm after thermal test.

• 전기화학회지
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• 제7권4호
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• pp.173-178
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• 2004

플라즈마 화학 기상 증착법으로 구리 막$(foil,\;35{\mu}m)$표면 위에 $SiH_4$와 Ar혼합가스를 공급하여 실리콘 박막을 증착 한 후 리튬 이온전지의 음극으로 활용하였다. 증착 온도에 따라 비정질 실리콘 박막과 copper silicide박막 형태의 다른 두 종류의 실리콘 박막 구조가 형성되는 것이 관찰되었다. $200^{\circ}C$ 이하의 온도에서는 비정질 실리콘 박막이 증착되었고, $400^{\circ}C$ 이상의 온도에서는 실리콘 라디칼과 확산된 구리 이온의 반응에 의한 그래뉼러 형태의 copper silicide박막이 형성되었다. 비정질 실리콘 박막은 copper silicide박막 보다 높은 용량을 나타냈으나 충·방전 반응에 의한 급격한 용량 손실을 나타냈다. 이것은 비정질 실리콘 박막의 부피 팽창에 의한 것으로 추정된다. 그러나 copper silicide 박막을 음극으로 사용했을 때는 copper silicide를 형성한 실리콘과 구리의 화학결합이 막 구조의 부피변화를 감소 시켜줄 뿐 아니라 낮은 전기 저항을 갖기 때문에 싸이클 특성이 향상되었다.

• Corrosion Science and Technology
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• 제20권5호
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• pp.249-255
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• 2021

In this work, we proposed a facile method to fabricate the three-dimensional porous copper current collector (3D Cu CC) for a Si-dominant anode in a Li-ion battery (LiB). The 3D Cu CC was prepared by combining chemical etching and thermal reduction from a planar copper foil. It had a porous layer employing micro-sized Cu balls with a large surface area. In particular, it had strengthened attachment of Si-dominant active material on the CC compared to a planar 2D copper foil. Moreover, the increased contact area between a Si-dominant active material and the 3D Cu could minimize contact loss of active materials from a CC. As a result of a battery test, Si-dominant active materials on 3D Cu showed higher cyclic performance and rate-capability than those on a conventional planar copper foil. Specifically, the Si electrode employing 3D Cu exhibited an areal capacity of 0.9 mAh cm^-2 at the 300^th cycles (@ 1.0 mA cm^-2), which was 5.6 times higher than that on the 2D copper foil (0.16 mAh cm^-2).

• 한국표면공학회지
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• 제29권2호
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• pp.140-145
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• 1996

Silver deposits formed on copper substrates by replacement reactions show poor adhesion, and a silver film plated on such a deposit does not adhere. Silver ion makes a highly stable complex with cyanide ion, so that in a silver cyanide solution, the activity of silver ion is very small. This is one of the reasons for the universal use of cyanide baths in the industrial silver plating. However, the consideration of the difference between the values of the stability constants for bath the silver-iodide complex and the copper-iodide complex suggest that the rate of replacement deposition of silver on the copper substrate in si]ver-potassium iodide solution, could be comparatively low. To confirm this, the rate of replacement deposition of silver in both a silver-potassium iodide solution ($AgNO_3$0.10 mol/L, KI 2.00 mol/L ) and a strike silver plating bath (AgCN 0.028 mol/L, KCN 1.15 mol/L ) was estimated from the current density corresponding to the point of intersection of the anodic and the cathodic polarization curves. These estimated values were almost the same, and it is suggested that the silver-potassium iodide solution is not only a cyanide free silver plating bath capable of employing a copper substrate but a silver plating bath which requires no strike plating.