• Journal of Adhesion and Interface
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• v.4 no.3
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• pp.1-8
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• 2003

Adhesion between rubber compound and copper-film-coated steel plate (abbreviated hereafter as copper film plate) with different thicknesses of copper film was investigated. Two different methods were employed for the preparation of the copper film plates: a substitution plating of preelectroplated zinc with copper ion and a vacuum sputtering of copper on steel plate. Adhesion strength of the copper film plates with rubber compounds was largely dependent upon the thickness of copper film, regardless of their preparation methods. The copper film plates with thinner thickness than 75 nm showed high adhesion comparable to brass, while those with thicker copper film showed poor adhesion due to excessive growth of copper sulfide at adhesion interface.

• Journal of Animal Science and Technology
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• v.64 no.5
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• pp.885-896
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• 2022

This experiment was conducted to investigate the effects of three different copper (Cu) sources (one inorganic and two organics) and levels (0, 50, and 100 mg/kg) on the growth performance, Cu digestibility, fecal mineral excretion, serum mineral concentration, jejunal morphology, and serum biochemical profile of growing pigs. A total of 42 male, growing pigs (31.08 ± 1.82 kg) were randomly assigned to seven treatments consisting of one negative control (0 mg/kg of added Cu level) and treatments with copper sulfate (CuSO4), Cu-amino acid complex (CuAA), and Cu-hydroxy-4-methylthio butanoate chelate complex (CuHMB) at 50 and 100 mg/kg each for 28 d. Pigs fed 50 or 100 mg/kg of Cu showed improved (p < 0.05) average daily gain and feed intake. Although Cu excretion decreased (p < 0.01) in pigs fed 100 mg/kg of organic Cu sources compared to those fed CuSO4, there was no difference between the Cu sources in pigs fed 50 mg/kg. However, the apparent total tract digestibility of Cu increased (p < 0.01) in pigs fed organic Cu sources compared with that in pigs fed CuSO4. The addition of CuHMB increased (p < 0.01) serum phosphorus and sulfur concentrations; however, there were no effects of source and level on jejunal morphology and serum biochemical profile. These results suggest that the inclusion (50 mg/kg) of organic Cu sources (CuAA and CuHMB) in the growing pig diet could be beneficial for growth performance and Cu availability and may reduce environmental pollution.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.5
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• pp.243-248
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• 2017

In this study copper glaze samples were prepared with varying amount of tin oxide, and the chromatic characteristics of glazes were explained on the results of spectrophotometric, crystalline phase, and microstructural analyses. The red color of copper glaze was dissipated with the addition of tin oxide and turned into achromatic color due to the decrease of CIEab values. Tin oxide homogeneously distributed in the glaze layer interfered with the red color generation coming from the growth of Cu nuclei, and formed an alloy with metal copper around bubbles. This resulted in the decrease of metal copper peak intensity with minor $Cu_2O$ peak. With the 3.79 % tin oxide addition the glaze was appeared as gray due to the black color CuO and Cassiterite $SnO_2$ phases.

• Korean Journal of Microbiology
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• v.53 no.4
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• pp.251-256
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• 2017

Some rhizobacteria were isolated, that have copper resistance and can confer copper resistance to plants allowing growth under copper stress. Isolated strains Pseudomonas veronii MS1 and P. migulae MS2 produced 0.13 and 0.26 mmol/ml of siderophore, that is a metal-chelating agent, and also showed 64.6 and 77.9% of biosorption ability for Cu in 20 mg/L Cu solution, respectively. Copper can catalyze a formation of harmful free radicals, which may cause oxidative stress in organisms. Removal activity of 1,1-diphenyl-2-picryl hydrazyl radical and antioxidant capacity of strains MS1 and MS2 increased up to 82.6 and 78.1%, respectively compared to those of control at 24 h of incubation. They exhibited 7.10 and $6.42{\mu}mol$ ${\alpha}$-ketobutyrate mg/h of 1-aminocyclopropane-1-carboxylic acid deaminase activity, respectively, which reduced levels of stress hormone, ethylene in plants, and also produced indole-3-acetic acid and salicyclic acid that can help plant growth under abiotic stress. All these results indicated that these copper-resistant rhizobacteria could confer copper resistance and growth promotion to plants.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.86-86
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• 2003

Copper has attracted much attention in the deep submicron ULSI metallization process as a replacement for aluminum due to its lower resistivity and higher electromigration resistance. Electroless copper deposition method is appealing because it yields conformal, high quality copper at relatively low cost and a low processing temperature. In this work, it was investigated that effect of the microstructure of the substrate on the electroless deposition. The mechanism of the nucleation and growth of the palladium nuclei during palladium activation was proposed. Electroless copper deposition on TiN barriers using glyoxylic acid as a reducing agent was also investigated to replace toxic formaldehyde. Furthermore, electroless copper deposition on TaN$\sub$x/ barriers was examined at various nitrogen flow rate during TaN$\sub$x/ deposition. Finally, it was investigated that the effect of plasma treatment of as-deposited TaN$\sub$x/ harriers on the electroless copper deposition.

