• Journal of Sensor Science and Technology
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• v.15 no.5
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• pp.352-356
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• 2006

In this paper, we developed enzyme electrode of a new form to improve performance of disposable glucose sensor. We could fabricate electrode of Cu/Ni/Au structure which has very low electrical resistance (0.1 $\Omega$) by sticking copper film to plastic film with laminating method and electro-plated nickle and gold on it. The enzyme electrode was completed by immobilizing enzyme on the fabricated electrode. The fabricated glucose sensor has very quick sensing time as 3 seconds, and excellent reproducibility, fabrication yield as well.

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

• Korean Journal of Materials Research
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• v.19 no.7
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• pp.349-355
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• 2009

Metal thin film patterns on a LTCC substrate, which was connected through inner via and metal paste for electrical signals, were formed by a screen printing process that used electric paste, such as silver and copper, in a conventional method. This method brought about many problems, such as non uniform thickness in printing, large line spaces, and non-clearance. As a result of these problems, it was very difficult to perform fine and high resolution for high frequency signals. In this study, the electric signal patterns were formed with the sputtered metal thin films (Ti, Cu) on an LTCC substrate that was coated with protective oxide layers, such as $TiO_2$ and $SiO_2$. These electric signal patterns' morphology, surface bonding strength, and effect on electro plating were also investigated. After putting a sold ball on the sputtered metal thin films, their adhesion strength on the LTCC substrate was also evaluated. The protective oxide layers were found to play important roles in creating a strong design for electric components and integrating circuit modules in high frequency ranges.

• Progress in Superconductivity and Cryogenics
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• v.25 no.4
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• pp.24-27
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• 2023

Until now, many research activities have been conducted to commercialize high-temperature superconducting (HTS) wires for electric applications. Most of all researchers have focused on enhancing the piece length, critical current density, mechanical strength, and throughput of HTS wires. Recently, HTS magnet for generating high magnetic field shows degraded performance due to the deformation of HTS wire by high electro-magnetic force. The deformation can be derived from widthwise thickness non-uniformity of HTS wire mainly caused by wet processes such as electro-polishing of metal substrate and electro-plating of copper. Gradient sputtering process is designed to improve the thickness uniformity of HTS wire along the width direction. Copper stabilizing layer is deposited on HTS wire covered with specially designed mask. In order to evaluate the thickness uniformity of HTS wire after gradient sputtering process, the thickness distribution across the width is measured by using the optical microscope. The results show that the gradient deposition process is an effective method for improving the thickness uniformity of HTS wire.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.12
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• pp.919-923
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• 2010

Copper pillar tin bump (CPTB) was developed for high density chip interconnect technology. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM -1250 dry film photoresist (DFR), copper electroplating method and Sn electro-less plating method. Mechanical shear strength measurements were introduced to characterize the bonding process as a function of thermo-compression. Shear strength has maximum value with $330^{\circ}C$ and 500 N thenno-compression process. Through the simulation work, it was proved that when the copper pillar tin bump decreased in its size, it was largely affected by the copper oxidation.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.205-206
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• 2011

Cu thin films for electromagnetic wave shielding were prepared on PET film and Ni-coated PET film by using Dry and Wet coating method, such as evaporation method, DC sputtering method and copper sulfate($CuSO_4$). After that, Zn thin film and Ni thin film were prepared onto the Cu thin films by using evaporation dry process and Ni electro plating wet process as a finishing treatment, respectively. The result of conductivity test and corrosion resistance test revealed Cu thin films which were formed with bigger grain size and high Cu composition rate have superior properties. Zn thin film by dry evaporation process and Ni thin film by wet electro plating process on Cu thin films were largely contributed to corrosion resistance. However, Ni thin film by wet process made conductivity of all specimen worse, the other hand, Zn thin film by dry process made it better to improve condictivity of specimens just prepared by dry process.

• Journal of Institute of Control, Robotics and Systems
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• v.13 no.11
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• pp.1067-1073
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• 2007

This paper presents development of an special metal hydride(SMH) actuator system using a peltier module. The newly developed simple SMH actuator, consisting of the plated hydrogen-absorbing alloy as a power source, Peltier elements as a heat source and a cylinder with metal bellows as a functioning part, has been developed. The SMH actuator is characterized by its small size, low weight, noiseless operation and a compliance similar to that of human body. A new SMH actuator that uses reversible reactions between the heat energy and mechanical energy of a hydrogen absorbing alloy. It is well known that hydrogen-absorbing alloys can reversibly absorb and desorb a large amount of hydrogen, more than about 1000 times of their own volume. To improve the thermal conductivity of the hydrogen-absorbing alloy, an electro-less copper plating has been carried out. For this purpose, the effects of the electro-less copper plating and the dynamic characteristics of the SMH actuator have been studied. The hydrogen equilibrium pressure increases and hydrogen is desorbed by heating the hydrogen-absorbing alloys, whereas by cooling the alloys, the hydrogen equilibrium pressure decreases and hydrogen is absorbed. The SMH actuator has the characteristic of being light and easy to use. Therefore, it is suitable for medical and rehabilitation applications.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.551-555
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• 2005

This paper presents the temperature-pressure characteristics of SMH actuator using a peltier module. The simple SMH actuator, consisting of the plated hydrogen-absorbing alloy as a power source, Peltier elements as a heat source and a cylinder with metal bellows a functioning part has been developed. The SMH actuator is characterized by its small size, low weight, noiseless operation and a compliance similar to that of the human body. A new special metal hydride(SMH) actuator that uses the reversible reaction between the heat energy and mechanical energy of a hydrogen absorbing ally. It is well known that hydrogen-absorbing alloys can reversibly absorb and desorb a large amount of hydrogen, more than about 1000 times as their own volume. To improve the thermal conductivity of the hydrogen-absorbing alloy, an electro-less copper plating has been carried out. The effects of the electro-less copper plating and the dynamic characteristics of the SMH actuator have been studied. The hydrogen equilibrium pressure increases and hydrogen is desorbed by heating the hydrogen-absorbing alloys, whereas by cooling the alloys, the hydrogen equilibrium pressure decreases and hydrogen is absorbed. Therefor, the SMH actuator has the characteristic of being light and easy to use and so is suitable for use in medical and rehabilitation applications.

• Proceedings of the KIEE Conference
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• 2001.10a
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• pp.104-106
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• 2001

In this paper, it is object of design of high efficiency slotless BLDC motor using film coil. Slotless BLDC motor is able to have high efficiency property and low cogging torque, due to magnetization of stator core have constant contribution by slotless core. But it is difficult to make coil winding of slotless BLDC motor. So we make amateur of slotless BLDC motor using film coil. Film coil is fabricated by drilling, electro-plating and etching of copper/insulator/copper plate. In this paper, after design of slotless BLDC motor for moving axial blower, it is fabricated by NdFeB permanent magnet type rotor and film coil.

• Journal of Korea Foundry Society
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• v.25 no.6
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.