• Corrosion Science and Technology
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• v.6 no.4
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• pp.198-205
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• 2007

The initial stages of electrochemical oxidative CuI film formation on Cu(111), as studied by means of Cyclic Voltammetry (CV), in-situ Scanning Tunneling Microscopy (STM) and ex-situ Synchrotron X-ray Photoemission Spectroscopy (SXPS), indicate a significant acceleration of copper oxidation in the presence of iodide anions in the electrolyte. A surface confined supersaturation with mobile CuI monomers first leads to the formation of a 2D-CuI film via nucleation and growth of a Cu/I-bilayer on-top of a pre-adsorbed iodide monolayer. Structurally, this 2D-CuI film is closely related to the (111) plane of crystalline CuI (zinc blende type). Interestingly, this film causes no significant passivation of the copper surface. In an advanced stage of copper dissolution a transition from the 2D- to a 3D-CuI growth mode can be observed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.245-245
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• 2009

l-D nanostructured materials have much more attention because of their outstanding properties and wide applicability in device fabrication. Copper oxide(CuO) has been realized as a p-type metal oxide semiconductor with narrow band gap of 1.2 -1.5eV. Copper oxide nanostructures can be synthesized by various growth method such as oxidation reaction, thermal evaporation thermal decomposition, sol-gel. and Mostly CuO nanowire prepared on the Cu substrate such as Copper foil, grid, plate. In this study, CuO NWs were grown by thermal oxidation (at various temperatures in air (1 atm)) of Cu metal deposited on CuO (20nm)/$SiO_2$(250nm)/Si. A 20nm-thick CuO layer was used as an adhesion layer between Cu metal and $SiO_2$

• Journal of the Korean Society for Heat Treatment
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• v.21 no.3
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• pp.144-149
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• 2008

It has been reported that copper and copper alloys have a large anisotropy of functional properties such as electrical, thermal and mechanical properties, which means that the texture of polycrystalline alloy should be considered to achieve better properties. In this study, the determination of grain growth orientation and texture formation in the cold-rolled, heat-treated and Ni-plated hybrid copper sheets was investigated. Grain growth direction and texture formation were analyzed by the X-ray pole figure. The influence of texture on the mechanical properties could be quantitatively confirmed by the results from the orientation distribution function and the tensile test. The heat-treated texture in the cold-rolled hybrid copper sheet is also investigated and discussed.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.6
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• pp.307-313
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• 2010

Quantitative analytical condition for lead and cadmium in copper contained carbon materials using solvent extraction followed by inductively coupled plasma-atomic emission spectrometry was studied. Copper contained carbon samples were dissolved by nitric acid-perchloric acid digestion. Lead and cadmium were determined after separation with KCN masked copper by an dithizone-chloroform solvent extraction. Recovery efficiency of analyte elements was satisfactory, and most of matrix elements causing interference could be effectively eliminated by the separation. Lead and cadmium were quantitatively determined without influence of sample matrix, by applying it procedure to artifact sample.

• Journal of Animal Science and Technology
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• v.55 no.4
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• pp.295-301
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• 2013

This study was conducted to evaluate the effects of chelated Cu and Zn on growth performance, nutrient digestibility, blood profiles, and fecal noxious gas emission in weanling pigs. A total of 90 weanling pigs with an initial body weight (BW) of $5.27{\pm}0.04kg$ were randomly allotted to two dietary treatments for 42 d. Pigs were then fed a control diet (CON) or a Zinpro diet (CON + 0.1% chelate copper and zinc). There were nine replicate-pens with five pigs in each pen. During d 0 to 14 and d 14 to 28, the ADFI decreased (p<0.05) and the G/F increased (p<0.05) in pigs fed the Zinpro diet compared with those that received the CON diet. During d 28 to 42, the ADFI increased (p<0.05) in pigs fed the Zinpro diet relative to those fed the CON diet. Additionally, the apparent total tract digestibility of DM, N, and energy increased (p<0.05) in the Zinpro group when compared to the CON group on d 14 and 28. The lymphocyte percentage was also greater (p<0.05) in the Zinpro group than in the CON group. Overall, dietary supplementation with 0.1% chelate copper and zinc improved the growth performance and nutrient digestibility in weanling pigs.